Uyilo olungqongqo lweFlex PCBA kunye nokuveliswa

Izinto zokuqinisa: isiseko selaphu leglasi yefiber

Insulating resin: polyimide resin (PI)

Ubukhulu bemveliso: ipleyiti ethambileyo 0.15mm; Ibhodi enzima 0.5mm; (ukunyamezela ± 0.03mm)

Ubungakanani betshiphu enye: bunokwenziwa ngokwezifiso ngokwemizobo enikezelwe ngumthengi

Ubunzima befoyile yobhedu: 18 μ m(0.5oz)

I-Solder ukumelana nefilimu / ioli: ifilimu ephuzi / ifilimu emnyama / ifilimu emhlophe / ioli eluhlaza

Ukwaleka kunye nobukhulu: OSP (12um-36um)

Umlinganiselo womlilo: 94-V0

Uvavanyo lokumelana nobushushu: ukothuka kwe-thermal 288 ℃ 10sec

I-Dielectric rhoqo: Pi 3.5; AD 3.9;

Umjikelo wokucubungula: iintsuku ezi-4 zeesampuli; Iintsuku ezisi-7 zokuvelisa ngobuninzi;

Indawo yokugcina: indawo emnyama kunye ne-vacuum, iqondo lokushisa <25 ℃, ukufuma <70%

iimpawu Product:

1. I-iPCB ingenziwa ngokwezifiso ukuba iqhube inkqubo ye-HDI yokungaboniyo komngxuma kunye nezinye i-Rigid Flex PCBA yoyilo kunye nokuvelisa;

2. Inkxaso ye-OEM kunye ne-ODM ye-OEM, ukusuka kwidizayini yokudweba ukuya kwimveliso yebhodi yesiphaluka kunye nokulungiswa kwe-SMT, kunye nokusebenzisana nabanikezeli ngenkonzo yokumisa enye;

3. Lawula ngokungqongqo umgangatho kwaye uhlangabezane nomgangatho we-ipc2;

Ubume be sicelo:

Iimveliso zisetyenziswa ngokubanzi kwiifowuni eziphathwayo, izixhobo zasekhaya, ulawulo lwamashishini, ishishini kunye nezinye iinkalo.