It is reported that TSMC has won a large number of orders for 3nm process from Intel. Intel will use new technology to develop its next generation chip.
Udn ngadugikeun sumber dina ranté suplai salaku nyarios yén Intel parantos kéngingkeun seueur order prosés 3nm TSMC pikeun produksi chip generasi salajengna. Numutkeun ka média berita, pabrik wafer TSB 18B diperkirakeun ngamimitian produksi dina kuartal kadua 2022 sareng produksi masal diperkirakeun ngamimitian dina pertengahan 2022. Diperkirakeun yén kapasitas produksi bakal ngahontal 4000 lembar dugi ka Mei 2022 sareng 10000 potongan per bulan salami produksi massal

It has been reported that Intel will use TSMC 3nm in its next generation processors and display products. We first heard rumors from the beginning of 2021 that Intel may be producing mainstream consumer chips using N3 process to try to achieve the same process as AMD. Last month, we heard another news media quote TSMC’s two Intel designs to win.
Ayeuna dilaporkeun yén TSMC’s 18B Fab bakal ngahasilkeun henteu dua tapi sahenteuna opat produk dina 3nm. Éta kalebet tilu desain kanggo lapangan server sareng hiji desain kanggo bidang tampilan. Kami henteu yakin produk mana ieu, tapi Intel parantos nempatkeun granit Rapids Xeon CPU generasi saterusna salaku produk “Intel 4” (baheulana 7Nm). Chip Intel anu bakal datang bakal ngadopsi desain arsitéktur ubin, nyampur sareng pakait sareng sababaraha chip leutik, sareng sambungkeun aranjeunna ngalangkungan téknologi forveros / emib.
Some flat chips are likely to be produced in TSMC, while others will be produced in Intel’s own wafer factory. Intel’s flagship chip, the Ponte Vecchio GPU of “Intel 4”, is a product that well reflects this multi tile design. The design has multiple small chips in different processes produced by different wafer factories. Intel’s 2023 meteor Lake CPU is expected to adopt a similar tile configuration, and compute tile has tapeout on the “Intel 4” process. It is also possible to rely on external Fab I / O and display chips.
Intel has swallowed up the entire 3nm capacity of TSMC, which may put pressure on its competitors, mainly AMD and apple. Due to the process limitation of TSMC, AMD, which completely depends on TSMC to produce its latest 7Nm, has been facing serious supply problems. This may also be Intel’s strategy to prevent amd process development by prioritizing its own chips over TSMC, although it remains to be seen. For those who miss it, chipzilla has confirmed that it will outsource its chips to other wafer factories if necessary, so there is no speculation about this.