Bohlokoa ba Tenyetsehang tenyetsehang PCB cannot be underestimated in PCB manufacturing. Lebaka le leng ke mokhoa o lebisang ho miniaturization. Ntle le moo, tlhoko ea PCBS e thata e ntse e eketseha ka lebaka la ho fetoha le ts’ebetso ea kopano ea 3D. Leha ho le joalo, ha se baetsi bohle ba PCB ba khonang ho kopana le ts’ebetso e rarahaneng ea maemo a thata ea PCB. Liboto tsa potoloho tse hatisitsoeng ka semmuso li etsoa ka ts’ebetso e fokotsang botenya ba boto e thata ho 0.25mm +/- 0.05mm. Sena le sona se lumella boto hore e sebelisoe lits’ebetsong tse hlokang ho khumama boto le ho e kenya kahare ho ntlo. The plate can be used for one-time bending installation and multi-bending installation.

Mona ke kakaretso ea litšoaneleho tse ling tse e khethollang:

FR4 seka-tenyetsehang litšobotsi PCB

L Tšobotsi ea bohlokoahali e sebetsang hamolemo molemong oa hau ke hore e fetoha le maemo ebile e ka ikamahanya le sebaka se fumanehang.

L Its versatility is increased by the fact that its flexibility does not impede its signal transmission.

L E bobebe hape.

Ka kakaretso, li-PCBS tse sa fetoheng habonolo li boetse li tsejoa ka litšenyehelo tsa tsona tse ntle hobane lits’ebetso tsa bona tsa tlhahiso li tsamaisana le bokhoni bo teng ba tlhahiso.

L Li boloka nako ea moralo le nako ea kopano.

L Ke mekhoa e meng e ka tšeptjoang haholo, haholo hobane e qoba mathata a mangata, ho kenyeletsoa le likhoketsane le litšepe.

Tsamaiso ea ho etsa PCB

The main manufacturing process of FR4 semi-flexible printed circuit board is as follows:

Ts’ebetso ena ka kakaretso e akaretsa lintlha tse latelang:

L Ho itšeha ha thepa

L Ho roala filimi e omileng

L itirisang tsa tlhahlobo Optical

L Browning

L laminated

L X-ray tlhahlobo

L ho cheka

L motlakase oa motlakase

L Phetolelo ea Graph

L mananose

L Screen khatiso

L Ponaletso le nts’etsopele

L Bokaholimo ba ho qetela

L Bolaoli ba taolo ea botebo

L Teko ea motlakase

L Taolo ea boleng

L ho paka

Ke mathata a le ditharollo khoneha ka ho etsa thepa PCB?

Bothata bo ka sehloohong ho etsa thepa ke ho etsa bonnete ba ho nepahala le ho teba taolo tolerances siloa. Ho bohlokoa hape ho netefatsa hore ha ho na mapetso a lehoakhoa kapa ho qhalana ha oli ho ka bakang mathata afe kapa afe a boleng. Sena se kenyelletsa ho lekola tse latelang nakong ea ts’ebetso ea taolo e tebileng:

L botenya

L Litaba tsa lehoakhoa

L Mamello ea ho sila

Teko ea taolo ea botebo ea taolo ea botebo

Ho sila botenya ho ne ho etsoa ka mokhoa oa ‘mapa ho latela botenya ba 0.25 mm, 0.275 mm le 0.3 mm. Kamora hore boto e lokolloe, e tla hlahlojoa ho bona hore na e ka mamella ho kobeha ha likhato tse 90. Ka kakaretso, haeba botenya bo setseng ke 0.283mm, fiber ea khalase e nkuoa e senyehile. Therefore, the thickness of the plate, the thickness of the glass fiber and the dielectric condition must be taken into account when conducting deep milling.

Teko ea taolo ea botebo ea taolo ea botebo

Ho ipapisitsoe le tse kaholimo, ho hlokahala hore ho netefatsoe botenya ba koporo ea 0.188mm ho 0.213mm lipakeng tsa lera la mokoallo oa solder le L2. Tlhokomelo e nepahetseng e boetse e hloka ho nkuoa bakeng sa lintoa life kapa life tse ka bang teng, tse amang botenya ba botenya ka kakaretso.

Teko ea taolo ea botebo ea taolo ea botebo

Ho sila ka botebo ho ne ho le bohlokoa ho netefatsa hore litekanyo li behiloe ho 6.3 “x10.5” kamora hore mofuta oa phanele o lokolloe. After this, survey point measurements are taken to ensure that 20 mm vertical and horizontal intervals are maintained.

Special fabrication methods ensure that the depth control thickness tolerance is within ±20μm.