Uluhlu lwezizathu zokuhlwempuzeka PCB umaleko

1. Umngxuma wokuqhafaza

Imingxuma ye-pin ibangelwa i-hydrogen adsorbed phezu kwendawo edibeneyo, kwaye ayikhululwa ixesha elide. Yenza isisombululo se-plating singakwazi ukumanzisa umphezulu weendawo ezifakwe kwi-plating, ukwenzela ukuba i-plating layer ayikwazi ukufakwa kwi-electrolytically. Njengoko ubukhulu bengubo kwindawo ejikeleze i-hydrogen evolution point inyuka, i-pinhole yenziwa kwindawo ye-hydrogen evolution. Ibonakala ngomngxuma ongqukuva omenyezelayo kwaye ngamanye amaxesha ube nomsila omncinci oya phezulu. Xa isisombululo se-plating singenayo i-ejenti yokumanzisa kwaye ubuninzi bangoku buphezulu, i-pinholes yenziwa lula.

2. Pockmark

Umngxuma ubangelwa ngumphezulu ongacocekanga womphezulu ocandiweyo, ukufakwa kwezinto eziqinileyo, okanye ukunqunyanyiswa kwezinto eziqinileyo kwisisombululo sokucwenga. Xa ifikelela kumphezulu we-workpiece phantsi kwesenzo sentsimi yombane, i-adsorbed kuyo, echaphazela i-electrolysis kwaye ifake le nto eqinileyo kwi-Layer electroplating, ama-bumps amancinci (imigodi) yenziwa. Uphawu kukuba i-convex, ayikho into ekhanyayo, kwaye akukho milo ezinzileyo. Ngamafutshane, kubangelwa yi-workpiece engcolileyo kunye nesisombululo esingcolileyo se-plating.

3. Iindiza zomoya

I-air flow streaks ngenxa yezongezo ezigqithisileyo okanye i-cathode ephezulu yangoku okanye i-agent eyinkimbinkimbi ephezulu, enciphisa ukusebenza kwe-cathode yangoku, okubangelwa ubuninzi be-hydrogen evolution. Ukuba isisombululo se-plating sihamba ngokukhawuleza kwaye i-cathode ihamba ngokucothayo, igesi ye-hydrogen iya kuchaphazela ukulungelelaniswa kweekristale ze-electrolytic ngexesha lenkqubo yokunyuka ngokubhekiselele kumphezulu we-workpiece, ukwenza imivimbo yokuhamba kwegesi ephantsi ukuya phezulu.

4. Ukugquma (okuveziweyo)

I-Masking ibangelwa ukuba i-flash ethambileyo kwiikhonkwane eziphezu kwendawo yokusebenza ayizange isuswe, kwaye i-electrolytic deposition coating ayikwazi ukuqhutyelwa apha. Isiseko sezinto ezibonakalayo sibonakala emva kwe-electroplating, ngoko kuthiwa ibonakaliswe (kuba i-flash ethambileyo yinto eguquguqukayo okanye ecacileyo ye-resin component).

5. Ukwaleka kubhityile

Emva kwe-SMD electroplating, emva kokusika iimbambo kunye nokuqulunqa, kunokubonwa ukuba kukho ukuqhekeka kwiindawo zokugoba izikhonkwane. Xa kukho ukuqhekeka phakathi kwe-nickel layer kunye ne-substrate, kugwetywa ukuba i-nickel layer is brittle. Xa kukho ukuqhekeka phakathi kwe-tin layer kunye ne-nickel layer, kugwetywa ukuba i-tin layer i-brittle. Unobangela wobuqhophololo ubukhulu becala zizongezo, ukuqaqamba okugqithisileyo, okanye ukungcola okuninzi kwe-inorganic okanye kwe-organic kwisisombululo seplating.