- 15
- Nov
PCB icinezela iingxaki eziqhelekileyo
PCB ukucinezela iingxaki eziqhelekileyo
1. Emhlophe, eveza ukuthungwa kwelaphu leglasi
ingxaki ibangela:
1. I-resin fluidity iphezulu kakhulu;
2. Uxinzelelo lwangaphambili luphezulu kakhulu;
3. Ixesha lokongeza uxinzelelo oluphezulu aluchanekanga;
4. Umxholo we-resin wephepha lokudibanisa liphantsi, ixesha le-gel lide, kwaye i-fluidity inkulu;
isisombululo:
1. Ukunciphisa ubushushu okanye uxinzelelo;
2. Ukunciphisa uxinzelelo lwangaphambili;
3. Qaphela ngokucophelela ukuhamba kwe-resin ngexesha le-lamination, emva kokutshintsha koxinzelelo kunye nokunyuka kweqondo lokushisa, lungisa ixesha lokuqala lokusebenzisa uxinzelelo oluphezulu;
4. Lungisa i-pre-pressure\ubushushu kunye nexesha lokuqala loxinzelelo oluphezulu;
Zimbini, zilephuza amagwebu, zilephuza amagwebu
ingxaki ibangela:
1. Uxinzelelo lwangaphambili luphantsi;
2. Ubushushu buphezulu kakhulu kwaye ikhefu phakathi koxinzelelo lwangaphambili kunye noxinzelelo olupheleleyo lide kakhulu;
3. I-viscosity eguquguqukayo ye-resin iphezulu, kwaye ixesha lokongeza uxinzelelo olupheleleyo lide kakhulu;
4. Umxholo oguquguqukayo uphezulu kakhulu;
5. Umphezulu wokudibanisa awucocekanga;
6. Ukungahambi kakuhle okanye ukungonelanga koxinzelelo lwangaphambili;
7. Ubushushu bebhodi buphantsi.
isisombululo:
1. Ukwandisa uxinzelelo lwangaphambili;
2. Ukupholisa phantsi, ukwandisa uxinzelelo lwangaphambili okanye unciphise umjikelo wangaphambi koxinzelelo;
3. Ijika lobudlelwane bexesha lomsebenzi kufuneka lithelekiswe ukwenza uxinzelelo, ubushushu kunye nolwelo zilungelelanise enye kwenye;
4. Ukunciphisa umjikelezo wangaphambili wokunyanzeliswa kunye nokunciphisa izinga lokunyuka kweqondo lokushisa, okanye ukunciphisa umxholo oguqukayo;
5. Ukuqinisa amandla okusebenza okucoca unyango.
6. Yandisa i-pre-pressure okanye utshintshe iphepha lokudibanisa.
7. Jonga umdlalo we-heater kwaye ulungelelanise ubushushu besitampu esishushu
3. Kukho imingxuma, i-resin kunye nemibimbi kumphezulu webhodi
ingxaki ibangela:
1. Ukusebenza okungafanelekanga kwe-LAY-UP, amabala amanzi ebusweni bentsimbi yensimbi engacinywanga yome, ebangela ukuba i-foil yobhedu idibanise;
2. Umphezulu webhodi ulahlekelwa uxinzelelo xa ucinezela ibhodi, ebangela ukulahleka kwe-resin engaphezulu, ukungabikho kweglue phantsi kwe-foil yobhedu, kunye nemibimbi phezu kwephepha lobhedu;
isisombululo:
1. Hlanza ngokucokisekileyo isitya sentsimbi kwaye ugubungele ubuso bephepha lobhedu;
2. Nika ingqalelo ukulungelelaniswa kwamacwecwe aphezulu nangaphantsi kunye namacwecwe xa ucwangcisa iiplate, ukunciphisa uxinzelelo lokusebenza, sebenzisa ifilimu ephantsi ye-RF%, unciphise ixesha lokuhamba kwe-resin kunye nokukhawuleza isantya sokufudumala;
Okwesine, utshintsho lwemizobo yomaleko wangaphakathi
ingxaki ibangela:
1. Iphethini yangaphakathi yefoyile yobhedu inamandla aphantsi okuxobuka okanye ukumelana nobushushu obuphantsi okanye ububanzi bomgca bubhityile kakhulu;
2. Uxinzelelo lwangaphambili luphezulu kakhulu; i-viscosity eguquguqukayo ye-resin incinci;
3. Itemplate ye-press ayihambelani;
isisombululo:
1. Tshintshela kwibhodi ye-foil-clad ekumgangatho ophezulu;
2. Nciphisa i-pre-pressure okanye utshintshe i-adhesive sheet;
3. Lungisa itemplate;
Isihlanu, ubukhulu obungalinganiyo, ukutyibilika komgangatho wangaphakathi
ingxaki ibangela:
1. Ubunzima obupheleleyo beplate yokubumba yefestile efanayo iyahluka;
2. Ukutenxa kobukhulu obuqokelelweyo bebhodi eprintiweyo kwibhodi yokwenza inkulu; i-parallelism ye-template ye-hot-pressing template ihlwempuzekile, ibhodi elaminethiweyo inokuhamba ngokukhululekileyo, kwaye i-stack yonke iphuma kwiziko le-template yokutshisa;
isisombululo:
1. Lungisa ubukhulu obufanayo bubonke;
2. Lungisa ubukhulu, khetha i-laminate ye-copper clad kunye nokuphambuka kobunzima obuncinci; ukulungelelanisa ukuhambelana kwebhodi yefilimu eshushu, ukunciphisa inkululeko yokuphendula ezininzi kwibhodi elaminethiweyo, kwaye uzame ukubeka i-laminate kwindawo ephakathi kwetemplate eshushu;
Isithandathu, ukuchithwa kwe-interlayer
ingxaki ibangela:
1. Ukwandiswa kwe-thermal ye-inner layer material kunye ne-resin flow of the bonding sheet;
2. Ukunciphisa ubushushu ngexesha lokuthambisa;
3. I-coefficient yokwandisa i-thermal yezinto eziphathekayo kunye nethemplate zihluke kakhulu.
isisombululo:
1. Lawula iimpawu zephepha lokunamathela;
2. Ipleyiti iphathwe ngobushushu kwangaphambili;
3. Sebenzisa umaleko wangaphakathi webhodi egqunywe ngobhedu kunye neshiti yokudibanisa kunye nokuzinza okuhle kwe-dimensional.
Isixhenxe, ipleyiti egobileyo, iplate warpage
ingxaki ibangela:
1. Ubume be-asymmetric;
2. Umjikelo ongonelanga wokunyanga;
3. Isalathiso sokusika ishidi lokudibanisa okanye i-laminate ye-copper yangaphakathi ayihambelani;
4. Ibhodi ye-multi-layer isebenzisa iiplate okanye ii-bonding sheets ezivela kubakhiqizi abahlukeneyo.
5. Ibhodi ye-multilayer iphathwa ngokungafanelekanga emva kokunyanga emva kokunyanga kunye nokukhulula uxinzelelo
isisombululo:
1. Zama ukuxinana koyilo lwe-wiring ye-symmetrical kunye nokubekwa ngokulinganayo kwamaphepha okudibanisa kwi-lamination;
2. Qinisekisa umjikelo wokunyanga;
3. Zama ukulandela umkhombandlela ongaguqukiyo wokusika.
4. Kuya kuba luncedo ukusebenzisa izinto eziveliswa ngumenzi ofanayo kwi-mold edibeneyo
5. Ibhodi ye-multilayer ifudunyezwa ngaphezu kwe-Tg phantsi koxinzelelo, kwaye igcinwe phantsi koxinzelelo kwaye ipholile ukuya ngaphantsi kweqondo lokushisa.
Isibhozo, i-stratification, i-stratification yobushushu
ingxaki ibangela:
1. Umswakama ophezulu okanye umxholo oguquguqukayo kwinqanaba elingaphakathi;
2. Umxholo oguquguqukayo ophezulu kwiphepha lokunamathela;
3. Ungcoliseko lomphezulu wangaphakathi; ukungcoliseka kwezinto zangaphandle;
4. Umphezulu we-oxide layer i-alkaline; kukho iintsalela zekloriti kumphezulu;
5. I-oxidation ayiqhelekanga, kwaye i-crystal layer oxide ide kakhulu; Unyango lwangaphambili aluzange lwenze indawo ephezulu ngokwaneleyo.
6. Intshukumo enganelanga
isisombululo:
1. Ngaphambi kwe-lamination, bhaka umaleko wangaphakathi ukususa umswakama;
2. Ukuphucula indawo yokugcina. I-adhesive sheet kufuneka isetyenziswe ngaphakathi kwemizuzu eyi-15 emva kokususwa kwindawo yokomisa i-vacuum;
3. Ukuphucula ukusebenza kwaye uthintele ukubamba indawo esebenzayo yendawo yokuhlangana;
4. Yomeleza ukucoca emva kokusebenza kwe-oxidation; ukujonga ixabiso le-PH yamanzi okucoca;
5. Nciphisa ixesha le-oxidation, lungisa ukuxinwa kwesisombululo se-oxidation okanye usebenze ubushushu, ukwandisa i-micro-etching, kwaye uphucule imeko yomhlaba.
6. Landela iimfuno zenkqubo