Aan casri ahayn PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Farsamada HDI waxay u oggolaanaysaa naqshadeeyayaasha inay dhigaan qaybo yaryar oo isu dhow. Cufnaanta baakadka sare, baaxadda guddiga oo yar iyo lakabyo yar ayaa u keenaya saamayn cascading naqshadda PCB.

Faa’iidada HDI

Let’s take a closer look at the impact. Kordhinta cufnaanta xirmada waxay noo oggolaaneysaa inaan gaabinno waddooyinka korantada ee u dhexeeya qaybaha. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Yaraynta tirada lakabyadu waxay ku ridi karaan iskuxiryo dheeraad ah isla boorka waxayna hagaajin karaan meelaynta qaybaha, fiilooyinka iyo isku xidhka. Halkaas, waxaan diiradda saari karnaa farsamo la yiraahdo interconnect per Layer (ELIC), kaas oo ka caawiya kooxaha naqshadeynta inay ka gudbaan guddiyada dhumucda leh si ay u noqdaan kuwo dabacsan oo dhuuban si ay u ilaashadaan xoogga iyagoo u oggolaanaya HDI inay aragto cufnaanta shaqeysa.

HDI PCBS rely on lasers rather than mechanical drilling. Taa baddalkeeda, naqshadda PCB -ga HDI waxay keentaa dalool yar iyo cabbir yar oo suuf ah. Yaraynta daloolka ayaa u oggolaaday kooxda naqshadeynta inay kordhiyaan qaabeynta aagga guddiga. Gaabinta waddooyinka korantada iyo awood u siinta fiilooyin aad u xoog badan waxay hagaajineysaa daacadnimada signalada ee naqshadeynta waxayna dardar gelineysaa ka shaqeynta signalada. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

Naqshadaha PCB -ga HDI ma isticmaalaan godadka, laakiin waxay isticmaalaan godad indha la ‘oo la aasay. Staggered and accurate placement of burial and blind holes reduces mechanical pressure on the plate and prevents any chance of warping. In addition, you can use stacked through-holes to enhance interconnect points and improve reliability. Isticmaalkaaga suufka ayaa sidoo kale yareyn kara luminta signalada iyadoo yareyneysa dib u dhaca iskutallaabta iyo yaraynta saamaynta dulin.

Soo -saaridda HDI waxay u baahan tahay wada -shaqayn kooxeed

Naqshadaynta wax -soo -saarka (DFM) waxay u baahan tahay qaab fikir leh, oo sax ah qaabka naqshadeynta PCB iyo xiriir joogto ah oo lala yeesho soo -saarayaasha iyo soo -saarayaasha. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Marka la soo koobo, naqshadeynta, soo -saaridda iyo hannaanka wax -soo -saarka ee HDI PCBS waxay u baahan tahay wada -shaqeyn dhow iyo fiiro gaar ah xeerarka gaarka ah ee DFM ee khuseeya mashruuca.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Ogow qalabka guddiga wareeggaaga iyo tilmaamaha

Sababtoo ah soosaarka HDI wuxuu adeegsadaa habab kala duwan oo qodista laser ah, wada hadalka u dhexeeya kooxda naqshadeynta, soo -saaraha iyo soo -saaraha waa inuu diiradda saaraa nooca maaddada looxyada marka laga hadlayo geedi socodka qodista. Codsiga badeecadda ee keenaya hannaanka naqshadeynta waxaa laga yaabaa inuu yeesho shuruudo cabbir iyo culeys oo wada hadalka u dhaqaajiya hal dhinac ama dhinac kale. High frequency applications may require materials other than standard FR4. Intaa waxaa dheer, go’aamada ku saabsan nooca maaddada FR4 waxay saameysaa go’aannada ku saabsan xulashada nidaamyada qodista ama ilaha wax -soo -saarka kale. In kasta oo nidaamyada qaarkood ay si fudud u qodayaan naxaas, kuwa kale si joogto ah uma dhex galaan fiilooyinka galaaska.

Marka lagu daro xulashada nooca maaddada saxda ah, kooxda naqshadeynta waa inay sidoo kale hubisaa in soo -saaraha iyo soo -saaraha ay isticmaali karaan dhumucda saxanka saxda ah iyo farsamooyinka dahaarka. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. In kasta oo taarikada dhumucda leh ay oggolaadaan daloollada yaryar, shuruudaha farsamada ee mashruuca ayaa laga yaabaa inay tilmaamaan taarikada khafiifka ah ee u nugul inay ku guuldaraystaan ​​xaaladaha deegaanka qaarkood. Kooxda naqshadeynta waxay ahayd inay hubiyaan in soo -saaraha uu awood u leeyahay inuu adeegsado farsamada “isku -xirnaanta lakabka” iyo qodista godadka qoto dheer oo sax ah, iyo inay hubiyaan in xalka kiimikada ee loo isticmaalo korontada uu buuxin doono godadka.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Natiijada ELIC darteed, naqshadaha PCB waxay ka faa’iideysan karaan cufnaanta, isku-xirnaanta adag ee looga baahan yahay wareegyada xawaaraha sare leh. Sababtoo ah ELIC waxay u isticmaashaa microholes naxaas-ka buuxsamay naxaas-buuxsan si ay isugu xirmaan, waxay ku xirnaan kartaa inta u dhaxaysa laba lakab oo kasta iyada oo aan daciifin guddiga wareegga.

Xulashada qaybtu waxay saameysaa qaabeynta

Wadahadal kasta oo lala yeesho soo-saarayaasha iyo soo-saarayaasha ku saabsan naqshadeynta HDI waa inay sidoo kale diiradda saaraan qaabka saxda ah ee qaybaha cufnaanta sare leh. The selection of components affects wiring width, position, stack and hole size. Tusaale ahaan, naqshadaha PCI -ga HDI -ga ayaa sida caadiga ah waxaa ka mid ah xarig goobeed kubbadeed oo cufan (BGA) iyo BGA aad u kala fog oo u baahan baxsad pin. Caqabadaha wax u dhimaya korontada iyo daacadnimada signalada iyo sidoo kale hufnaanta jirka ee guddiga waa in la aqoonsadaa marka la isticmaalayo aaladahaan. Arrimahan waxaa ka mid ah in la gaaro go’doomin habboon oo u dhexeysa lakabyada sare iyo kan hoose si loo yareeyo isku -dhafka labada dhinac iyo in la xakameeyo EMI inta u dhexeysa lakabyada calaamadaha gudaha.Symmetrically spaced components will help prevent uneven stress on the PCB.

Pay attention to signal, power and physical integrity

Ka sokow hagaajinta sharafta signalada, waxaad sidoo kale kor u qaadi kartaa sharafta awoodda. Sababtoo ah HDB PCB -gu wuxuu u dhaqaajiyaa lakabka dhulka hoostiisa meel u dhow dusha, daacadnimada awoodda ayaa la hagaajiyaa. Lakabka sare ee sabuuraddu wuxuu leeyahay lakab dhulka ah iyo lakabka korontada, kaas oo ku xirmi kara lakabka dhulka hoostiisa daloolada indhoolayaasha ama microholes, wuxuuna yareeyaa tirada godadka diyaaradda.

HDI PCB wuxuu yareeyaa tirada godadka dhex mara lakabka gudaha ee guddiga. In turn, reducing the number of perforations in the power plane provides three major advantages:

Aagga naxaasta ee weyn wuxuu quudiyaa AC iyo DC oo hadda ku jira pin pin -ka

L resistance decreases in the current path

L Sababtoo ah hoos -u -dhac yar, hadda beddelka saxda ah ayaa akhrin kara biinka korontada.

Qodobka kale ee muhiimka ah ee dooddu waa in la joogteeyo ballaarinta xarriiqda ugu hooseysa, kala -dheereynta nabdoon iyo isku -ekaanshaha raadraaca. Arrinta dambe, bilaw inaad gaarto dhumucda naxaasta labiska iyo isku xirnaanta fiilooyinka inta lagu guda jiro hawsha naqshadeynta oo sii wad habka wax -soo -saarka iyo wax -soo -saarka.

La’aanta kala fogaansho ammaan ah waxay u horseedi kartaa haraaga filimada xad -dhaafka ah inta lagu guda jiro geeddi -socodka filimka qalalan ee gudaha, taas oo horseedi karta wareegyo gaagaaban. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Design teams and manufacturers must also consider maintaining track uniformity as a means of controlling signal line impedance.

Samee oo ku dabaq xeerarka naqshadeynta gaarka ah

Qaab-dhismeedka cufnaanta sare waxay u baahan yihiin cabbirro dibadeed oo yar, fiilooyin fiican iyo kala-dheereynta qaybaha adag, sidaas darteedna waxay u baahan yihiin hannaan naqshad oo ka duwan. Habka wax -soo -saarka PCB -ga ee HDI wuxuu ku tiirsan yahay qodista laser, software -ka CAD iyo CAM, hababka sawir -qaadista tooska ah ee laser, qalabka wax -soo -saarka khaaska ah, iyo khibradda hawl -wadeenka. Guusha geedi socodka oo dhan waxay ku xiran tahay qeyb ahaan xeerarka naqshadeynta ee tilmaamaya shuruudaha impedance, ballaariyaha kaarka, cabbirka daloolka, iyo arrimo kale oo saameeya qaabeynta. Horumarinta xeerarka naqshadeynta oo faahfaahsan waxay gacan ka geysaneysaa xulashada soo -saaraha ama soo -saaraha saxda ah ee guddigaaga oo aasaaska u dhiga wada -xiriirka u dhexeeya kooxaha.