1. BT lehoakhoa
Lebitso le felletseng la lehoakhoa la BT ke “bismaleimide triazine resin”, e hlahisoang ke Mitsubishi Gas Company ea Japane. Le ha nako ea patent ea resin ea BT e felile, Mitsubishi Gas Company e ntse e le maemong a holimo lefats’eng ho R & D le ts’ebeliso ea resin ea BT. BT lehoakhoa le na le menyetla e mengata joalo ka phahameng Tg, mocheso o phahameng oa ho hanela mocheso, ho hanela mongobo, kamehla dielectric kamehla (DK) le low loss factor (DF). Leha ho le joalo, ka lebaka la lera la khalase ea fiber, e thata ho feta substrate ea FC e entsoeng ka ABF, likhoele tse thata le bothata bo boholo ba ho cheka laser, e ke ke ea fihlela litlhoko tsa mela e metle, empa e ka tsitsisa boholo le ho thibela kholo ea mocheso le shrinkage e batang e sa ameheng lihlahisoa tsa mohala, Ka hona, lisebelisoa tsa BT li sebelisoa haholo bakeng sa li-chip tsa marang-rang le li-chip tsa logic tse hlophisehang tse nang le litlhoko tse phahameng tsa ho ts’epahala. Hajoale, li-substrate tsa BT li sebelisoa haholo ho li-chips tsa MEMS tsa mobile, li-chip tsa puisano, li-memory memory le lihlahisoa tse ling. Ka nts’etsopele e potlakileng ea li-chip tsa LED, ts’ebeliso ea likaroloana tsa BT ka har’a liphutheloana tsa chip tsa LED le eona e ntse e hola ka potlako.

2,ABF
Lisebelisoa tsa ABF ke thepa e etelletsoeng pele le e ntlafalitsoeng ke Intel, e sebelisetsoang ho etsa liboto tsa bajari ba maemo a holimo joalo ka chip flip. Ha e bapisoa le substrate ea BT, lisebelisoa tsa ABF li ka sebelisoa joalo ka IC e nang le potoloho e tšesaane ebile e loketse nomoro e phahameng ea pini le phetisetso e phahameng. E sebelisoa haholo bakeng sa li-chip tse kholo tse phahameng tse kang CPU, GPU le chip set. ABF e sebelisoa e le lisebelisoa tse ling tsa lera. ABF e ka hokelloa ka kotloloho ho substrate ea koporo ea koporo joalo ka potoloho ntle le ts’ebetso ea ho hatella mocheso. Nakong e fetileng, abffc e ne e na le bothata ba botenya. Leha ho le joalo, ka lebaka la mahlale a ntseng a eketseha a koporo ea substrate ea koporo, abffc e ka rarolla bothata ba botenya ha feela e amohela poleiti e tšesaane. Mehleng ea pele, li-CPU tse ngata tsa liboto tsa ABF li ne li sebelisoa likhomphutheng le lipapaling tsa papali. Ka ho phahama ha lifono tse bohlale le phetoho ea mahlale a ho paka, indasteri ea ABF e kile ea oela leqhubu le tlase. Leha ho le joalo, lilemong tsa morao tjena, ka ntlafatso ea lebelo la marang-rang le katleho ea mahlale, lits’ebetso tse ncha tsa likhomphutha tse sebetsang hantle li hlahile, mme tlhoko ea ABF e ekelitsoe hape. Ho ea ka pono ea tšebetso ea indasteri, substrate ea ABF e ka tsamaisana le lebelo la semiconductor e tsoetseng pele, ho fihlela litlhoko tsa mohala o mosesaane, bophara ba mola o mosesane / sebaka sa mola, mme kholo ea kholo ea mmaraka e ka lebelloa nakong e tlang.
Bokgoni bo fokolang ba tlhahiso, baetapele ba indasteri ba qalile ho holisa tlhahiso. Ka Mots’eanong 2019, Xinxing o phatlalalitse hore ho lebelletsoe ho tsetela li-yuan tse limilione tse likete tse 20 ho tloha ka 2019 ho isa ho 2022 ho holisa semela se tsamaisang thepa se phahameng sa IC le ho nts’etsapele likarolo tsa ABF ka matla. Mabapi le limela tse ling tsa Taiwan, jingshuo e lebelletsoe ho fetisetsa lipoleiti tsa sehlopha sa thepa ho tlhahiso ea ABF, mme Nandian le eona e ntse e eketsa bokhoni ba tlhahiso. Lihlahisoa tsa sejoale-joale tsa elektroniki li batla li le SOC (system on chip), mme hoo e batlang e le mesebetsi eohle le tšebetso li hlalosoa ka litlhaloso tsa IC. Ka hona, mahlale a morao-rao le lisebelisoa tsa moralo o tsamaisang thepa ea morao-rao li tla bapala karolo ea bohlokoa haholo ho netefatsa hore qetellong ba ka ts’ehetsa ts’ebetso e potlakileng ea li-chip tsa IC. Hajoale, ABF (Ajinomoto build up film) ke lera le tsebahalang haholo le kenyang thepa bakeng sa thepa e phahameng ea li-IC ‘marakeng, mme barekisi ba ka sehloohong ba thepa ea ABF ke baetsi ba Majapane, joalo ka lik’hemik’hale tsa Ajinomoto le Sekisui.
Theknoloji ea Jinghua ke moetsi oa pele Chaena ho nts’etsapele lisebelisoa tsa ABF ka boithaopo. Hajoale, lihlahisoa li netefalitsoe ke baetsi ba bangata lapeng le kantle ho naha mme li rometsoe ka bongata bo bonyenyane.

3,MIS
MIS substrate technology ea ho paka ke theknoloji e ncha, e ntseng e tsoela pele ka potlako masimong a ‘maraka oa analog, IC, matla, chelete ea dijithale joalo-joalo. Ho fapana le substrate ea setso, MIS e kenyelletsa karolo e le ‘ngoe kapa ho feta ea sebopeho se kentsoeng pele. Lera ka leng le hokahane ka koporo ea motlakase ho fana ka khokahano ea motlakase ts’ebetsong ea ho paka. MIS e ka nkela liphutheloana tse ling tsa setso sebaka joalo ka sephutheloana sa QFN kapa sephutheloana sa leadframe, hobane MIS e na le bokhoni bo botle ba wiring, ts’ebetso e ntle ea motlakase le mocheso, le sebopeho se nyane.