Molemo oa HDI PCB

A re ke re shebisiseng tšusumetso. Ho eketsa palo ea liphutheloana ho re lumella ho khutsufatsa litsela tsa motlakase lipakeng tsa likarolo. Ka HDI, re ekelitse palo ea liteishene tsa wiring likarolong tse ka hare tsa PCB, ka hona re fokotsa palo ea likarolo tse hlokahalang bakeng sa moralo. Ho fokotsa palo ea likarolo ho ka beha likhokahano tse ngata ka board e le ngoe le ho ntlafatsa ho beoa ha likarolo, wiring le likhokahano. From there, we can focus on a technique called interconnect per Layer (ELIC), which helps design teams move from thicker boards to thinner flexible ones to maintain strength while allowing the HDI to see functional density.

HDI PCB rely on lasers rather than mechanical drilling. In turn, the HDI PCB design results in a smaller aperture and smaller pad size. Ho fokotsa palo ho lumelletse sehlopha sa meralo ho eketsa sebopeho sa sebaka sa boto. Ho khutsufatsa litsela tsa motlakase le ho nolofalletsa likhoele tse matla ho feta ho ntlafatsa bots’epehi ba lets’oao la boqapi le ho akofisa ts’ebetso ea lipontšo. Re fumana melemo e eketsehileng ka bongata hobane re fokotsa menyetla ea mathata a ho se sebetse hantle le a bokhoni.

Liqapi tsa HDI PCB ha li sebelise ka masoba, empa ke masoba a foufetseng le a patiloeng. Ho beoa ka mokhoa o tsitsipaneng le ho nepahala ha mabitla le masoba a foufetseng ho fokotsa khatello ea mochini poleiting mme ho thibela monyetla o fe kapa o fe oa ho kotana. Ntle le moo, o ka sebelisa mekoti e kenngoeng ka mekotla ho ntlafatsa lintlha tsa khokahano le ho ntlafatsa ho ts’epahala. Tšebeliso ea hau lipoleng e ka fokotsa tahlehelo ea matšoao ka ho fokotsa ho lieha ha sefapano le ho fokotsa litlamorao tsa likokoana-hloko.

Ho etsa lihlahisoa tsa HDI ho hloka tšebelisano ‘moho

Moralo oa tlhahiso (DFM) o hloka mokhoa o nahanang, o nepahetseng oa moralo oa PCB le puisano e lumellanang le baetsi le baetsi. Ha re ntse re eketsa HDI potefolio ea DFM, ho ela hloko lintlha tse qaqileng molemong oa moralo, tlhahiso le tlhahiso ho ile ha ba bohlokoa le ho feta mme ho ile ha tlameha hore ho rarolloe litaba tsa kopano le liteko. Ka bokhutšoanyane, moralo, prototyping le mochini oa tlhahiso oa HDI PCBS o hloka tšebelisano ‘moho le tlhokomelo ho melao e khethehileng ea DFM e sebetsang morerong ona.

E ‘ngoe ea likarolo tsa mantlha tsa moralo oa HDI (ho sebelisa laser cheka) e kanna ea ba kaholimo ho bokhoni ba moetsi, ea kopanyang, kapa moetsi, mme e hloka puisano e tataisang mabapi le ho nepahala le mofuta oa sistimi ea ho cheka e hlokahalang. Ka lebaka la sekhahla se tlase sa pulo le ponahalo e phahameng ea HDI PCBS, sehlopha sa meralo se ne se tlameha ho netefatsa hore baetsi le bahlahisi ba ka fihlela litlhoko tsa kopano, ho sebetsa bocha le ho tjheseletsa meralo ea HDI. Ka hona, lihlopha tsa meralo tse sebetsang ho meralo ea HDI PCB li tlameha ho ba le tsebo ho mekhoa e rarahaneng e sebelisetsoang ho hlahisa liboto.

Tseba lisebelisoa tsa boto ea hau ea potoloho le litlhaloso

Hobane tlhahiso ea HDI e sebelisa mefuta e fapaneng ea lits’ebetso tsa ho cheka laser, moqoqo lipakeng tsa sehlopha sa meralo, moetsi le moetsi o lokela ho shebana le mofuta oa liboto ha a bua ka ts’ebetso ea ho cheka. Sesebelisoa sa sehlahisoa se susumelletsang moralo oa moralo se ka ba le litlhoko tsa boholo le boima tse tsamaisang moqoqo ka lehlakoreng le leng. Likopo tse phahameng tsa maqhubu li ka hloka lisebelisoa tse ling ntle le standard FR4. Ntle le moo, liqeto mabapi le mofuta oa thepa ea FR4 li ama liqeto mabapi le khetho ea litsamaiso tsa ho cheka kapa lisebelisoa tse ling tsa tlhahiso. Le ha litsamaiso tse ling li phunya koporo habonolo, tse ling ha li kenelle khafetsa likhoeleng tsa khalase.

Ntle le ho khetha mofuta oa thepa e nepahetseng, sehlopha sa meralo se tlameha ho netefatsa hore moetsi le moetsi ba ka sebelisa botenya bo nepahetseng ba poleiti le mekhoa ea ho roala. Ka ts’ebeliso ea ho cheka ka laser, sekhahla sa lesoba sea fokotseha mme sekhahla sa botebo ba masoba se sebelisetsoang ho tlatsa mabokose se fokotseha. Leha lipoleiti tse tenya li lumella liphahlo tse nyane, litlhokahalo tsa projeke li ka supa lipoleiti tse tšesaane tse tloaetseng ho hloleha tlasa maemo a itseng a tikoloho. Sehlopha sa meralo se ile sa tlameha ho lekola hore moetsi o na le bokhoni ba ho sebelisa mokhoa oa “interconnect layer” le ho phunya masoba botebong bo nepahetseng, mme a netefatse hore tharollo ea lik’hemik’hale e sebelisetsoang ho khetha motlakase e tla tlatsa masoba.

Ho sebelisa theknoloji ea ELIC

Moralo oa li-PCI tsa HDI tse potileng theknoloji ea ELIC e thusitse sehlopha sa meralo ho nts’etsapele li-PCBS tse tsoetseng pele ho feta, tse kenyelletsang mekhahlelo e mengata ea li-microholes tse koahetsoeng ka koporo tse tlatsitsoeng. Ka lebaka la ELIC, meralo ea PCB e ka nka monyetla ka likhokahano tse thata, tse rarahaneng tse hlokahalang bakeng sa lipotoloho tse lebelo. Hobane ELIC e sebelisa li-microholes tse tlatsitsoeng ka koporo bakeng sa khokahano, e ka hokahanngoa lipakeng tsa likarolo tse peli ntle le ho fokolisa boto ea potoloho.

Khetho ea likarolo e ama sebopeho

Lipuisano life kapa life le baetsi le baetsi mabapi le moralo oa HDI le tsona li lokela ho shebana le sebopeho se nepahetseng sa likarolo tsa bongata bo phahameng. Khetho ea likarolo e ama bophara ba wiring, boemo, pokello le boholo ba lesoba. Mohlala, meralo ea HDI PCB hangata e kenyelletsa sehlopha se teteaneng sa bolo (BGA) le BGA e arohaneng hantle e hlokang phonyoha. Lintho tse fokolisang phepelo ea motlakase le bots’epehi ba lipontšo hammoho le boits’epo ba boto li tlameha ho ananeloa ha ho sebelisoa lisebelisoa tsena. Lintlha tsena li kenyelletsa ho fihlela karohano e loketseng lipakeng tsa karolo e kaholimo le e tlase ho fokotsa crosstalk e kopanetsoeng le ho laola EMI lipakeng tsa likarolo tsa matšoao a kahare.Lisebelisoa tse arohaneng hantle li tla thusa ho thibela khatello ea maikutlo e sa lekanang ho PCB.

Ela hloko pontšo, matla le botšepehi ba ‘mele

Ntle le ho ntlafatsa bots’epehi ba lets’oao, o ka matlafatsa bots’epehi ba matla. Hobane HDI PCB e sutumetsa lera la fatše haufi le bokaholimo, matla a matla a ntlafala. Karolo e kaholimo ea boto e na le lera la motheo le phepelo ea motlakase, e ka hokahantsoeng le mokato oa mobu ka likoti tse foufetseng kapa li-microholes, mme e fokotsa palo ea masoba a sefofane.

HDI PCB e fokotsa palo ea likoti tse kenang kahare ho boto. Ka lehlakoreng le leng, ho fokotsa palo ea litlolo ka sefofaneng sa motlakase ho fana ka menyetla e meraro e meholo:

Sebaka se seholo sa koporo se fepa AC le DC hona joale ka har’a phini ea motlakase ea chip

L ho hanyetsa ho fokotseha tseleng ea hona joale

L Ka lebaka la ho theoha ha maemo a tlase, nako e nepahetseng ea ho chencha e ka bala pini ea motlakase.

Ntlha e ngoe ea bohlokoa ea puisano ke ho boloka bonyane ba bophara ba mela, sebaka se sireletsehileng le ho tšoana ha pina. Makasineng ea morao-rao, qala ho fihlela botenya ba koporo le junifomo ea wiring nakong ea moralo le ho tsoela pele ka ts’ebetso ea tlhahiso le tlhahiso.

Ho haelloa ke sebaka se sireletsehileng ho ka lebisa ho masalla a feteletseng a filimi nakong ea ts’ebetso ea kahare ea filimi, e ka lebisang ho lipotoloho tse khutšoane. Ka tlasa bophara ba mohala o tlase ho ka baka mathata nakong ea ts’ebetso ea ho roala ka lebaka la ho monya matla le ho potoloha ho bulehileng. Lihlopha tsa meralo le baetsi ba lihlahisoa ba tlameha ho nahana ka ho boloka ho ts’oana ha lipina e le mokhoa oa ho laola phallo ea mohala oa lets’oao.

Theha le ho sebelisa melao e ikhethileng ea moralo

Meetso e phahameng haholo e hloka litekanyo tse nyane tsa kantle, likhoele tse ntle le karohano ea likarolo tse thata, ka hona e hloka ts’ebetso e fapaneng ea moralo. Ts’ebetso ea tlhahiso ea HDI PCB e its’etleha ho cheka tham mong bang laser, CAD le software ea CAM, lits’ebetso tsa litšoantšo tse tobileng tsa laser, lisebelisoa tse ikhethang tsa tlhahiso, le boiphihlelo ba opareitara. Katleho ea ts’ebetso ena kaofela e latela karolo ea melao ea moralo e khethollang litlhoko tsa impedance, bophara ba mokhanni, boholo ba lesoba le lintlha tse ling tse amang sebopeho. Developing detailed design rules helps select the right manufacturer or manufacturer for your board and lays the foundation for communication between teams.