Inqaku le-MARKO yindawo yokuchonga indawo kumatshini wokubeka ngokuzenzekelayo osetyenziswa yi-PCB kuyilo, kwaye ikwabizwa ngokuba yindawo yesalathiso. Idayamitha yi-1MM. Inqaku lamanqaku estencil yindawo yokuchonga indawo xa i-PCB iprintwa nge-solder paste / iglue ebomvu kwinkqubo yokubekwa kwebhodi yesekethe. Ukukhethwa kwamanqaku e-Mark kuchaphazela ngqo impumelelo yoshicilelo lwestencil kwaye iqinisekisa ukuba izixhobo ze-SMT zinokubeka kwindawo echanekileyo. Ibhodi PCB amacandelo. Ngoko ke, inqaku elithi MARK libaluleke kakhulu kwimveliso ye-SMT.

① Inqaku le-MAK: Izixhobo zokuvelisa ze-SMT zisebenzisa le nqaku ukuze zifumane indawo yebhodi yePCB ngokuzenzekelayo, ekufuneka iyilwe xa kuyilwa ibhodi yePCB. Ngaphandle koko, kunzima ukuvelisa i-SMT, okanye akunakwenzeka ukuyivelisa.

1. Kunconywa ukuyila inqaku le-MARKO njengesangqa okanye isikwere esihambelana nomda webhodi. Isangqa sesona silungileyo. Idayamitha yenqaku lesetyhula MARK ngokubanzi yi-1.0mm, 1.5mm, 2.0mm. Kunconywa ukuba ububanzi boyilo lwe-MARK point yi-1.0mm. Ukuba ubungakanani buncinci kakhulu, amachaphaza e-MARKO aveliswe ngabavelisi be-PCB awasicaba, amachaphaza e-MARKO awaqatshelwa lula ngumatshini okanye ukuchaneka kokuqaphela kubi, okuya kuchaphazela ukuchaneka kwamacandelo okushicilela kunye nokubeka. Ukuba inkulu kakhulu, iyakugqitha ubungakanani befestile evunyiweyo ngumatshini, ngakumbi umshicileli wescreen we DEK) ;

2. Indawo yenqaku MARK ngokuqhelekileyo iyilwe kwikona echaseneyo yebhodi yePCB. Inqaku le-MARKO kufuneka libe ubuncinane be-5mm kude nomda webhodi, ngaphandle koko inqaku le-MARKO liya kunyanzeliswa lula ngumatshini wokudibanisa umatshini, okwenza ukuba ikhamera yomatshini ingaphumeleli ukubamba inqaku le-MARKO;

3. Zama ukuba ungayiyi indawo yenqaku le-MARKO ukuze lilingane. Injongo ephambili kukuthintela ukungakhathali komsebenzisi kwinkqubo yokuvelisa ekubangeleni i-PCB ukuba iguqulwe, kubangele ukubekwa okungalunganga komatshini kunye nokulahlekelwa kwemveliso;

4. Ungabi namanqaku okuvavanya afanayo okanye iipads kwindawo ubuncinane ubuncinane be-5mm malunga nenqaku le-MARKO, ngaphandle koko, umatshini uya kuchaza ngokungafanelekanga inqaku le-MARKO, eliya kubangela ukulahlekelwa kwimveliso;

② Indawo ngokuyilwa: Ukungachanekanga ngoyilo kuya kubangela inkonkxa encinci okanye i-solder engenanto kwi-SMT yemveliso yokuwelda, eya kuchaphazela ngokunzulu ukuthembeka kwemveliso. Kucetyiswa ukuba abayili abayili kwiipads xa kuyilwa vias. Xa umngxuma odlulayo uyilwe ukujikeleza iphedi, kucetyiswa ukuba udini lomngxuma odlulayo kunye nomphetho wephedi ojikeleze isichasi esiqhelekileyo, i-capacitor, inductance, kunye ne-bead bead pad kufuneka igcinwe ubuncinci be-0.15mm okanye ngaphezulu. Ezinye ii-ICs, ii-SOTs, ii-inductors ezinkulu, i-electrolytic capacitors, njl njl. Imiphetho ye-vias kunye neepads ezijikeleze iipads ze-diode, izihlanganisi, njl. zigcinwa ubuncinane be-0.5mm okanye ngaphezulu (kuba ubungakanani bala macandelo buya kwandiswa xa i-pads idibene istencil yenzelwe) ukuthintela intlama ye-solder ekulahlekeni nge-vias xa amacandelo ephinda ehanjiswa;

③ Xa uyila isekethe, nikela ingqalelo kububanzi besekethe edibanisa i-pad ukuba ingagqithisi ububanzi be-pad, ngaphandle koko, amanye amacandelo e-fine-pitch alula ukudityaniswa okanye ukuthengiswa kunye nokuthotywa kancinci. Xa izikhonkwane ezikufutshane zamacandelo e-IC zisetyenziselwa ukuhla, kucetyiswa ukuba abaqulunqi bangabaqulunqi kwi-pad enkulu, ukwenzela ukuba ukuyila kwe-SMT soldering akulula ukulawula;

Ngenxa yoluhlu olubanzi lwamacandelo, kuphela iipadi zeesayizi zamacandelo amaninzi asemgangathweni kunye namanye amacandelo angekho semgangathweni alawulwayo ngoku. Kumsebenzi wexesha elizayo, siya kuqhubeka ukwenza le nxalenye yomsebenzi, uyilo lwenkonzo kunye nokuvelisa, ukuze sifezekise ukwaneliseka komntu wonke. .