Kwi-PCB, i-nickel isetyenziswa njenge-substrate yokwambathisa yeentsimbi ezixabisekileyo kunye nesiseko. Kwangaxeshanye, kwezinye iibhodi eziprintiweyo ezinecala elinye, i-nickel ikwasetyenziswa ngokuqhelekileyo njengomaleko womphezulu. Okulandelayo, ndiza ukwabelana nawe amacandelo PCB isisombululo se-nickel plating

1. Ityuwa ephambili: i-nickel sulfamate kunye ne-nickel sulfate zezona tyuwa ziphambili kuzo isisombululo se-nickel, ebonelela ikakhulu i-ion yensimbi ye-nickel efunekayo kwi-nickel plating kwaye ikwadlala indima yetyuwa eqhubayo. Ngomxholo ophezulu wetyuwa we-nickel, ubuninzi be-cathode yangoku bunokusetyenziswa, kwaye isantya sokubeka sikhawuleza. Iqhele ukusetyenziswa kwi-high-speed high-speed thick nickel plating. Isiqulatho setyuwa yenickel esezantsi sikhokelela kwisantya esisezantsi sokubekelwa, kodwa isakhono sokusasazeka sihle kakhulu, kwaye iicoleji ezicolekileyo neziqaqambileyo zekristale zinokufumaneka.

2. Isithinteli: i-boric acid isetyenziswa njenge-buffer ukugcina ixabiso le-pH lesisombululo se-nickel plating ngaphakathi koluhlu oluthile. I-asidi ye-boric ayinayo kuphela umsebenzi we-pH buffer, kodwa inokuphucula i-cathodic polarization, ukwenzela ukuba kuphuculwe ukusebenza kokuhlamba.

3. I-Anode activator: i-nickel anode kulula ukuyigqithisa ngexesha lombane. Ukuqinisekisa ukuchithwa okuqhelekileyo kwe-anode, umlinganiselo othile we-anode activator yongezwa kwisisombululo seplating.

4. I-additive: inxalenye ephambili yesongezo yi-arhente yokunciphisa uxinzelelo. Izongezo ezisetyenziswa ngokuqhelekileyo ziyi-naphthalene sulfonic acid, p-toluenesulfonamide, saccharin, njl.

5. I-agent yokumanzisa: ukwenzela ukunciphisa okanye ukuthintela ukuveliswa kwe-pinholes, i-agent encinci yokumanzi kufuneka ifakwe kwisisombululo se-plating, njenge-sodium dodecyl sulfate, i-sodium diethylhexyl sulfate, i-sodium octyl sulfate, njl.