Ngophuhliso oluqhubekayo lwesayensi ye-elektroniki kunye nobuchwepheshe, PCB Itekhnoloji nayo ifumene utshintsho olukhulu, kwaye nenkqubo yokuvelisa nayo ifuna ukuphuculwa. Kwangaxeshanye, iimfuno inkqubo iibhodi PCB sesekethe kushishino ngalinye ziye zaphucuka ngokuthe ngcembe. Ngokomzekelo, kwiibhodi zeesekethe zeefowuni eziphathwayo kunye neekhomputha, igolide kunye nobhedu zisetyenzisiweyo, okwenza kube lula ukuhlukanisa inzuzo kunye nokungonakali kweebhodi zeesekethe.

Thatha wonke umntu ukuba aqonde itekhnoloji yomphezulu webhodi yePCB, kwaye uthelekise izinto eziluncedo nezingeloncedo kunye neemeko ezisebenzayo zeenkqubo ezahlukeneyo zonyango lomphezulu webhodi yePCB.

Ngokucacileyo ukusuka ngaphandle, umaleko wangaphandle webhodi yesekethe ubukhulu becala unemibala emithathu: igolide, isilivere, kunye nokukhanya okubomvu. Ihlelwa ngokwexabiso: igolide yeyona ibiza kakhulu, isilivere yeyesibini, kwaye ibomvu ekhanyayo yeyona inexabiso eliphantsi. Enyanisweni, kulula ukugweba kumbala ukuba ngaba abavelisi be-hardware banqumla iikona. Nangona kunjalo, i-wiring ngaphakathi kwebhodi yesiphaluka ubukhulu becala ibhedu ecocekileyo, oko kukuthi, ibhodi yobhedu engenanto.

1. Bare ipleyiti yobhedu

Izibonelelo kunye nezinto ezingalunganga zicacile:

Izinto eziluncedo: ngexabiso eliphantsi, umphezulu ogudileyo, ukulungeleka okuhle (xa kungekho igcwala).

Iingxaki: Kulula ukuchatshazelwa yi-asidi kunye nokufuma kwaye ayikwazi ukugcinwa ixesha elide. Kufuneka isetyenziswe kwiiyure ezingama-2 emva kokukhupha, kuba ubhedu lufakwe i-oxidized ngokulula xa lubonakaliswe emoyeni; ayinakusetyenziselwa iibhodi ezinamacala amabini kuba icala lesibini emva kwe-solder yokuqala ye-reflow Isele i-oxidized. Ukuba kukho indawo yokuvavanya, i-solder paste kufuneka iprintwe ukukhusela i-oxidation, ngaphandle koko ayiyi kudibana kakuhle ne-probe.

Ubhedu olucocekileyo lufakwe i-oxidized ngokulula xa lubonakaliswe emoyeni, kwaye umaleko wangaphandle kufuneka ube noluhlu olukhuselekileyo olukhankanywe ngasentla. Yaye abanye abantu bacinga ukuba umthubi obugolide lubhedu, nto leyo ephosakele kuba lulwaleko olukhuselayo kubhedu. Ke ngoko, kuyafuneka ukuba ubeke indawo enkulu yegolide kwibhodi yesekethe, eyinkqubo yokuntywiliselwa kwegolide endikufundise yona ngaphambili.

Okwesibini, ipleyiti yegolide

Igolide yigolide yokwenene. Nangona kuphela umaleko obhityileyo kakhulu, sele ubala malunga ne-10% yeendleko zebhodi yesekethe. E-Shenzhen, baninzi abarhwebi abaziingcali ekuthengeni iibhodi zeesekethe zenkunkuma. Bayakwazi ukuhlamba igolide ngeendlela ezithile, eyingeniso elungileyo.

Sebenzisa igolide njengomaleko wokutyabeka, enye kukwenza lula ukuwelda, kwaye enye kukuthintela ukubola. Nkqu nomnwe wegolide we memory stick oye wasetyenziswa iminyaka eliqela usadanyaza njengangaphambili. Ukuba ithusi, ialuminiyam, kunye nentsimbi bezisetyenziswa kwasekuqaleni, ngoku ziye zagqwala zibe yimfumba yezinto ezilahliweyo.

Umaleko owenziwe ngegolide usetyenziswa ngokubanzi kwiipads zecandelo, iminwe yegolide, kunye ne-srapnel yokudibanisa yebhodi yesekethe. Ukuba ufumanisa ukuba ibhodi yesiphaluka ngokwenene isilivere, ihamba ngaphandle kokutsho. Ukuba utsalela umnxeba umnxeba wamalungelo abathengi ngokuthe ngqo, umenzi kufuneka anqumle iikona, asilele ukusebenzisa imathiriyeli ngokufanelekileyo, kwaye asebenzise ezinye iintsimbi ukuqhatha abathengi. Iibhodi zemotherboard zezona bhodi zesekethe zesetyhula zisetyenziswa kakhulu ziibhodi ezityalwe ngegolide, iibhodi zegolide ezintywiliselweyo, iibhodi zekhompyuter, iibhodi zeaudio kunye neebhodi ezincinci zesekethe yedijithali azikho iibhodi ezityalwe ngegolide.

Iingenelo kunye nokungalunganga kwetekhnoloji yegolide yokuntywiliselwa akunzima ukuyizoba:

Izinto eziluncedo: Akulula ukuba i-oxidize, ingagcinwa ixesha elide, kwaye umphezulu uthambile, ulungele ukuwelda izikhonkwane ze-gap ezincinci kunye namacandelo anamalungu amancinci e-solder. Ukhetho lokuqala lweebhodi zePCB ezinamaqhosha (ezifana neebhodi zefowuni ephathwayo). I-reflow soldering inokuphinda iphindwe ngamaxesha amaninzi ngaphandle kokunciphisa ukuthengiswa kwayo. Ingasetyenziselwa njenge-substrate ye-COB (ChipOnBoard) yokudibanisa ucingo.

Ukungalungi: ixabiso eliphezulu, amandla amabi we-welding, kuba inkqubo ye-nickel ye-electroless plating isetyenzisiweyo, kulula ukuba nengxaki yediski emnyama. I-nickel layer iya ku-oxidize ngokuhamba kwexesha, kwaye ukuthembeka kwexesha elide kuyingxaki.

Ngoku siyazi ukuba igolide yigolide kwaye isilivere yisilivere? Kakade akunjalo, yitoti.

Ezintathu, ukutshiza ibhodi yesekethe yebhodi

Ibhodi yesilivere ibizwa ngokuba yibhodi yetoti yokutshiza. Ukutshiza umaleko wetoti kumaleko angaphandle wesekethe yobhedu nako kunokunceda ukuthambisa. Kodwa ayinakubonelela ngokuthembeka koqhagamshelwano lwexesha elide njengegolide. Ayinayo impembelelo kumacandelo athe athengiswa, kodwa ukuthembeka akwanelanga kwiipads eziye zavezwa emoyeni ixesha elide, njengamaplanga aphantsi kunye neepini. Ukusetyenziswa kwexesha elide kuxhomekeke kwi-oxidation kunye ne-corrosion, kubangele ukudibanisa kakubi. Ngokusisiseko isetyenziswe njengebhodi yesekethe yeemveliso ezincinci zedijithali, ngaphandle kokukhetha, ibhodi yetoti yokutshiza, isizathu kukuba sincinci.

Izinto eziluncedo kunye nezingeloncedo zishwankathelwa ngolu hlobo:

Izinto eziluncedo: ixabiso eliphantsi kunye nokusebenza kakuhle kwe-welding.

Ukungalungi: Ayizifanelanga izikhonkwane zokuwelda ezinezikhewu ezicolekileyo kunye namalungu amancinci kakhulu, kuba umphezulu othe tyaba wepleyiti yetoti yokutshiza ayilunganga. Amaso eSolder athambekele ekuvelisweni ngexesha lokusetyenzwa kwe-PCB, kwaye kulula ukubangela ukuba iisekethe ezimfutshane zibe yinxalenye yepitch entle. Xa isetyenziswe kwinkqubo ye-SMT emacala amabini, ngenxa yokuba icala lesibini liye lafumana i-soldering ephezulu yokushisa kwakhona, kulula kakhulu ukutshiza i-tin kunye nokunyibilika kwakhona, okubangela amaso e-tin okanye amaconsi afanayo achatshazelwa ngumxhuzulane kwi-tin engqukuva. amachaphaza, okuya kubangela ukuba umphezulu ube mandundu ngakumbi. Ukucaba kuchaphazela iingxaki ze-welding.

Phambi kokuthetha ngebhodi yesekethe ebomvu enexabiso eliphantsi, oko kukuthi, isibane se-thermoelectric separation substrate yobhedu.

Ezine, ibhodi yezandla ye-OSP

Ifilimu ye-solder ye-Organic. Kuba iyinto ephilayo, ingeyiyo intsimbi, inexabiso eliphantsi kunokutshiza ngetoti.

Izinto eziluncedo: Inazo zonke iingenelo zokuwelda ipleyiti yobhedu engenanto, kwaye ibhodi ephelelwe lixesha inokuphinda iphathwe ngomphezulu.

Izinto ezingalunganga: zichatshazelwa lula yi-asidi kunye nokufuma. Xa isetyenziswe kwi-soldering ye-reflow soldering, kufuneka igqitywe ngexesha elithile, kwaye ngokuqhelekileyo umphumo we-reflow soldering yesibini iya kuba yimbi. Ukuba ixesha lokugcinwa lidlula kwiinyanga ezintathu, kufuneka lihlaziywe. Kufuneka isetyenziswe kwiiyure ezingama-24 emva kokuvula iphakheji. I-OSP ngumaleko okhuselayo, ngoko ke indawo yokuvavanya kufuneka iprintwe nge-solder paste ukuze isuse umaleko we-OSP woqobo ngaphambi kokuba iqhagamshelane nendawo ye-pin yovavanyo lombane.

Umsebenzi kuphela wale filimu yezinto eziphilayo kukuqinisekisa ukuba i-foil yobhedu yangaphakathi ayiyi kuba yi-oxidized phambi kwe-welding. Lo maleko wefilimu uyaguquka ngokukhawuleza xa ufudunyezwa ngexesha le-welding. I-solder ingadibanisa ucingo lobhedu kunye namalungu kunye.

Kodwa ayixhathisi kumhlwa. Ukuba ibhodi yesekethe ye-OSP ibonakaliswe emoyeni iintsuku ezilishumi, izixhobo azikwazi ukuthungwa.

Iibhodi ezininzi zekhompyuter zisebenzisa ubuchwepheshe be-OSP. Ngenxa yokuba indawo yebhodi yesekethe inkulu kakhulu, ayinakusetyenziselwa ukufakwa kwegolide.