Kukho iileya ezininzi ezahlukeneyo kuyilo kunye nokuveliswa kwazo ibhodi yesekethe eprintiweyo. Ezi maleko zisenokungaqheleki kwaye ngamanye amaxesha zide zibangele ukubhideka, nakubantu abasoloko besebenza nabo. Kukho iileya ezibonakalayo zoqhagamshelwano lwesekethe kwibhodi yesekethe, kwaye ke kukho iileya zokuyila ezi maleko kwisixhobo sePCB CAD. Makhe sijonge intsingiselo yako konke oku kwaye sichaze iileya zePCB.

PCB ingcaciso umaleko kwibhodi yesekethe eprintiweyo

Njenge-snack engentla, ibhodi yesekethe eprintiweyo yenziwe ngamacandelo amaninzi. Nokuba ibhodi elula yecala elilodwa (enye-ungqimba) iqulunqwe ngumaleko wetsimbi oqhubekileyo kunye nomgangatho wesiseko odityanisiweyo kunye. Njengoko ubunzima bePCB bukhula, inani leeleya ngaphakathi kuyo liya kwanda.

I-PCB ye-multilayer iya kuba ne-core layers enye okanye ngaphezulu eyenziwe ngemathiriyeli ye-dielectric. Esi sixhobo sihlala senziwe ngelaphu le-fiberglass kunye ne-epoxy resin adhesive, kwaye isetyenziswa njengomaleko okhuselayo phakathi kwamaleko entsimbi amabini akufuphi nayo. Ngokuxhomekeka ekubeni zingaphi iileya zomzimba ezifunwa yibhodi, kuya kubakho iileyile ezininzi zetsimbi kunye nezinto eziphambili. Phakathi kwendawo nganye yentsimbi kuya kubakho umaleko weglasi yefiber yeglasi yefiber, efakwe ngaphambili ngeresin ebizwa ngokuba yi “prepreg”. I-Prepregs zizinto ezingundoqo ezinganyangekiyo, kwaye xa zibekwe phantsi koxinzelelo lokufudumeza kwenkqubo ye-lamination, ziyanyibilika kwaye zidibanise iileya kunye. I-prepreg iya kusetyenziswa njenge-insulator phakathi kweengqimba zetsimbi.

Uluhlu lwesinyithi kwi-PCB ye-multi-layer iya kuqhuba umqondiso wombane wendawo yesiphaluka ngenqaku. Kwiimpawu eziqhelekileyo, sebenzisa iintambo zetsimbi ezincinci, ngelixa unamandla kunye nenetha yomhlaba, sebenzisa ukulandelela okubanzi. Iibhodi ze-Multilayer zihlala zisebenzisa uluhlu olupheleleyo lwetsimbi ukwenza amandla okanye indiza yomhlaba. Oku kuvumela zonke iinxalenye ukuba zingene ngokulula kwindiza yendiza ngokusebenzisa imingxuma emincinci egcwele i-solder, ngaphandle kwesidingo socingo lwamandla kunye neenqwelo-moya zomhlaba kulo lonke uyilo. Ikwanegalelo ekusebenzeni kombane kuyilo ngokubonelela ngokhuselo lwe-electromagnetic kunye nendlela elungileyo yokubuya eyomeleleyo yokulandela umqondiso.

Iprintwe izaleko zebhodi yesekethe kwizixhobo zoyilo zePCB

Ukuze udale iileyile kwibhodi yesiphaluka somzimba, ifayile yomfanekiso wendlela yokulandelela isinyithi eyenziwa ngumenzi wokwakha ibhodi yesekethe iyadingeka. Ukuze udale le mifanekiso, PCB uyilo izixhobo CAD babe iseti yazo umaleko ibhodi yesekethe ukuze iinjineli ukuba basebenzise xa kuyilwa iibhodi zesekethe. Emva kokuba uyilo lugqityiwe, la maleko ahlukeneyo e-CAD aya kuthunyelwa kumenzi ngokusebenzisa iseti yokuvelisa kunye neefayile zemveliso yendibano.

Umaleko ngamnye wesinyithi kwibhodi yesekethe imelwe ngumaleko omnye okanye ngaphezulu kwisixhobo soyilo sePCB. Ngokuqhelekileyo, i-dielectric (i-core kunye ne-prepreg) i-layers ayibonakaliswa ngamacandelo e-CAD, nangona oku kuya kuhluka ngokuxhomekeke kwi-teknoloji yebhodi yesekethe eya kuyilwa, esiya kuyikhankanya kamva. Nangona kunjalo, kuyilo oluninzi lwePCB, umaleko we-dielectric umelwe kuphela ziimpawu kwisixhobo soyilo, ukuze kuqwalaselwe izinto kunye nobubanzi. Ezi mpawu zibalulekile kwiikhaltyhuleyitha ezahlukeneyo kunye ne-simulators esiya kuthi sisetyenziswe sisixhobo soyilo ukumisela amaxabiso achanekileyo emitha yesinyithi kunye nezithuba.

Ukongeza ekufumaneni umaleko ohlukeneyo wentsimbi nganye yebhodi yesekethe kwisixhobo soyilo sePCB, kuya kubakho iileyile zeCAD ezinikezelwe kwimaski ye-solder, i-solder paste, kunye namanqaku okushicilela kwesikrini. Emva kokuba iibhodi zeesekethe zihlanjululwe kunye, iimaski, i-pastes kunye ne-agent yokushicilela isikrini zisetyenziselwa kwiibhodi zeesekethe, ngoko azikho iileyile ezibonakalayo zeebhodi zesekethe zangempela. Nangona kunjalo, ukubonelela abavelisi be-PCB ngolwazi olufunekayo ukuze basebenzise ezi zixhobo, kufuneka bazenzele iifayile zabo zemifanekiso kwi-PCB CAD layer. Okokugqibela, isixhobo soyilo sePCB siya kuba nezinye iileya ezininzi ezakhelwe ngaphakathi ukufumana olunye ulwazi olufunekayo kuyilo okanye iinjongo zoxwebhu. Oku kunokubandakanya ezinye izinto zetsimbi ebhodini okanye ebhodini, iinombolo zenxalenye kunye nolwandlalo lwamacandelo.

Ngaphaya komgangatho wePCB umaleko

Ukongeza ekuyileni umaleko omnye okanye iibhodi zesekethe eziprintiweyo ezininzi, izixhobo zeCAD zikwasetyenziswa kwezinye iindlela zoyilo lwePCB namhlanje. Uyilo oluguquguqukayo nolungqongqo luya kuba neeleya eziguquguqukayo ezakhelwe kuzo, kwaye ezi maleko ziyafuneka ukuba zimelwe kwi-PCB yoyilo lwezixhobo zeCAD. Akufuneki kuphela ukubonisa ezi maleko kwisixhobo sokusebenza, kodwa zifuna indawo yokusebenza ye-3D ephezulu kwisixhobo. Oku kuya kuvumela abayili ukuba babone indlela uyilo olubhetyebhetye olugoba ngayo kwaye lutyhileke kunye nenqanaba kunye ne-engile yokugoba xa isetyenziswa.

Obunye ubuchwephesha obufuna iileya ezongezelelweyo zeCAD bubuchwephesha obuprintwayo okanye obuhlanganisiweyo be-elektroniki. Olu luyilo lwenziwa ngokongeza okanye “ukuprinta” isinyithi kunye nemathiriyeli ye-dielectric kwi-substrate endaweni yokusebenzisa inkqubo ye-subtractive etching njengakwii-PCB eziqhelekileyo. Ukuze ulungelelanise le meko, izixhobo zokuyila ze-PCB kufuneka zikwazi ukubonisa kunye nokuyila ezi zingqimba ze-dielectric ngaphezu kwesinyithi esisemgangathweni, imaski, ukuncamathisela kunye neengqimba zokushicilela isikrini.