Inkcazo eyisiseko yebhodi yesekethe

Okokuqala – IiMfuneko zezithuba zePCB

1. Isithuba phakathi kwee-conductor: ubuncinci besithuba somgca sikwangumgca ukuya kumgca, kwaye umgama phakathi kwemigca kunye neepads awuyi kuba ngaphantsi kwe-4MIL. Ngokwembono yemveliso, inkulu iba ngcono ukuba iimeko zivuma. Ngokubanzi, i-10 MIL iqhelekile.
2. Idayamitha yomngxuma wePad kunye nobubanzi bepad: ngokwemeko yomenzi we-PCB, ukuba i-pad hole idiameter igrunjwa ngoomatshini, ubuncinci abuyi kuba ngaphantsi kwe-0.2mm; Ukuba i-laser drilling isetyenzisiwe, ubuncinci abuyi kuba ngaphantsi kwe-4mil. Ukunyamezelana kwedayamitha yomngxuma kuhluke kancinane ngokweepleyiti ezahlukeneyo, kwaye kunokulawulwa ngaphakathi kwe-0.05mm ngokubanzi; Ubuncinane bephedi ububanzi abuyi kuba ngaphantsi kwe-0.2mm.
3. Isithuba phakathi kweepads: Ngokomthamo wokusetyenzwa kwabavelisi bePCB, isithuba asiyi kuba ngaphantsi kwe-0.2MM. 4. Umgama phakathi kwephepha lobhedu kunye nomphetho weplate kufuneka ube ngaphantsi kwe-0.3mm. Kwimeko yokubeka ubhedu kwindawo enkulu, ngokuqhelekileyo kukho umgama wangaphakathi ukusuka kumphetho wepleyiti, obekwe ngokubanzi njenge-20mil.

– Umgama ongakhuselekanga wombane

1. Ububanzi, ubude kunye nesithuba soonobumba: Kumagama aprintiweyo kwisikrini sesilika, amaxabiso aqhelekileyo afana no-5/30 kunye no-6/36 MIL asetyenziswa ngokubanzi. Kuba xa okubhaliweyo kukuncinci kakhulu, ukusetyenzwa nokushicilela kuya kuba mfiliba.
2. Umgama ukusuka kwisikrini sesilika ukuya kwiphedi: isikrini sesilika asivumelekanga ukufaka i-pad. Kuba ukuba i-solder pad igutyungelwe ngesikrini sesilika, isikrini sesilika asikwazi ukugqunywa ngetoti, echaphazela ukuhlanganiswa kwamacandelo. Ngokubanzi, umenzi wePCB ufuna ukugcina indawo eyi-8mil. Ukuba indawo yezinye iibhodi zePCB isondele kakhulu, isithuba se-4MIL samkelekile. Ukuba isikrini sesilika ngempazamo sigqume iphedi yokudibanisa ngexesha loyilo, umenzi we-PCB uya kuphelisa ngokuzenzekelayo isikrini sesilika esishiywe kwi-bonding pad ngexesha lokwenziwa ukuqinisekisa i-tin kwi-bonding pad.
3. Ubude be-3D kunye nesithuba esithe tye kwisakhiwo soomatshini: Xa ufaka izinto kwi-PCB, qwalasela ukuba isalathiso esithe tye kunye nokuphakama kwendawo kuya kungquzulana nezinye izakhiwo zoomatshini. Ngoko ke, ngexesha loyilo, kuyimfuneko ukuqwalasela ngokupheleleyo ukulungelelaniswa kwesakhiwo sendawo phakathi kwamacandelo, kunye naphakathi kwePCB egqityiweyo kunye neqokobhe lemveliso, kwaye ugcine indawo ekhuselekileyo yento nganye ekujoliswe kuyo. Ezi zingentla zezinye iimfuno zesithuba kuyilo lwePCB.

Iimfuno zoxinano oluphezulu kunye nesantya esiphezulu se-multilayer PCB (HDI)

Ngokuqhelekileyo yohlulwe ngokweendidi ezintathu, ezizezi, umngxuma oyimfama, umngxuma ongcwatyiweyo kunye nomngxuma
Umngxuma ofakelweyo: ubhekiselele kumngxuma wokudibanisa obekwe kwinqanaba elingaphakathi lebhodi yesekethe eprintiweyo, engayi kunabela kumphezulu webhodi yesekethe eprintiweyo.
Ngomngxuma: Lo mngxuma udlula kuyo yonke ibhodi yesekethe kwaye unokusetyenziselwa uqhagamshelo lwangaphakathi okanye njengofakelo kunye nokubeka umngxuma wamacandelo.
Umngxuma oyimfama: Ibekwe kwindawo ephezulu kunye nesezantsi kwibhodi yesekethe eprintiweyo, enobunzulu obuthile, kwaye isetyenziselwa ukudibanisa ipateni yomhlaba kunye nepateni yangaphakathi engezantsi.

Ngokunyuka kwesantya esiphezulu kunye ne-miniaturization yeemveliso eziphezulu, ukuphuculwa okuqhubekayo kwe-semiconductor edibeneyo yokuhlanganiswa kweesekethe kunye nesantya, iimfuno zobugcisa kwiibhodi eziprintiweyo ziphezulu. Iingcingo kwi-PCB zincinci kwaye zincinci, ukuxinana kweengcingo kuphezulu nangaphezulu, kwaye imingxuma kwi-PCB incinci kwaye incinci.
Ukusebenzisa i-laser blind hole njengeyona mikrolo iphambili ngomngxuma yenye yeetekhnoloji eziphambili zeHDI. Umngxuma oyimfama we-laser onesimbobo esincinci kunye nemingxuma emininzi yindlela esebenzayo yokufumana ukuxinana kocingo oluphezulu lwebhodi ye-HDI. Njengoko kukho imingxunya emfama ye-laser njengeendawo zoqhagamshelwano kwiibhodi ze-HDI, ukuthembeka kwemingxuma eyimfama ye-laser imisela ngokuthe ngqo ukuthembeka kweemveliso.

Ubume bobhedu lomngxuma
Iimpawu eziphambili zibandakanya: ubukhulu bobhedu bekona, ubukhulu bobhedu bodonga lomngxuma, ukuphakama kokuzaliswa komngxuma (ubunzima obungaphantsi kobhedu), ixabiso lobubanzi, njl.

Iimfuno zoyilo lwe-Stack-up
1. Nganye umaleko womzila kufuneka ube nereferensi ekufutshane (umbane okanye istratum);
2. Umaleko wobonelelo lwamandla kunye nestratum uya kugcinwa kumgama omncinci ukunika amandla okudibanisa okukhulu.

Umzekelo we-4Layer umi ngolu hlobo lulandelayo
I-SIG-GND (PWR)-PWR (GND)-SIG; 2. GND-SIG (PWR)-SIG (PWR)-GND
Izithuba zomaleko ziya kuba zikhulu kakhulu, ezingalunganga kuphela kulawulo lwe-impedance, ukudityaniswa kwe-interlayer kunye nokukhusela; Ngokukodwa, isithuba esikhulu phakathi kwemigangatho yonikezelo lwamandla kunciphisa amandla ebhodi, angayisebenzisi ingxolo yokucoca.