Ngokukhula kwe-5g, i-AI kunye neemarike zekhompyuter ezikumgangatho ophezulu, imfuno yezithuthi ze-IC, ngakumbi izithuthi zeABF, iqhume. Nangona kunjalo, ngenxa yesithintelo somthamo wabathengisi abafanelekileyo, ukubonelelwa kwabaphethe iABF kunqabile kwaye ixabiso liyaqhubeka nokunyuka. Umzi-mveliso ulindele ukuba ingxaki yokunikezelwa ngokuqinileyo kwamacwecwe okuphatha i-ABF ingaqhubeka kude kube ngu-2023. Kule meko, izityalo ezine ezinkulu zokulayisha iipleyiti eTaiwan, eXinxing, Nandian, jingshuo naseZhending, zindulule izicwangciso zokukhulisa iipleyiti ze-ABF kulo nyaka, nge Inkcitho iyonke yenkcitho engaphezulu kwe-NT $ 65 yezigidigidi kwilizwekazi naseTaiwan. Ukongeza, ibiden yaseJapan kunye ne-shinko, iimoto zaseSouth Korea zeSamsung kunye ne-Dade ye-elektroniki ziye zalwandisa utyalo-mali lwazo kwiipleyiti ze-ABF.

Imfuno kunye nexabiso lebhodi yenethiwekhi ye-ABF inyuka ngokukhawuleza, kwaye ukunqongophala kunokuqhubeka kude kube ngu-2023
I-substrate ye-IC iphuhliswa ngesiseko sebhodi ye-HDI (ibhodi yesekethe yokudibanisa) Njengoko izinto eliphakathi kokudibanisa chip kunye nebhodi yesekethe kwinkqubo chip ukupakisha, umsebenzi engundoqo ibhodi yenethiwekhi ABF kukuba ukwenza ezixineneyo kunye ngesantya esiphezulu unxibelelwano uqhagamshelo kunye chip, uze uqhagamshele ngebhodi enkulu PCB ngokusebenzisa imigca ngaphezulu kwibhodi yenethiwekhi ye-IC, edlala indima yokuqhagamshela, ukukhusela ukuthembeka kwesekethe, ukunciphisa ukuvuza, ukulungisa imeko yomgca Kulungele ukutshabalalisa ubushushu be-chip ukukhusela i-chip, kwaye kungene ngaphakathi kwaye kungasebenzi izixhobo ukufezekisa imisebenzi ethile yenkqubo.

Okwangoku, kwicandelo lokupakisha okuphezulu, umphathi we-IC uye waba yinxalenye ebalulekileyo yokupakisha. Idatha ibonisa ukuba okwangoku, inani lesithwali se-IC kwiindleko zokupakisha liphela lifikelele malunga ne-40%.
Phakathi kwezithwali ze-IC, ikakhulu kukho i-ABF (Ajinomoto eyakha ifilimu) kunye nabaphethe i-BT ngokweendlela ezahlukeneyo zobugcisa ezinje ngenkqubo ye-resin ye-CLL.
Phakathi kwabo, ibhodi yenethiwekhi ye-ABF isetyenziselwa ikakhulu ii-chip eziphezulu zekhompyuter ezinje ngeCPU, iGPU, iFPGA kunye neASIC. Emva kokuba ezi chips zivelisiwe, zihlala zifuna ukuba zipakishwe kwibhodi yenethiwekhi ye-ABF ngaphambi kokuba zidityaniswe kwibhodi enkulu yePCB. Nje ukuba umphathi we-ABF aphume kwisitokhwe, abavelisi abakhulu kubandakanya i-Intel kunye ne-AMD abanakubalekela kwisiphelo esingenakuthunyelwa nge-chip. Ukubaluleka komphathi we-ABF kunokubonwa.

Ukusukela kwisiqingatha sesibini sonyaka ophelileyo, enkosi ekukhuleni kwe-5g, ilifu ye-AI, iiseva kunye nezinye iimarike, imfuno yeetshipsi zekhompyuter (HPC) inyuke kakhulu. Ukudityaniswa nokukhula kwemfuno yentengiso yeofisi yasekhaya / eyolonwabo, imoto kunye nezinye iimarike, ibango le-CPU, i-GPU kunye ne-AI chips kwicala lesiphelo lenyuke kakhulu, eliye lanyusa ibango leebhodi ze-ABF.