Ho tloha Q4 ho 2020, ka lebaka la kholo ea 5g, leru AI khomphutha, lisebelisoa le limmaraka tse ling, tlhoko ea li-chip tsa likhomphutha tse sebetsang hantle e eketsehile. Hammoho le kholo ea tlhokeho ea mmaraka bakeng sa ofisi ea lehae ea WFM le likoloi tsa motlakase, tlhoko ea li-chips tsa CPU, GPU le AI e eketsehile haholo, e leng hape ho matlafalitseng tlhoko ea liboto tsa bajari ba ABF. Hammoho le litlamorao tsa kotsi ea mollo fekthering ea ibiden Qingliu, feme e kholo ea bajari ea IC, le fektheri ea Xinxing Electronic Shanying, bajari ba ABF lefats’eng ba haella haholo.

Ka Hlakubele selemong sena, ho ne ho na le litaba ‘marakeng tsa hore lipoleiti tsa bajari ba ABF li haella haholo, mme potoloho ea phano e bile libeke tse 30 feela. Ka phepelo e fokolang ea poleiti ea bajari ea ABF, theko le eona e ile ea tsoela pele ho nyoloha. Litaba li bonts’a hore ho tloha kotareng ea bone ea selemo se fetileng, theko ea boto ea bajari ea IC e ntse e tsoela pele ho nyoloha, ho kenyeletsoa BT carrier board e nyolohetse ka 20%, ha ABF board board e nyoloha ka 30% – 50%.
Ha matla a bajari a ABF a le matsohong a baetsi ba ‘maloa ba Taiwan, Japane le Korea Boroa, katoloso ea bona ea tlhahiso le eona e ne e fokola nakong e fetileng, e leng se etsang hore ho be thata ho fokotsa khaello ea phepelo ea bajari ba ABF ka nakoana poleloana e reng. Litaba tsa bohlokoahali tsa poleiti ea bajari ea ABF ke filimi ea ho aha. Hajoale, 99% ea lisebelisoa tsa ABF tse marakeng li fanoa ke Ajinomoto, moetsi oa Japane. Ka lebaka la matla a fokolang a tlhahiso, phepelo e haella.

Bakeng sa ho hlola bothata ba hore lisebelisoa tsa laminate tsa ABF li laoloa ke baetsi ba Majapane le ho haelloa ke matla a tlhahiso, theknoloji ea crystallographic e tsetetse ka botlalo ho R & D e ikemetseng mme e iketselitse thepa ea filimi ea semiconductor e hlophisehileng haholo le thepa ea laminate ea ABF ho lilemong tsa morao tjena. Hajoale, ke moetapele feela lefapheng la lisebelisoa tsa filimi tsa ABF tse tsamaisang thepa Taiwan le moetsi oa bobeli lefats’eng ea atlehileng ho nts’etsapele thepa ea laminate ea ABF, Ho ts’epeloa hore sebaka sa phepelo ea thepa ea semiconductor ea Taiwan se ka khothaletsoa, le lipoleiti tsa thepa ea ABF li ka etsoa ka filimi e tlatselletsang e entsoeng Taiwan.
Theknoloji ea Jinghua ke moetsi oa pele Chaena ho nts’etsapele le ho hlahisa filimi ea Taiwan ea ho aha (TBF) bakeng sa poleiti ea ABF. Hajoale, ka kopanelo e hlahisitse lisebelisoa tse tlase tsa DK & DF tse eketsang lisebelisoa le baetsi ba bangata lapeng le kantle ho naha, tse tla sebelisoa molokong o latelang oa li-chip tsa AI.