Yintoni ibhodi yePCB yeHDI (High Density Interconnect)?

Uxinaniso oluphezulu lwe-Interconnect (HDI) PCB, luhlobo lwemveliso yebhodi yesekethe eprintiweyo (iteknoloji), ukusetyenziswa komngxuma ongaboniyo, ubugcisa bomngxuma ongcwatywe, ibhodi yesekethe enoxinzelelo oluphezulu lokuhambisa. Ngenxa yophuhliso oluqhubekayo lwetekhnoloji yeemfuno zombane zesantya esiphezulu, ibhodi yesekethe kufuneka ibonelele ngolawulo lwe-impedance kunye neempawu ze-ac, amandla okuhambisa amaza, ukunciphisa imisebe engadingekile (EMI) njalo njalo. Ukusebenzisa i-Stripline, i-Microstrip isakhiwo, uyilo lwe-multi-layer luba yimfuneko. Ukuze kuncitshiswe ingxaki yomgangatho wokuhanjiswa komqondiso, i-insulation material ene-coefficient ephantsi ye-dielectric kunye nezinga lokunciphisa eliphantsi liya kwamkelwa. Ukuze kuhambelane ne-miniaturization kunye noluhlu lwamacandelo e-elektroniki, ukuxinana kwebhodi yesekethe kuya kwandiswa ngokuqhubekayo ukuhlangabezana nemfuno.

HDI (high density interconnection) ibhodi yesekethe ngokuqhelekileyo ibandakanya laser blind umngxuma kunye mechanical blind hole;
Ngokubanzi ngomngxuma ongcwatyiweyo, umngxuma oyimfama, umngxuma owelanayo, umngxuma ogxadazelayo, umngxuma ongcwatyiweyo onqamlezileyo, ngomngxuma, umngxuma oyimfama wokugcwalisa i-electroplating, umgca obhityileyo umsantsa omncinci, i-microhole yepleyiti kunye nezinye iinkqubo zokufezekisa ukuqhutywa phakathi kwamaleko angaphakathi nangaphandle, ngokuqhelekileyo angaboniyo. Idayamitha engcwatyiweyo ayikho ngaphezulu kwe-6mil.

HDI ibhodi yesekethe yahlulwe eziliqela kunye naluphi na uqhagamshelwano umaleko

Isakhiwo se-HDI somyalelo wokuqala: 1+N+1 (ucofa kabini, i-laser kanye)

Isakhiwo se-HDI sesibini: 2 + N + 2 (ucinezela amaxesha e-3, i-laser ngamaxesha angama-2)

Umyalelo wesithathu wesakhiwo se-HDI: 3 + N + 3 (ucinezela amaxesha e-4, i-laser 3 amaxesha)Umyalelo wesine

Ubume be-HDI: 4 + N + 4 (ucinezela amaxesha ama-5, i-laser 4 amaxesha)

Kwaye nayiphi na i-HDI