In PCB uyilo, i-wiring linyathelo elibalulekileyo lokugqiba uyilo lwemveliso. Kunokuthiwa amalungiselelo angaphambili enzelwe yona. Kuyo yonke i-PCB, inkqubo yoyilo lwe-wiring inowona mda uphezulu, izakhono ezigqwesileyo, kunye nowona msebenzi mkhulu. I-PCB yocingo ibandakanya i-single-side, i-wiring-side-side kunye ne-multilayer wiring. Kukho neendlela ezimbini zocingo: i-wiring ezenzekelayo kunye ne-interactive wiring. Ngaphambi kocingo oluzenzekelayo, ungasebenzisa i-interactive uku-pre-ingcingo iintambo ezifuna kakhulu. Imida yesiphelo segalelo kunye nesiphelo sesiphumo kufuneka sigwenywe kufuphi ne-parallel ukuphepha ukuphazamiseka kokubonakalisa. Ukuba kuyimfuneko, ucingo lomhlaba kufuneka longezwe ukuba lube lodwa, kwaye i-wiring yemigangatho emibini esondeleyo kufuneka ibe yi-perpendicular omnye komnye. Ukudibanisa kweParasitic kulula ukwenzeka ngokuhambelana.

Umyinge woyilo lomzila oluzenzekelayo uxhomekeke kuyilo olulungileyo. Imithetho yomzila inokumiselwa kwangaphambili, kuquka inani lamaxesha okugoba, inani le-vias, kunye nenani lamanyathelo. Ngokuqhelekileyo, hlola i-warp wiring kuqala, ngokukhawuleza udibanise iingcingo ezimfutshane, uze wenze i-labyrinth wiring. Okokuqala, i-wiring eza kubekwa ilungiselelwe indlela yocingo yehlabathi. Iyakwazi ukuqhawula iingcingo ezibekiweyo njengoko kufuneka. Kwaye zama ukuphinda-ingcingo ukuphucula umphumo jikelele.

Uyilo lwangoku olunoxinano oluphezulu lwe-PCB luvakalelwa kukuba umngxuma wokutyhutyha awufanelekanga, kwaye uchitha amajelo ocingo axabisekileyo. Ukuze kulungiswe le ngxabano, ubuchwepheshe obuyimfama kunye nokungcwatywa komngxuma buye bavela, obungazalisekisi kuphela indima ye- through-hole Kwakhona kusindisa amaninzi amajelo ocingo ukwenza inkqubo yocingo ibe lula, ilula, kwaye iphelele. Inkqubo yoyilo lwebhodi yePCB yinkqubo entsonkothileyo nelula. Ukuze uyiqonde kakuhle, kufuneka uyilo lobunjineli be-elektroniki obukhulu. Kuphela kuxa abasebenzi bezifumana bebodwa abanokuthi bafumane eyona ntsingiselo yayo.

1 Unyango lonikezelo lwamandla kunye nocingo lomhlaba

Nokuba i-wiring kwibhodi yonke ye-PCB igqitywe kakuhle kakhulu, ukuphazamiseka okubangelwa ukuqwalaselwa okungafanelekanga konikezelo lwamandla kunye nocingo lomhlaba luya kunciphisa ukusebenza kwemveliso, kwaye ngamanye amaxesha kuchaphazela izinga lokuphumelela kwemveliso. Ngoko ke, i-wiring yombane kunye neengcingo zomhlaba kufuneka zithathwe ngokungathí sina, kunye nokuphazamiseka kwengxolo eyenziwa ngamacingo ombane kunye nomhlaba kufuneka kuncitshiswe ukuqinisekisa umgangatho wemveliso.

Zonke iinjineli ezibandakanyeka kuyilo lweemveliso ze-elektroniki ziyasiqonda isizathu sengxolo phakathi kocingo oluphantsi komhlaba kunye nocingo lwamandla, kwaye ngoku kuchazwa kuphela ukuthomalaliswa kwengxolo encitshisiweyo:

(1) Kuyaziwa ukuba yongeza i-decoupling capacitor phakathi kokunikezelwa kwamandla kunye nomhlaba.

(2) Yandisa ububanzi bamandla kunye neengcingo zomhlaba kangangoko kunokwenzeka, kukhethwa ucingo oluphantsi lubanzi kunocingo lwamandla, ubudlelwane babo bu: ucingo oluphantsi> ucingo lwamandla> ucingo lwesignali, ngokuqhelekileyo ububanzi becingo lomqondiso: 0.2～ 0.3mm, obona Ububanzi obubhityileyo bunokufikelela kwi-0.05 ~ 0.07mm, kwaye intambo yamandla yi-1.2 ~ 2.5 mm.

Kwi-PCB yesekethe yedijithali, ucingo olubanzi lomhlaba lungasetyenziselwa ukwenza i-loop, oko kukuthi, ukwenza umnatha womhlaba oza kuwusebenzisa (umhlaba wesiphaluka se-analog awukwazi ukusetyenziswa ngale ndlela)

(3) Sebenzisa indawo enkulu yobhedu njengocingo oluphantsi, kwaye udibanise iindawo ezingasetyenziswanga kwibhodi yesekethe eprintiweyo emhlabeni njengocingo oluphantsi. Okanye ingenziwa kwibhodi ye-multilayer, kwaye ukunikezelwa kwamandla kunye neengcingo zomhlaba zithatha umaleko omnye.

2 Ukulungiswa komhlaba oqhelekileyo wesekethe yedijithali kunye nesekethe ye-analog

Ii-PCB ezininzi azisekho iisekethe ezisebenza enye (iisekethe zedijithali okanye ze-analog), kodwa zenziwe ngumxube wesekethe zedijithali kunye ne-analog. Ngoko ke, kuyimfuneko ukuqwalasela ukuphazamiseka phakathi kwabo xa udibanisa, ngokukodwa ukuphazamiseka kwengxolo kwi-wire yomhlaba.

I-frequency yesekethe yedijithali iphezulu, kwaye uvakalelo lwesekethe ye-analog yomelele. Ngomgca wesignali, umgca wesignali we-high-frequency kufuneka ube kude kangangoko kunokwenzeka kwisixhobo sesekethe ye-analog ebuthathaka. Kumgca osezantsi, yonke i-PCB ine-node enye kwihlabathi langaphandle, ngoko ke Ingxaki yedijithali kunye ne-analog yomhlaba oqhelekileyo kufuneka kujongwane nayo ngaphakathi kwe-PCB, kwaye umhlaba wedijithali kunye nomhlaba we-analog ngaphakathi kwebhodi zihlulwe ngokwenene kwaye ziyahlukana. ayidityaniswanga enye kwenye, kodwa kujongano (ezifana neeplagi, njl. njl.) idibanisa iPCB nelizwe langaphandle. Kukho uxhumano olufutshane phakathi komhlaba wedijithali kunye nomhlaba we-analog. Nceda uqaphele ukuba kukho indawo enye kuphela yoqhagamshelwano. Kukwakho nezizathu ezingezizo eziqhelekileyo kwi-PCB, emiselwa yinkqubo yoyilo.

3 Umgca wesignali ubekwe phezu kombane (umhlaba) umaleko

Kwi-multi-layer eprinted wiring board, kuba akukho ingcingo ezininzi ezisele kwi-signal line layer engakhange ibekwe, ukongeza iileyile ezininzi kuya kubangela inkunkuma kunye nokwandisa umsebenzi wokuvelisa, kwaye iindleko ziya kunyuka ngokufanelekileyo. Ukusombulula le ngxabano, unokuqwalasela i-wiring kumbane (umhlaba) umaleko. Uluhlu lwamandla kufuneka luqwalaselwe kuqala, kwaye umgangatho womhlaba wesibini. Ngenxa yokuba kungcono ukugcina ingqibelelo yokwakheka.

I-4 Unyango lwemilenze yokudibanisa kwiindawo ezinkulu zabaqhubi

Kwindawo enkulu yomhlaba (umbane), imilenze yamacandelo aqhelekileyo axhunyiwe kuyo. Unyango lwemilenze yokudibanisa kufuneka ithathelwe ingqalelo ngokubanzi. Ngokumalunga nokusebenza kombane, kungcono ukudibanisa iipads zemilenze yecandelo kwindawo yobhedu. Kukho iingozi ezingafunekiyo ezifihlakeleyo ekudibaniseni nasekudityanisweni kwezinto, ezinje: ① Ukuwelda kufuna izifudumezi ezinamandla amakhulu. ②Kulula ukwenza i-solder joints. Ke ngoko, zombini ukusebenza kombane kunye neemfuno zenkqubo zenziwe kwiipads ezinqamlezileyo, ezibizwa ngokuba zizikhuselo zobushushu, ezaziwa ngokuba zii-thermal pads (Thermal), ukwenzela ukuba amajoyinti e-solder anokuthi aveliswe ngenxa yobushushu obugqithileyo becandelo ngexesha le-soldering. Ukwabelana ngesondo kuncitshiswe kakhulu. Ukuqhutyelwa komlenze wamandla (umhlaba) webhodi ye-multilayer iyafana.

5 Indima yesixokelelwano sothungelwano kwikhewubhuli

Kwiinkqubo ezininzi zeCAD, i-wiring inqunywe yinkqubo yenethiwekhi. Igridi ixinene kakhulu kwaye indlela iye yanda, kodwa inyathelo lincinci, kwaye inani ledatha kwintsimi likhulu kakhulu. Oku kuya kuba neemfuneko eziphezulu zendawo yokugcina isixhobo, kunye nesantya sekhompyutheni yeemveliso zombane ezisekelwe kwikhompyutha. Impembelelo enkulu. Ezinye iindlela azivumelekanga, njengalezo zihlalwa ngamaphedi emilenze yecandelo okanye ngokufaka imingxuma kunye nemingxuma esisigxina. Iigridi ezinqabileyo kakhulu kunye neeshaneli ezimbalwa zinempembelelo enkulu kwizinga lokusabalalisa. Ngoko ke, kufuneka kubekho inkqubo yegridi edibeneyo kunye nengqiqo ukuxhasa i-wiring.

Umgama phakathi kwemilenze yamacandelo asemgangathweni yi-intshi ye-0.1 (2.54mm), ngoko ke isiseko senkqubo yegridi siqhele ukuseta kwi-intshi ze-0.1 (2.54 mm) okanye ukuphindaphinda okudibeneyo okungaphantsi kwe-intshi ye-0.1, njenge: 0.05 intshi, 0.025 intshi, 0.02 intshi njl.

6 Ukujonga uMthetho woYilo (DRC)

Emva kokugqitywa koyilo lwe-wiring, kuyimfuneko ukujonga ngokucophelela ukuba i-wiring design idibana nemithetho ebekwe ngumyili, kwaye kwangaxeshanye, kuyimfuneko ukuqinisekisa ukuba imigaqo ebekiweyo iyahlangabezana neemfuno zenkqubo yokuvelisa ibhodi eprintiweyo. Uhlolo jikelele lunemiba ilandelayo:

(1) Ingaba umgama phakathi komgca kunye nomgca, umgca kunye nomgca wecandelo, umgca kunye nomngxuma, i-pad yecandelo kunye nomngxuma, ngomngxuma kunye nomngxuma kunengqiqo, kwaye ingaba iyahlangabezana neemfuno zemveliso.

(2) Ngaba ububanzi bentambo yombane kunye nomgca osezantsi bufanelekile? Ngaba unikezelo lwamandla kunye nomgca osezantsi zidityaniswe ngokuqinileyo (i-impedance yamaza aphantsi)? Ingaba ikhona indawo kwiPCB apho ucingo olusezantsi lunokwandiswa?

(3) Ingaba amanyathelo angcono athathiweyo kwimigca yeempawu eziphambili, njengobude obufutshane, umgca wokukhusela wongezwa, kwaye umgca wokungena kunye nomgca wokuphuma uhlukaniswe ngokucacileyo.

(4) Ingaba kukho iingcingo zomhlaba ezahlukeneyo zesekethe ye-analog kunye nesekethe yedijithali.

(5) Nokuba imizobo (efana nee-iyikhoni kunye neenkcazo) ezongeziweyo kwi-PCB ziya kubangela umqondiso wesiphaluka esifutshane.

(6) Guqula iimilo zomgca ezinganqwenelekiyo.

(7) Ngaba kukho umgca wenkqubo kwi-PCB? Ingaba i-mask ye-solder iyahlangabezana neemfuno zenkqubo yokuvelisa, nokuba isayizi ye-mask ye-solder ifanelekile, kunye nokuba ilogo yomlinganiswa icinezelwe kwiphedi yesixhobo, ukuze ingachaphazeli umgangatho wesixhobo sombane.

(8) Ingaba umphetho wesakhelo sangaphandle somaleko womhlaba wamandla kwibhodi ye-multilayer uyancitshiswa, njengefoyile yobhedu yomaleko omhlaba wamandla ovezwe ngaphandle kwebhodi, onokubangela isekethe emfutshane.