I. Intshayelelo

Iindlela zokunciphisa ukuphazamiseka kwi Ibhodi PCB zezi:

1. Nciphisa indawo yendlela yokwahlula isiginali yelophu.

2. Nciphisa imbuyekezo yengxolo ephezulu (ukucoca, ukwahlula kunye nokutshatisa).

3. Ukunciphisa i-voltage yemodi eqhelekileyo (uyilo lokumisa). Imigaqo ye-47 ye-PCB ekhawulezayo yoyilo lwe-EMC II. Isishwankathelo semigaqo yoyilo lwePCB

Umgaqo 1: I-PCB clock frequency idlula i-5MHZ okanye ixesha lokunyuka kwesignali lingaphantsi kwe-5ns, ngokubanzi kufuneka isebenzise idizayini yebhodi ye-multi-layer.

Isizathu: Indawo yesiginali yesignali inokulawulwa kakuhle ngokwamkela uyilo lwebhodi enemigangatho emininzi.

UmGaqo wesi-2: Kwiibhodi ezinomaleko amaninzi, iileya zocingo ezingundoqo (iileya apho imigca yewotshi, iibhasi, imigca yesignali yojongano, imigca yerediyo yefrikhwensi, ukuseta kwakhona imigca yesignali, itshiphu yokukhetha imigca yesignali, kunye nemigca yemiqondiso eyahlukeneyo yolawulo ibekwe khona) kufuneka ibe kufuphi. ukuya kumhlaba opheleleyo. Ngokukhethekileyo phakathi kweenqwelomoya ezimbini zomhlaba.

Isizathu: Imigca yemiqondiso engundoqo idla ngokuba yimitha yemitha eyomeleleyo okanye imigca yemiqondiso ebuthathaka kakhulu. Iingcingo ezikufutshane nenqwelomoya esemhlabeni zinokunciphisa indawo yeluphu yomqondiso, ukunciphisa ubushushu bemitha okanye ukuphucula isakhono sokuchasana nokuphazamiseka.

Umgaqo wesi-3: Kwiibhodi zomgca omnye, macala omabini emigca yeempawu eziphambili kufuneka agqunywe ngomhlaba.

Isizathu: Isiginali ephambili igutyungelwe ngumhlaba kumacala omabini, kwelinye icala, inokunciphisa indawo yelophu yesiginali, kwaye kwelinye icala, inokuthintela ukuphambana phakathi komgca wesiginali kunye neminye imigca yesiginali.

Umgaqo-4: Kwibhodi ephindwe kabini, indawo enkulu yomhlaba kufuneka ibekwe kwiplani yokubonisa umgca wesignali engundoqo, okanye ifana nebhodi enye.

Isizathu: ngokufanayo naloo mqondiso obalulekileyo webhodi ye-multilayer isondele kwi-plane yomhlaba.

Umgaqo wesi-5: Kwibhodi ye-multilayer, indiza yamandla kufuneka ihoxiswe yi-5H-20H ngokumalunga nendiza yayo ephantsi komhlaba (H ngumgama phakathi kokunikezelwa kwamandla kunye nendiza yomhlaba).

Reason: The indentation of the power plane relative to its return ground plane can effectively suppress the edge radiation problem.

Principle 6: The projection plane of the wiring layer should be in the area of ​​the reflow plane layer.

Isizathu: Ukuba umaleko we-wiring awukho kwindawo yentelekelelo yomaleko wenqwelomoya, iya kubangela iingxaki zemitha yemitha kwaye yandise indawo ye-loop yomqondiso, okukhokelela ekonyukeni kwemowudi yokwahluka kwemitha.

Umgaqo we-7: Kwiibhodi ezininzi zeebhodi, akufanele kubekho imigca yesignali enkulu kune-50MHZ kwi-TOP kunye ne-BOTTOM yebhodi enye. Isizathu: Kungcono ukuhamba umqondiso wefrikhwensi ephezulu phakathi kweengqimba ezimbini zenqwelomoya ukucinezela imitha yayo esithubeni.

Umgaqo wesi-8: Kwiibhodi ezizimeleyo ezinezinga lebhodi elisebenza ngokuphindaphindiweyo ngaphezu kwe-50MHz, ukuba uluhlu lwesibini kunye noluhlu lwe-penultimate luyi-wiring layers, i-Top kunye ne-Boottom layers kufuneka igqunywe nge-foil yobhedu ephantsi.

Isizathu: Kungcono ukuhamba umqondiso wefrikhwensi ephezulu phakathi kweengqimba ezimbini zenqwelomoya ukucinezela imitha yayo esithubeni.

Principle 9: In a multilayer board, the main working power plane (the most widely used power plane) of the single board should be in close proximity to its ground plane.

Isizathu: Inqwelomoya yamandla ekufutshane kunye nenqwelomoya ephantsi komhlaba inokunciphisa ngokufanelekileyo indawo ye-loop yesekethe yamandla.

Principle 10: In a single-layer board, there must be a ground wire next to and parallel to the power trace.

Isizathu: ukunciphisa indawo yonikezelo lwamandla loop yangoku.

Umgaqo we-11: Kwibhodi ye-double-layer, kufuneka kubekho ucingo olusezantsi ecaleni kunye nokuhambelana nomkhondo wamandla.

Isizathu: ukunciphisa indawo yonikezelo lwamandla loop yangoku.

Umgaqo we-12: Kuyilo olunemaleko, zama ukunqanda iileya zocingo ezikufutshane. Ukuba kungenakuphepheka ukuba iileyile ze-wiring zisondele komnye nomnye, isithuba soluhlu phakathi kwee-wire layers kufuneka sandiswe ngokufanelekileyo, kwaye umgca we-wire layer phakathi kwe-wiring layer kunye ne-signal circuit kufuneka incitshiswe.

Isizathu: Izalathisi zesignali ezinxuseneyo kumaleko eentambo ezikufutshane zinokubangela umqondiso we-crosstalk.

Umgaqo we-13: Imigangatho yenqwelomoya emeleneyo kufuneka ithintele ukugqithelana kwiinqwelo-moya zabo ezibonisayo.

Isizathu: Xa iingqikelelo ziwelana, amandla okudibanisa phakathi kwamaleko aya kubangela ingxolo phakathi kweeleya ukuba zidibanise enye kwenye.

Umgaqo 14: Xa uyila uyilo lwePCB, jonga ngokupheleleyo umgaqo woyilo wokubeka kumgca othe tye ecaleni komqondiso wokuhamba komqondiso, kwaye uzame ukunqanda ukujikeleza emva naphambili.

Isizathu: Gwema ukudibanisa umqondiso ngokuthe ngqo kwaye uchaphazele umgangatho wesignali.

Umgaqo 15: Xa iisekethe zemodyuli ezininzi zibekwe kwi-PCB enye, iisekethe zedijithali kunye neesekethe ze-analog, kunye neesekethe eziphezulu kunye nesantya esiphantsi kufuneka zibekwe ngokwahlukileyo.

Isizathu: Kuphephe ukuphazamisana phakathi kweesekethe zedijithali, iisekethe ze-analog, iisekethe ezinesantya esiphezulu, kunye neesekethe ezinesantya esiphantsi.

Umgaqo-16: Xa kukho iisekethe eziphezulu, eziphakathi, kunye nesantya esiphantsi kwibhodi yesekethe ngexesha elifanayo, landela iisekethe eziphezulu kunye ne-medium-speed circuits kwaye uhlale kude ne-interface.

Isizathu: Gwema ingxolo yesekethe ye-high-frequency ukusuka kwi-radiation ukuya ngaphandle ngokusebenzisa ujongano.

Umgaqo we-17: Ukugcinwa kwamandla kunye ne-high-frequency filter capacitors kufuneka zibekwe kufuphi neesekethe zeeyunithi okanye izixhobo ezinotshintsho olukhulu lwangoku (njengeemodyuli zokubonelela ngombane: ii-terminals input and output output, fans and relays).

Isizathu: Ubukho bee-capacitors zokugcina amandla kunokunciphisa indawo ye-loop enkulu yangoku.

Umgaqo we-18: Isiphaluka sokucoca i-port yegalelo lamandla ebhodini yesekethe kufuneka ibekwe kufuphi ne-interface. Isizathu: ukuthintela umgca ohluziweyo ekubeni udityaniswe kwakhona.

Umgaqo we-19: Kwi-PCB, ukuhluza, ukukhuselwa kunye nokwahlulwa kwamacandelo esekethe ye-interface kufuneka ibekwe kufuphi ne-interface.

Isizathu: Inokuphumeza ngokufanelekileyo imiphumo yokukhusela, ukuhluza kunye nokuzihlukanisa.

Umgaqo we-20: Ukuba kukho zombini isihluzo kunye nesiphaluka sokukhusela kwi-interface, umgaqo wokukhusela kuqala kunye nokucoca kufuneka kulandelwe.

Isizathu: Isekethe yokukhusela isetyenziselwa ukucinezela i-overvoltage yangaphandle kunye ne-overcurrent. Ukuba isiphaluka sokukhusela sibekwe emva kwesiphaluka sokucoca, isiphaluka sokucoca siya konakaliswa ngokugqithisa kunye nokugqithisa.