1. PCB unyango lomhlaba:

I-Anti-oxidation, i-tin spray, i-lead-free tin spray, igolide yokuntywiliselwa, i-tin yokuntywiliselwa, isilivere yokuntywiliselwa, i-hard gold plating, ibhodi egcweleyo yegolide, umnwe wegolide, i-nickel palladium yegolide ye-OSP: ixabiso eliphantsi, ukuthengiswa okulungileyo, iimeko zokugcina ezinzima, ixesha. Itekhnoloji emfutshane, ehambelana nokusingqongileyo, i-welding elungileyo kunye negudileyo.

Itoti yokutshiza: Ipleyiti yenkcenkce yesitshizi ngokuqhelekileyo iyi-multilayer (i-4-46 layer) imodeli ye-PCB echanekileyo ephezulu, esetyenziswe ngonxibelelwano olukhulu lwasekhaya, ikhompyutha, izixhobo zonyango kunye namashishini e-aerospace kunye neeyunithi zophando. Umnwe wegolide (ukudibanisa umnwe) yinxalenye yokudibanisa phakathi kwebha yememori kunye ne-slot yememori, zonke iimpawu zihanjiswa ngeminwe yegolide.

Umnwe wegolide wenziwa ngonxibelelwano lwegolide olutyheli oluninzi. Ngenxa yokuba ubuso bubekwe ngegolide kwaye i-conductive contacts ihlelwe njengeminwe, ibizwa ngokuba “ngomnwe wegolide”.

Umnwe wegolide eneneni ugqunywe ngomqolo wegolide kwibhodi egqunywe ngobhedu ngenkqubo ekhethekileyo, kuba igolide ixhathisa ngokugqithisileyo kwi-oxidation kwaye ine-conductivity eyomeleleyo.

Nangona kunjalo, ngenxa yexabiso eliphezulu legolide, ininzi yememori ngoku ithathelwe indawo yi-tin plating. Ukususela kwiminyaka yee-1990, izinto ze-tin zithandwa kakhulu. Okwangoku, “iminwe yegolide” yeebhodi ze-motherboard, imemori kunye namakhadi emizobo phantse zonke zisetyenziswa. Izinto ze-tin, kuphela inxalenye yeendawo zoqhagamshelwano zeeseva ezisebenza kakhulu / iindawo zokusebenza ziya kuqhubeka zifakwe ngegolide, ezibiza ngokwemvelo.

2. Kutheni sebenzisa iipleyiti ezinegolide

Njengoko inqanaba lokudityaniswa kwe-IC liba phezulu kwaye liphezulu, izikhonkwane ze-IC ziba zixinene ngakumbi. Inkqubo ye-tin yokutshiza ethe nkqo inzima ukuthambisa iipads ezincinci, ezizisa ubunzima ekubekweni kwe-SMT; ukongeza, ubomi beshelufu yepleyiti yetoti yokutshiza bufutshane kakhulu.

Ibhodi etyatyekwe ngegolide isombulula ezi ngxaki:

1. Kwinkqubo yokunyuswa komphezulu, ngakumbi kwi-0603 kunye ne-0402 i-ultra-small surface mounts, ngenxa yokuba i-flatness ye-pad ihambelana ngokuthe ngqo nomgangatho wenkqubo yokushicilela i-solder paste, inempembelelo eqinisekileyo kumgangatho wokuphindaphinda okulandelayo. i-soldering, ngoko ibhodi yonke i-Gold plating ixhaphake kwiinkqubo eziphezulu zoxinaniso kunye ne-ultra-encinci.

2. Kwinqanaba lokuveliswa kwetyala, ngenxa yezinto ezifana nokuthengwa kwecandelo, ngokuqhelekileyo kungekhona ukuba ibhodi ithengiswa ngokukhawuleza xa ifika, kodwa isetyenziswa rhoqo kwiiveki eziliqela okanye kwiinyanga. Ubomi beshelufu yebhodi egqitywe ngegolide bungcono kunolothe. I-Tin alloy inde amaxesha amaninzi, ngoko ke wonke umntu uyakuvuyela ukuyisebenzisa.

Ngaphandle koko, ixabiso le-PCB efakwe ngegolide kwinqanaba lesampulu liphantse lilingane naleyo yebhodi ye-lead-tin alloy board.

Kodwa njengoko i-wiring iba nzima, ububanzi bomgca kunye nesithuba sifikelele kwi-3-4MIL.

Ngoko ke, ingxaki yocingo olufutshane lwegolide luziswa: njengoko ukuphindaphinda komqondiso kuba phezulu nangaphezulu, ukuhanjiswa komqondiso kwi-multi-plated layer okubangelwa yimpembelelo yesikhumba kunempembelelo ecacileyo ngakumbi kumgangatho wesignali.

Umphumo wesikhumba ubhekiselele kwi: i-high frequency alternating current, i-current iya kuthanda ukugxila kumphezulu wocingo ukuba uhambe. Ngokwezibalo, ubunzulu besikhumba buhambelana nokuphindaphinda.

Ukwenzela ukusombulula ezi ngxaki zingentla zeebhodi ezityatyekwe ngegolide, iiPCB zisebenzisa iibhodi ezityatyekwe ngegolide ikakhulu zinezi mpawu zilandelayo:

1. Ngenxa yokuba ulwakhiwo lwekristale olwenziwe ngokuntywiliselwa kwegolide kunye nokufakwa kwegolide lwahlukile, ukuntywiliselwa kwegolide kuya kuba tyheli ngegolide kunokwalekwa kwegolide, kwaye abathengi baya kwaneliseka ngakumbi.

2. Ukuntywiliselwa kwegolide kulula ukuwelda kunegolide, kwaye akuyi kubangela ukuwelda kakubi kwaye kubangele izikhalazo zabathengi.

3. Ngenxa yokuba ibhodi yegolide yokucwiliswa ine-nickel kunye negolide kuphela kwi-pad, ukuhanjiswa komqondiso kwimpembelelo yesikhumba akuyi kuchaphazela umqondiso kumgangatho wobhedu.

4. Ngenxa yokuba igolide yokuntywiliselwa inokwakheka kwekristale exineneyo kuneyokucwecwa kwegolide, akukho lula ukuvelisa i-oxidation.

5. Ngenxa yokuba ibhodi yegolide yokuntywiliselwa ine-nickel kunye negolide kuphela kwiipads, ayiyi kuvelisa iingcingo zegolide kwaye ibangele ubufutshane obuncinci.

6. Ngenxa yokuba ibhodi yegolide yokuntywiliselwa ine-nickel kunye negolide kuphela kwi-pads, imaski ye-solder kwisekethe kunye ne-copper layer iboshwe ngokuqinileyo.

7. Iprojekthi ayisayi kuchaphazela umgama xa kusenziwa imbuyekezo.

8. Ngenxa yokuba i-crystal structure eyenziwe ngokucwiliswa kwegolide kunye negolide yegolide yahlukile, uxinzelelo lwe-plate yegolide yokucwiliswa kulula ukulawula, kunye neemveliso ezinobumbano, zilungele ngakumbi ukuqhutyelwa kwe-bonding. Kwangaxeshanye, kungenxa yokuba igolide yokuntywiliselwa ithambile ngakumbi kune-gilding, ngoko ke ipleyiti yegolide yokuntywiliselwa ayixhathisi njengomnwe wegolide.

9. Umcaba kunye nobomi bebhodi yegolide entywiliselwayo ilungile njengebhodi ehonjiswe ngegolide.

Kwinkqubo ye-gilding, isiphumo se-tinning siyancipha kakhulu, ngelixa i-tinning effect yegolide yokuntywiliselwa ingcono; Ngaphandle kokuba umenzi ufuna ukubophelela, uninzi lwabavelisi ngoku baya kukhetha inkqubo yokuntywiliselwa kwegolide, eqheleke ngokubanzi Phantsi kweemeko, unyango lomphezulu we-PCB ngolu hlobo lulandelayo:

Ukufakwa kwegolide (igolide ye-electroplating, igolide yokucwiliswa), isilivere yesilivere, i-OSP, ukutshiza ngetoti (i-lead kunye ne-lead-free).

Ezi ntlobo ikakhulu ze-FR-4 okanye i-CEM-3 kunye nezinye iibhodi. Isiseko sephepha lezinto kunye nendlela yonyango yomgangatho we-rosin coating; ukuba i-tin ayilungile (i-tin embi yokutya), ukuba i-solder paste kunye nabanye abavelisi be-patch ababandakanywanga Ngenxa yezizathu zemveliso kunye nobuchwepheshe bezinto eziphathekayo.

Nantsi kuphela ingxaki yePCB, kukho ezi zizathu zilandelayo:

1. Ngexesha le-PCB yokushicilela, ingaba kukho i-oil-permeable surface film kwi-PAN isikhundla, enokuthintela umphumo we-tinning; oku kunokuqinisekiswa ngovavanyo lokuxutywa kwetoti.

2. Ingaba indawo ye-lubrication ye-PAN ihlangabezana neemfuno zokuyila, oko kukuthi, ingaba umsebenzi wokuxhasa inxalenye unokuqinisekiswa ngexesha loyilo lwepad.

3. Ingaba i-pad ingcolisekile, oku kunokufunyanwa ngovavanyo longcoliseko lwe-ion; la manqaku mathathu angasentla yimiba engundoqo eqwalaselwa ngabavelisi bePCB.

Ngokuphathelele iingenelo kunye nokungalunganga kweendlela ezininzi zonyango olungaphezulu, nganye inamandla kunye nobuthathaka bayo!

Ngokubhekiselele kwi-plating yegolide, inokugcina ii-PCBs ixesha elide, kwaye ixhomekeke kutshintsho oluncinci kwiqondo lokushisa kunye nokufuma kwendawo yangaphandle (xa kuthelekiswa nolunye unyango oluphezulu), kwaye ngokubanzi inokugcinwa malunga nonyaka omnye; unyango lomphezulu olutshizwe ngetoti ngowesibini, i-OSP kwakhona, oku Ingqwalasela eninzi kufuneka ihlawulwe kwixesha logcino lwezonyango ezimbini zomphezulu kwiqondo lobushushu kunye nokufuma.

Ngaphantsi kweemeko eziqhelekileyo, unyango oluphezulu lwesilivere yokucwiliswa luhluke kancinci, ixabiso liphezulu, kwaye iimeko zokugcina zifuna kakhulu, ngoko kufuneka zifakwe kwiphepha elingenaso sulfure! Kwaye ixesha lokugcina malunga neenyanga ezintathu! Ngokwefuthe le-tinning, igolide yokuntywiliselwa, i-OSP, ukutshiza ngetoti, njl.njl. ziyafana, kwaye abavelisi ikakhulu bajonga ukusebenza kakuhle kweendleko!