Tanpa modéren PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Téknologi HDI ngamungkinkeun désainer nempatkeun komponén leutik caket silih. Kapadetan rangkep anu langkung saé, ukuran papan anu langkung alit sareng lapisan anu langkung saé ngahasilkeun pangaruh tina desain PCB.

Kauntungannana HDI

Let’s take a closer look at the impact. Ningkatkeun kapadetan pakét ngamungkinkeun urang pikeun nyingetkeun jalur listrik antara komponén. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Ngurangan jumlah lapisan tiasa nempatkeun langkung seueur sambungan dina papan anu sami sareng ningkatkeun panempatan komponén, sambungan kabel sareng koneksi. Ti dinya, urang tiasa fokus kana téhnik anu disebut interconnect per Layer (ELIC), anu ngabantosan tim desain ngalih tina papan anu langkung kandel janten anu fleksibel ipis pikeun ngajaga kakuatan bari ngamungkinkeun HDI ningali kapadetan fungsional.

HDI PCBS rely on lasers rather than mechanical drilling. Dina gilirannana, desain HDI PCB ngahasilkeun aperture anu langkung alit sareng ukuran pad anu langkung alit. Ngurangan aperture ngamungkinkeun tim desain pikeun ningkatkeun tata ruang daérah dewan. Nyingetkeun jalur listrik sareng ngamungkinkeun kabel langkung intensif ningkatkeun integritas sinyal desain sareng ngagancangkeun pamrosésan sinyal. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

Desain HDI PCB henteu dianggo ngalangkungan liang, tapi lolong buta sareng dikubur. Staggered and accurate placement of burial and blind holes reduces mechanical pressure on the plate and prevents any chance of warping. In addition, you can use stacked through-holes to enhance interconnect points and improve reliability. Pamakéan anjeun dina bantalan ogé tiasa ngirangan leungitna sinyal ku ngirangan tunda silang sareng ngirangan épék parasit.

HDI manufacturability requires teamwork

Desain pabrikan (DFM) meryogikeun wawasan, pendekatan desain PCB tepat sareng komunikasi anu saluyu sareng pabrikan sareng pabrik. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Pondokna, desain, prototyping sareng prosés pembuatan HDI PCBS meryogikeun gawé babarengan anu caket sareng perhatosan kana aturan DFM khusus anu lumaku pikeun proyek.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Terang bahan papan sirkuit anjeun sareng spésifikasi

Kusabab produksi HDI nganggo sababaraha jinis prosés pangeboran laser, dialog antara tim desain, pabrikan sareng pabrikan kedah pokus kana jinis bahan papan nalika ngabahas prosés pangeboran. Aplikasi produk anu ngadorong prosés desain tiasa gaduh syarat ukuran sareng beurat anu mindahkeun paguneman dina hiji arah atanapi anu sanés. High frequency applications may require materials other than standard FR4. In addition, decisions about the type of FR4 material affect decisions about the selection of drilling systems or other manufacturing resources. Sedengkeun sababaraha sistem gampang dibor ngaliwatan tambaga, anu sanés henteu sacara konsisten nembus serat gelas.

Salian ti milih jinis bahan anu pas, tim desain ogé kedah mastikeun yén pabrikan sareng pabrikan tiasa nganggo ketebalan piring sareng teknik pelapis anu leres. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Sanaos pelat anu langkung kandel ngamungkinkeun apertur anu langkung alit, sarat mékanis proyek tiasa nunjukkeun pelat ipis anu gampang gagal dina kaayaan lingkungan anu tangtu. Tim desain kedah parios yén pabrikna ngagaduhan kamampuan ngagunakeun téknik “interconnect layer” sareng liang bor dina bojong anu leres, sareng mastikeun yén larutan kimia anu dianggo pikeun electroplating bakal ngeusian liang.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Salaku hasil tina ELIC, desain PCB tiasa ngamangpaatkeun padet, interkonéksi kompléks anu diperyogikeun pikeun sirkuit gancang-gancang. Kusabab ELIC nganggo microholes anu dieusi tambaga pikeun interkonéksi, éta tiasa dihubungkeun antara dua lapisan tanpa ngalemahkeun papan sirkuit.

Pilihan komponén mangaruhan tata perenah

Sawala diskusi sareng pabrik sareng pabrik ngeunaan desain HDI ogé kedah pokus kana tata perenah komponén kapadetan tinggi. The selection of components affects wiring width, position, stack and hole size. Salaku conto, desain HDI PCB ilaharna kalebet susunan kotak-kotak bola padet (BGA) sareng BGA jarak anu saé anu peryogi kabur pin. Faktor anu ngarusak pasokan listrik sareng integritas sinyal ogé integritas fisik dewan kedah dipikaterang nalika nganggo alat ieu. Faktor ieu kalebet ngahontal isolasi anu pas antara lapisan luhur sareng handap pikeun ngirangan silih crosstalk sareng ngendalikeun EMI antara lapisan sinyal internal.Symmetrically spaced components will help prevent uneven stress on the PCB.

Pay attention to signal, power and physical integrity

Salaku tambahan pikeun ningkatkeun integritas sinyal, anjeun ogé tiasa ningkatkeun integritas kakuatan. Kusabab HDI PCB mindahkeun lapisan grounding langkung caket kana permukaan, integritas kakuatan ningkat. Lapisan luhur papan ngagaduhan lapisan grounding sareng lapisan catu daya, anu tiasa dihubungkeun sareng lapisan grounding ngalangkungan liang buta atanapi microholes, sareng ngirangan jumlah liang pesawat.

HDI PCB ngirangan jumlah liwat-liang ngalangkungan lapisan jero dewan. In turn, reducing the number of perforations in the power plane provides three major advantages:

Daérah tambaga anu langkung ageung tuang AC sareng DC ayeuna kana pin kakuatan chip

L resistance decreases in the current path

L Kusabab induktansi rendah, arus switching anu leres tiasa maca pin kakuatan.

Another key point of discussion is to maintain minimum line width, safe spacing and track uniformity. Dina masalah anu terakhir, mimitian ngahontal ketebalan tambaga seragam sareng keseragaman kabel nalika prosés desain sareng teraskeun sareng prosés manufaktur sareng pabrik.

Lack of safe spacing can lead to excessive film residues during the internal dry film process, which can lead to short circuits. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Design teams and manufacturers must also consider maintaining track uniformity as a means of controlling signal line impedance.

Ngadegkeun sareng nerapkeun aturan desain khusus

High-density layouts require smaller external dimensions, finer wiring and tighter component spacing, and therefore require a different design process. The HDI PCB manufacturing process relies on laser drilling, CAD and CAM software, laser direct imaging processes, specialized manufacturing equipment, and operator expertise. The success of the entire process depends in part on design rules that identify impedance requirements, conductor width, hole size, and other factors that affect the layout. Ngembangkeun aturan desain anu lengkep ngabantosan milih pabrik atanapi pabrikan anu pas pikeun dewan anjeun sareng nyayogikeun yayasan pikeun komunikasi antar tim.