Izinto ezinzima ze-substrate: intshayelelo kwi-BT, ABF kunye neMIS

1. Intlabathi ye-BT
Igama elipheleleyo le-resin ye-BT “yi-bismaleimide triazine resin”, ephuhliswa yiNkampani yeGesi yaseMitsubishi yaseJapan. Nangona ixesha lobunikazi be-resin ye-BT liphelile, i-Mitsubishi Gas Company isekwindawo ekhokelayo kwihlabathi kwi-R & D kunye nokusetyenziswa kwe-resin ye-BT. I-resin ye-BT inezibonelelo ezininzi ezinjenge-Tg ephezulu, ukumelana nobushushu obuphezulu, ukunganyamezeli kokufuma, i-dielectric rhoqo (DK) kunye nelahleko ephantsi (DF). Nangona kunjalo, ngenxa yoluhlu lweglasi yefayibha yentsimbi, kunzima kune-FC substrate eyenziwe nge-ABF, i-wiring enzima kunye nobunzima obuphezulu kwi-laser yokomba, ayinakho ukuhlangabezana neemfuno zemigca emihle, kodwa inokuzinzisa ubungakanani kunye nokuthintela ukwanda kwe-thermal kunye ne-shrinkage ebandayo evela ekuchaphazeleni isivuno somgca, ke ngoko, izixhobo ze-BT zisetyenziselwa iitshipsi zenethiwekhi kunye neetshiphusi ezinokucwangciswa ezineemfuno zokuthembeka okuphezulu. Okwangoku, ii-substrates ze-BT zisetyenziswa ikakhulu kwiifowuni eziphathwayo ze-MEMS, iichips zonxibelelwano, iitshipsi zememori kunye nezinye iimveliso. Ngophuhliso olukhawulezayo lweetshiphusi ze-LED, ukusetyenziswa kweBT substrates kwi-chip chip ye-LED kukwakhula ngokukhawuleza.

2,ABF
Izinto ze-ABF yinto ekhokelwa kwaye yaphuhliswa yi-Intel, esetyenziselwa ukuvelisa iibhodi zenqanaba eliphezulu zokuphatha ezinje ngeflip chip. Xa kuthelekiswa ne-BT substrate, izinto ze-ABF zinokusetyenziswa njenge-IC enesekethe ecekeceke kwaye ilungele inombolo ephezulu yepini kunye nokuhambisa okuphezulu. Isetyenziselwa ubukhulu becala iitshipsi ezinkulu zokugqibela ezinjengeCPU, i-GPU kunye nokuseta kwe-chip. I-ABF isetyenziswa njengezinto ezongeziweyo zomaleko. I-ABF inokuqhotyoshelwa ngqo kwi-substrate yobhedu njengesekethe ngaphandle kwenkqubo yokucinezela i-thermal. Kwixesha elidlulileyo, i-abffc ibinengxaki yokuqina. Nangona kunjalo, ngenxa yetekhnoloji eyandayo yokuqhubela phambili ye-foil substrate, i-abffc iyakwazi ukusombulula ingxaki yobunzima okoko ithathe ipleyiti ebhityileyo. Kwiintsuku zokuqala, uninzi lwee-CPU zeebhodi ze-ABF zazisetyenziswa kwiikhompyuter nakwimidlalo yomdlalo. Ngokunyuka kweefowuni ezikrelekrele kunye notshintsho kwitekhnoloji yokupakisha, ishishini le-ABF lakha lawela kulwandle oluphantsi. Nangona kunjalo, kule minyaka idlulileyo, ngokuphuculwa kwesantya senethiwekhi kunye nokuphumelela kwetekhnoloji, izicelo ezintsha zekhompyuter esebenza ngokukuko ziye zavela, kwaye ibango leABF landisiwe kwakhona. Ukusuka kwimbono yokushishina, i-ABF substrate inokugcina isantya se-semiconductor phambili, ukuhlangabezana neemfuno zomgca ocekeceke, ububanzi bomgca / umgca womgama, kunye nokukhula kweemarike kunokulindeleka kwixesha elizayo.
Amandla emveliso alinganiselweyo, iinkokheli zeshishini zaqala ukwandisa imveliso. Ngo-Meyi u-2019, u-Xinxing wabhengeza ukuba kulindeleke ukuba kutyalwe i-yuan eyi-20 yezigidigidi ukusuka ngo-2019 ukuya ku-2022 ukwandisa umatshini ophakamileyo we-IC wokufaka izinto kunye nokuphucula ngamandla i-ABF substrates. Ngokubhekisele kwezinye izityalo zaseTaiwan, i-jingshuo kulindeleke ukuba igqithise iipleyiti zokuthwala ezodidi ukuya kwimveliso ye-ABF, kwaye uNandian ukwanyusa ngokuqhubekayo amandla emveliso. Iimveliso zanamhlanje ze-elektroniki ziphantse zayi-SOC (inkqubo kwi-chip), kwaye phantse yonke imisebenzi kunye nokusebenza kuyachazwa ngokweenkcukacha ze-IC. Ke ngoko, itekhnoloji kunye nezinto zokwenza umva wokupakisha uyilo lwenethiwekhi ziya kudlala indima ebaluleke kakhulu yokuqinisekisa ukuba ekugqibeleni banokuxhasa ukusebenza kwesantya esiphezulu kwee-chips ze-IC. Okwangoku, i-ABF (i-Ajinomoto eyakha ifilimu) lolona luhlu ludumileyo longeza izinto zokuhambisa i-IC ephezulu kwimarike, kwaye abathengisi abaphambili bezinto ze-ABF ngabavelisi baseJapan, abanjengoAjinomoto kunye neSekisui chemical.
Itekhnoloji yeJinghua ngumenzi wokuqala e-China ukuphuhlisa ngokuzimeleyo izinto ze-ABF. Okwangoku, iimveliso ziqinisekisiwe ngabenzi abaninzi ekhaya nakumazwe aphesheya kwaye zithunyelwe ngesixa esincinci.

3,MIS
Itekhnoloji yokupakisha ye-MIS substrate yitekhnoloji entsha, ekhula ngokukhawuleza kwimimandla yentengiso ye-analog, i-IC yamandla, imali yedijithali njalo njalo. Yahlukile kummiselo wendabuko, i-MIS ibandakanya enye okanye ezingaphezulu ezibekiweyo zesakhiwo esifakwe ngaphambili. Uluhlu ngalunye luqhagamshelene nobhedu olusetyenziselwa ukubonelela ngombane kwinkqubo yokupakisha. I-MIS inokuthi ithathe indawo yeephakeji zesiko ezinje ngephakeji yeQFN okanye iphakheji esekwe kwilframe, kuba i-MIS inamandla okwenza iintambo, ukusebenza okungcono kombane kunye nobushushu, kunye nemilo encinci.