Inkqubo yokuhlanganisa umphezulu wentaba isebenzisa iitemplates njengendlela eya echanekileyo, ephindaphindwayo yokubeka i-solder paste. Ithempleyithi ibhekisa kwiphepha elicekethekileyo okanye elicekethekileyo lobhedu okanye intsimbi engenasiphene enepateni yesekethe esikwe kuyo ukuze itshatise ipateni yendawo yesixhobo sokunyuka komphezulu (SMD) ibhodi yesekethe eprintiweyo (PCB) apho ithempleyithi iza kusetyenziswa. Emva kokuba ithemplate ibekwe ngokuchanekileyo kwaye ihambelana ne-PCB, i-metal squeegee inyanzelisa i-solder paste ngokusebenzisa imingxuma ye-template, ngaloo ndlela yenza iidiphozithi kwi-PCB ukulungisa i-SMD endaweni. I-solder paste idiphozithi iyanyibilika xa idlula kwi-oven yokubuyisela kwaye ilungise i-SMD kwi-PCB.

Uyilo lwethemplate, ngokukodwa ukubunjwa kwayo kunye nobukhulu, kunye nokumila kunye nobukhulu bemingxuma, imisela ubungakanani, imilo kunye nendawo yeediphozithi ze-solder paste, okuyimfuneko ekuqinisekiseni inkqubo yokuhlanganisana ephezulu. Ngokomzekelo, ubukhulu be-foil kunye nobukhulu bokuvula imingxuma ichaza umthamo we-slurry efakwe ebhodini. Ukugqithiswa kwe-solder ngokugqithisileyo kunokukhokelela ekubunjweni kweebhola, iibhulorho kunye namatye amangcwaba. Inani elincinci le-solder paste liya kubangela ukuba i-solder joints yome. Bobabini baya kuwonakalisa umsebenzi wombane webhodi yesekethe.

Olona bunzima befoyile

Uhlobo lwe-SMD ebhodini luchaza ubukhulu be-foil obufanelekileyo. Umzekelo, ukupakishwa kwecandelo elinje nge-0603 okanye 0.020 ″ i-pitch SOIC ifuna ithempleyithi yokuncamathisela ebhityileyo, ngelixa ithempleyithi etyebileyo ifaneleke ngakumbi kumacandelo anje nge-1206 okanye 0.050 ″ pitch SOIC. Nangona ubukhulu bethempleyithi esetyenziselwa ukuncamatheliswa kwe-solder bususela kwi-0.001″ ukuya kwi-0.030″, ubukhulu befoil eqhelekileyo esetyenziswa kwiibhodi ezininzi zesekethe busuka kwi-0.004″ ukuya kwi-0.007″.

Itekhnoloji yokwenza itemplate

Okwangoku, ishishini lisebenzisa itekhnoloji ezintlanu ukwenza i-stencils-laser cut, i-electroforming, i-chemical etching kunye nokuxuba. Nangona itekhnoloji ye-hybrid iyindibaniselwano yokusikwa kweekhemikhali kunye nokusika i-laser, ukufakwa kweekhemikhali kuluncedo kakhulu ekwenzeni iistencil ezinyuliweyo kunye neestencil ezixutyiweyo.

Ukufakwa kweekhemikhali kwiitemplates

Ukugaya imichiza kubamba imaski yentsimbi kunye netemplate yemaski yentsimbi eguqukayo macala omabini. Ekubeni oku kugqwesa kungekuphela nje kwicala elithe nkqo kodwa nakwicala elisecaleni, kuya kubangela ukuba ngaphantsi kwaye kwenze ukuvuleka okukhulu kunobungakanani obufunekayo. Njengoko i-etching iqhubela phambili ukusuka kumacala omabini, ukubethelwa eludongeni oluthe tye kuya kubangela ukubunjwa kwe-hourglass shape, eya kubangela iidiphozithi ezingaphezulu kwe-solder.

Ekubeni ukuvulwa kwe-stencil etching akuvelisi iziphumo ezigudileyo, ishishini lisebenzisa iindlela ezimbini zokugudisa iindonga. Enye yazo yinkqubo ye-electro-polish kunye ne-micro-etching, kwaye enye i-nickel plating.

Nangona indawo egudileyo okanye epholisiweyo inceda ukukhulula intlama, inokubangela ukuba intlama itsibe umphezulu wetemplate endaweni yokuqengqeleka kunye ne-squeegee. Umenzi wetemplate usombulula le ngxaki ngokukhetha ngokucokisekileyo iindonga zomngxuma endaweni yendawo yetemplate. Nangona i-nickel plating inokuphucula ukuhamba kakuhle kunye nokusebenza kokushicilela kwethemplate, kunokunciphisa ukuvuleka, okudinga ukulungiswa komsebenzi wobugcisa.

Template laser cutting

Ukusika i-Laser yinkqubo yokunciphisa efaka idatha yeGerber kumatshini we-CNC olawula i-laser beam. I-laser beam iqala ngaphakathi komda womngxuma kwaye inqumla i-perimeter yayo ngelixa isusa ngokupheleleyo isinyithi ukwenza umngxuma, umngxuma omnye kuphela ngexesha.

Iiparamitha ezininzi zichaza ukugudiswa kokusika kwe-laser. Oku kubandakanya isantya sokusika, ubungakanani bendawo yomqadi, amandla e-laser kunye nokugxilwa komqadi. Ngokubanzi, ishishini lisebenzisa ibala elimalunga ne-1.25 mils, elinokuthi lisike iindawo ezichanekileyo kwiintlobo ezahlukeneyo zeemilo kunye neemfuno zobukhulu. Nangona kunjalo, imingxuma yokusikwa kwelaser nayo ifuna ukusetyenzwa ngasemva, njengemingxunya efakwe ngamachiza. I-Laser cutting molds idinga i-electrolytic polishing kunye ne-nickel plating ukwenza udonga lwangaphakathi lomngxuma lube lula. Njengoko ubungakanani be-aperture buncitshisiwe kwinkqubo elandelayo, ubungakanani be-aperture yokusika i-laser kufuneka bubuyekezwe ngokufanelekileyo.

Imiba yokusebenzisa i-stencil printing

Ukushicilela ngeestencil kubandakanya iinkqubo ezintathu ezahlukeneyo. Eyokuqala yinkqubo yokuzalisa umngxuma, apho i-solder paste igcwalisa imingxuma. Okwesibini yinkqubo yokudluliselwa kwe-solder paste, apho i-solder paste eqokelelwe emngxunyeni idluliselwe kumphezulu we-PCB, kwaye okwesithathu yindawo yokuncamathelisa idiphozithi ye-solder. Ezi nkqubo zintathu zibalulekile ekufumaneni isiphumo esifunekayo-ukufaka umthamo ochanekileyo we-solder paste (ekwabizwa ngokuba sisitena) kwindawo efanelekileyo kwi-PCB.

Ukuzalisa imingxuma yetemplate nge-solder paste kufuna i-metal scraper ukucinezela i-solder paste kwimingxuma. Ukuqhelaniswa komngxuma ngokubhekiselele kumgca we-squeegee kuchaphazela inkqubo yokuzalisa. Umzekelo, umngxuma one-axis ende ejolise kwi-stroke ye-blade igcwalisa ngcono kunomngxuma kunye ne-axis yayo emfutshane ejoliswe kwicala le-blade stroke. Ukongezelela, ekubeni isantya se-squeegee sichaphazela ukuzaliswa kwemingxuma, isantya esisezantsi se-squeegee singenza imingxuma emide i-axis ihambelana ne-stroke ye-squeegee igcwalise ngcono imingxuma.

Umda womgca we-squeegee uchaphazela indlela i-solder paste igcwalisa ngayo imingxuma ye-stencil. Umkhuba oqhelekileyo kukuprinta ngelixa usebenzisa ubuncinci boxinzelelo lwe-squeegee ngelixa ugcina ucoceko olucocekileyo lwe-solder paste ebusweni be-stencil. Ukwandisa uxinzelelo lwe-squeegee kunokonakalisa i-squeegee kunye ne-template, kwaye kubangele ukuba i-paste ifakwe phantsi kobuso be template.

Kwelinye icala, uxinzelelo olusezantsi lwe-squeegee alunakuvumela ukuba i-solder paste ikhululwe kwimingxuma emincinci, okukhokelela kwi-solder engonelanga kwi-PCB pads. Ukongeza, intlama ye-solder eshiywe kwicala le-squeegee kufuphi nomngxuma omkhulu inokutsalwa phantsi ngumxhuzulane, okukhokelela ekubekweni kwe-solder engaphezulu. Ngoko ke, uxinzelelo oluncinci luyafuneka, oluya kufezekisa ukusula okucocekileyo kwe-paste.

Ubungakanani boxinzelelo olusetyenzisiweyo luxhomekeke kuhlobo lwe-solder paste esetyenzisiweyo. Ngokomzekelo, xa kuthelekiswa nokusebenzisa i-tin / lead paste, xa usebenzisa i-lead-free solder paste, i-PTFE / i-nickel-plated squeegee idinga malunga ne-25-40% yoxinzelelo olungaphezulu.

Imiba yokusebenza ye-solder paste kunye neestencil

Eminye imiba yokusebenza enxulumene ne-solder paste kunye ne-stencils yile:

Ubukhulu kunye nobungakanani bokuvuleka kwefoyile yestencil bumisela umthamo onokubakho wokuncamatheliswa kwe-solder ofakwe kwi-PCB pad.

Ukukwazi ukukhulula i-solder paste ukusuka kudonga lomngxuma wetemplate

Isikhundla ukuchaneka izitena solder eprintwe PCB pads

Ngethuba lomjikelezo wokushicilela, xa umgca we-squeegee udlula kwi-stencil, i-solder paste igcwalisa umngxuma we-stencil. Ngethuba lomjikelezo wokuhlukana kwebhodi / itemplate, i-solder paste iya kukhutshwa kwiipads ebhodini. Ngokufanelekileyo, yonke i-solder paste egcwalisa umngxuma ngexesha lenkqubo yokushicilela kufuneka ikhutshwe eludongeni lomngxuma kwaye idluliselwe kwi-pad ebhodini ukwenza isitena esipheleleyo se-solder. Nangona kunjalo, isixa sokudlulisa sixhomekeke kwi-aspect ratio kunye nomlinganiselo wendawo yokuvula.

Ngokomzekelo, kwimeko apho indawo yepadi inkulu kunesibini kwisithathu sommandla wodonga lwangaphakathi lwe-pore, i-paste inokuphumeza ukukhululwa okungcono kune-80%. Oku kuthetha ukuba ukunciphisa ubukhulu betemplate okanye ukwandisa ubungakanani bomngxuma kunokukhulula ngcono i-solder paste phantsi komlinganiselo ofanayo wendawo.

Ukukwazi kwe-solder paste ukukhulula kudonga lomngxuma wetemplate kuxhomekeke ekugqityweni kodonga lomngxuma. Imingxuma yokusika iLaser nge-electropolishing kunye / okanye i-electroplating inokuphucula ukusebenza kakuhle kokuhanjiswa kwe-slurry. Nangona kunjalo, ukudluliselwa kwe-solder paste ukusuka kwitemplate ukuya kwi-PCB kwakhona kuxhomekeke ekunamatheleni kwe-solder paste kwi-template yodonga lomngxuma kunye nokunamathela kwi-solder pad kwi-PCB pad. Ukuze ufumane isiphumo esihle sokudlulisa, lo mva kufuneka ube mkhulu, oku kuthetha ukuba ukuprintwa kuxhomekeke kumlinganiselo wendawo yodonga lwethemplate kwindawo yokuvula, ngelixa ungayihoyi iziphumo ezincinci ezifana ne-angle eyidrafti yodonga kunye noburhabaxa bayo. .

Isikhundla kunye nokuchaneka kwe-dimensional yezitena ze-solder eziprintiweyo kwi-PCB pads zixhomekeke kumgangatho wedatha ye-CAD edlulisiweyo, iteknoloji kunye nendlela esetyenziselwa ukwenza itemplate, kunye nokushisa kwethemplate ngexesha lokusetyenziswa. Ukongezelela, ukuchaneka kwendawo kuxhomekeke kwindlela yokulungelelanisa esetyenzisiweyo.

Ithemplethi enefreyimu okanye itemplate encamatheleyo

Ithemplate ecwangcisiweyo okwangoku iyona template enamandla kakhulu yokusika i-laser, eyenzelwe ukuprintwa kwesikrini esikhulu kwinkqubo yokuvelisa. Zifakwe ngokusisigxina kwisakhelo se-formwork, kwaye isakhelo se-mesh siqinisa ngokuqinileyo i-foil formwork kwi-formwork. Kwi-BGA encinci kunye namacandelo ane-pitch ye-16 mil nangaphantsi, kuyacetyiswa ukuba usebenzise i-template eqingqiweyo kunye nodonga lomngxuma olugudileyo. Xa isetyenziswe phantsi kweemeko zokushisa ezilawulwayo, iimbumba ezicwangcisiweyo zibonelela ngeyona ndawo ingcono kunye nokuchaneka kwe-dimensional.

Kwimveliso yexesha elifutshane okanye indibano ye-PCB yeprototype, iitemplates ezingenasiphelo zinokubonelela ngeyona nto ingcono yokulawula umthamo we-solder. Ziyilelwe ukusetyenziswa kunye ne-formwork tensioning systems, ezizizakhelo zeformwork eziphinda zisetyenziswe, ezifana nezakhelo zendalo yonke. Kuba ukubumba kungancanyathiselwe ngokusisigxina kwisakhelo, kubiza kakhulu kunohlobo lwesakhelo sokubumba kwaye kuthatha indawo encinci yokugcina.