Ntle le ea sejoale-joale PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Theknoloji ea HDI e lumella baqapi ho beha likaroloana tse nyane haufi le e mong. Phahame sephutheloana segokanyipalo, tse nyenyane boholo boto le le dikarolo tse seng kae tlisa phello e cascading ho moralo PCB.

Molemo oa HDI

Let’s take a closer look at the impact. Ho eketsa palo ea liphutheloana ho re lumella ho khutsufatsa litsela tsa motlakase lipakeng tsa likarolo. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Ho fokotsa palo ea likarolo ho ka beha likhokahano tse ngata ka board e le ngoe le ho ntlafatsa ho beoa ha likarolo, wiring le likhokahano. Ho tloha moo, re ka tsepamisa maikutlo ho mokhoa o bitsoang interconnect per Layer (ELIC), o thusang lihlopha tsa meralo ho tloha mapolankeng a matenya ho isa ho tse fokolang tse tenyetsehang ho boloka matla ha li ntse li lumella HDI ho bona tšebetso e sebetsang.

HDI PCBS rely on lasers rather than mechanical drilling. Ka lehlakoreng le leng, moralo oa HDI PCB o fella ka lesoba le lenyane la pad. Ho fokotsa palo ho lumelletse sehlopha sa meralo ho eketsa sebopeho sa sebaka sa boto. Ho khutsufatsa litsela tsa motlakase le ho nolofalletsa likhoele tse matla ho feta ho ntlafatsa bots’epehi ba lets’oao la boqapi le ho akofisa ts’ebetso ea lipontšo. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

Liqapi tsa HDI PCB ha li sebelise ka masoba, empa ke masoba a foufetseng le a patiloeng. Ho beoa ka mokhoa o tsitsipaneng le ho nepahala ha mabitla le masoba a foufetseng ho fokotsa khatello ea mochini poleiting mme ho thibela monyetla o fe kapa o fe oa ho kotana. Ntle le moo, o ka sebelisa mekoti e kenngoeng ka mekotla ho ntlafatsa lintlha tsa khokahano le ho ntlafatsa ho ts’epahala. Tšebeliso ea hau lipoleng e ka fokotsa tahlehelo ea matšoao ka ho fokotsa ho lieha ha sefapano le ho fokotsa litlamorao tsa likokoana-hloko.

Ho etsa lihlahisoa tsa HDI ho hloka tšebelisano ‘moho

Moralo oa tlhahiso (DFM) o hloka mokhoa o nahanang, o nepahetseng oa moralo oa PCB le puisano e lumellanang le baetsi le baetsi. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Ka bokhutšoanyane, moralo, prototyping le mochini oa tlhahiso oa HDI PCBS o hloka tšebelisano ‘moho le tlhokomelo ho melao e khethehileng ea DFM e sebetsang morerong ona.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Tseba lisebelisoa tsa boto ea hau ea potoloho le litlhaloso

Hobane tlhahiso ea HDI e sebelisa mefuta e fapaneng ea lits’ebetso tsa ho cheka laser, moqoqo lipakeng tsa sehlopha sa meralo, moetsi le moetsi o lokela ho shebana le mofuta oa liboto ha a bua ka ts’ebetso ea ho cheka. Sesebelisoa sa sehlahisoa se susumelletsang moralo oa moralo se ka ba le litlhoko tsa boholo le boima tse tsamaisang moqoqo ka lehlakoreng le leng. High frequency applications may require materials other than standard FR4. Ntle le moo, liqeto mabapi le mofuta oa thepa ea FR4 li ama liqeto mabapi le khetho ea litsamaiso tsa ho cheka kapa lisebelisoa tse ling tsa tlhahiso. Le ha litsamaiso tse ling li phunya koporo habonolo, tse ling ha li kenelle khafetsa likhoeleng tsa khalase.

Ntle le ho khetha mofuta oa thepa e nepahetseng, sehlopha sa meralo se tlameha ho netefatsa hore moetsi le moetsi ba ka sebelisa botenya bo nepahetseng ba poleiti le mekhoa ea ho roala. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Leha lipoleiti tse tenya li lumella liphahlo tse nyane, litlhokahalo tsa projeke li ka supa lipoleiti tse tšesaane tse tloaetseng ho hloleha tlasa maemo a itseng a tikoloho. Sehlopha sa meralo se ile sa tlameha ho lekola hore moetsi o na le bokhoni ba ho sebelisa mokhoa oa “interconnect layer” le ho phunya masoba botebong bo nepahetseng, mme a netefatse hore tharollo ea lik’hemik’hale e sebelisetsoang ho khetha motlakase e tla tlatsa masoba.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Ka lebaka la ELIC, meralo ea PCB e ka nka monyetla ka likhokahano tse thata, tse rarahaneng tse hlokahalang bakeng sa lipotoloho tse lebelo. Hobane ELIC e sebelisa li-microholes tse tlatsitsoeng ka koporo bakeng sa khokahano, e ka hokahanngoa lipakeng tsa likarolo tse peli ntle le ho fokolisa boto ea potoloho.

Khetho ea likarolo e ama sebopeho

Lipuisano life kapa life le baetsi le baetsi mabapi le moralo oa HDI le tsona li lokela ho shebana le sebopeho se nepahetseng sa likarolo tsa bongata bo phahameng. The selection of components affects wiring width, position, stack and hole size. Mohlala, meralo ea HDI PCB hangata e kenyelletsa sehlopha se teteaneng sa bolo (BGA) le BGA e arohaneng hantle e hlokang phonyoha. Lintho tse fokolisang phepelo ea motlakase le bots’epehi ba lipontšo hammoho le boits’epo ba boto li tlameha ho ananeloa ha ho sebelisoa lisebelisoa tsena. Lintlha tsena li kenyelletsa ho fihlela karohano e loketseng lipakeng tsa karolo e kaholimo le e tlase ho fokotsa crosstalk e kopanetsoeng le ho laola EMI lipakeng tsa likarolo tsa matšoao a kahare.Symmetrically spaced components will help prevent uneven stress on the PCB.

Ela hloko pontšo, matla le botšepehi ba ‘mele

Ntle le ho ntlafatsa bots’epehi ba lets’oao, o ka matlafatsa bots’epehi ba matla. Hobane HDI PCB e sutumetsa lera la fatše haufi le bokaholimo, matla a matla a ntlafala. Karolo e kaholimo ea boto e na le lera la motheo le phepelo ea motlakase, e ka hokahantsoeng le mokato oa mobu ka likoti tse foufetseng kapa li-microholes, mme e fokotsa palo ea masoba a sefofane.

HDI PCB e fokotsa palo ea likoti tse kenang kahare ho boto. In turn, reducing the number of perforations in the power plane provides three major advantages:

Sebaka se seholo sa koporo se fepa AC le DC hona joale ka har’a phini ea motlakase ea chip

L resistance decreases in the current path

L Ka lebaka la ho theoha ha maemo a tlase, nako e nepahetseng ea ho chencha e ka bala pini ea motlakase.

Ntlha e ngoe ea bohlokoa ea puisano ke ho boloka bonyane ba bophara ba mela, sebaka se sireletsehileng le ho tšoana ha pina. Makasineng ea morao-rao, qala ho fihlela botenya ba koporo le junifomo ea wiring nakong ea moralo le ho tsoela pele ka ts’ebetso ea tlhahiso le tlhahiso.

Ho haelloa ke sebaka se sireletsehileng ho ka lebisa ho masalla a feteletseng a filimi nakong ea ts’ebetso ea kahare ea filimi, e ka lebisang ho lipotoloho tse khutšoane. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Lihlopha tsa meralo le baetsi ba lihlahisoa ba tlameha ho nahana ka ho boloka ho ts’oana ha lipina e le mokhoa oa ho laola phallo ea mohala oa lets’oao.

Theha le ho sebelisa melao e ikhethileng ea moralo

Meetso e phahameng haholo e hloka litekanyo tse nyane tsa kantle, likhoele tse ntle le karohano ea likarolo tse thata, ka hona e hloka ts’ebetso e fapaneng ea moralo. Ts’ebetso ea tlhahiso ea HDI PCB e its’etleha ho cheka tham mong bang laser, CAD le software ea CAM, lits’ebetso tsa litšoantšo tse tobileng tsa laser, lisebelisoa tse ikhethang tsa tlhahiso, le boiphihlelo ba opareitara. Katleho ea ts’ebetso ena kaofela e latela karolo ea melao ea moralo e khethollang litlhoko tsa impedance, bophara ba mokhanni, boholo ba lesoba le lintlha tse ling tse amang sebopeho. Ho theha melao e qaqileng ea moralo ho thusa ho khetha moetsi kapa moetsi ea nepahetseng bakeng sa boto ea hau mme ho rala motheo oa puisano lipakeng tsa lihlopha.