Iimfuno zezinto ze-LTCC
Izinto ezifunekayo kwiipropathi ezibonakalayo zezixhobo ze-LTCC zibandakanya iipropathi zombane, iipropathi zethemomechanical kunye nepropathi yenkqubo.

Ukuhlala kwe-dielectric yeyona nto ibaluleke kakhulu kwizinto ze-LTCC. Kuba iyunithi esisiseko yesixhobo serediyo-ubude be-resonator buhambelana ngokuchanekileyo nengcambu yesikwere se-dielectric yento leyo, xa isantya sokusebenza kwesixhobo siphantsi (njengamakhulu eMHz), kusetyenziswa rhoqo i-dielectric engagungqiyo, isixhobo esi siya kuba sikhulu kakhulu ukuba singasetyenziswa. Ke ngoko, kungcono ukuba ulandele i-dielectric rhoqo ukuze ilungele iindlela ezahlukeneyo zokusebenza.

Ukulahleka kwe-dielectric kukwindawo ebalulekileyo ebonwa kuyilo lwezixhobo zerediyo, kwaye inxulumene ngokuthe ngqo nelahleko yesixhobo. Kwithiyori, okuncinci kubangcono. Ubushushu bokulingana kwe-dielectric rhoqo yiparameter ebalulekileyo emisela uzinzo lobushushu ekusebenzeni kombane kwifowuni yerediyo.

Ukuqinisekisa ukuthembeka kwezixhobo ze-LTCC, iipropathi ezininzi ze-thermo-mechanical nazo kufuneka ziqwalaselwe xa ukhetha izinto. Eyona ibaluleke kakhulu kukulingana kokunatyiswa kwe-thermal, ekufuneka ihambelane nebhodi yesekethe ukuba ithengiswe kangangoko kunokwenzeka. Ukongeza, kuthathelwa ingqalelo ukuqhubekeka kunye nokusetyenziswa kwexa elizayo, izinto ze-LTCC kufuneka zihlangabezane neemfuno zomatshini ezininzi, njengokugoba amandla σ, ukuqina kwe-Hv, umphezulu wobuso, i-elastic modulus E kunye nokuqina kobunzima be-KIC njalo njalo.

Inkqubo yokusebenza inokuthi ibandakanye le miba ilandelayo: Okokuqala, inokucocwa kubushushu obungaphantsi kwe-900 ° C kwisakhiwo esinyinyithekayo. Okwesibini, ubushushu boxinaniso akufuneki bube sezantsi kakhulu, ukuze kuthintelwe ukukhutshwa kwezinto eziphilayo kwincam yesilivere kunye nebhanti eluhlaza. Okwesithathu, emva kokongeza izinto ezifanelekileyo eziphilayo, inokuphoswa kwiteyiphu efanayo, egudileyo, kwaye eyomeleleyo eluhlaza.

Ukwahlulahlula izinto ze-LTCC
Okwangoku, izinto ze-LTCC ze-ceramic ikakhulu zenziwe ziinkqubo ezimbini, ezizezi ziinkqubo zeglasi-ceramic kunye nenkqubo yeglasi + yodongwe. Ukunyibilika nge-oxide enyibilikayo esezantsi okanye iglasi enyibilikayo kunganciphisa ubushushu bokuntywila kwezixhobo zeceramic, kodwa ukunciphisa ubushushu bokuntywila kunqabile, kwaye ukusebenza kwemathiriyeli kuya konakaliswa ngokwamaqondo ahlukeneyo. Ukukhangelwa kwezinto zeceramic ezinobushushu obuphantsi bokuntywila kuye kwatsala umdla wabaphandi. Ezona ntlobo ziphambili zezi zinto ziphuhliswayo yi-barium tin borate (BaSn (BO3) 2) uthotho, uthotho lwegermanate kunye ne-tellurate, uthotho lwe-BiNbO4, uthotho lwe-Bi203-Zn0-Nb205, uthotho lwe-ZnO-TiO2 kunye nezinye izinto ze-ceramic. Kwiminyaka yakutshanje, iqela lophando likaZhou Ji kwiYunivesithi yaseTsinghua lizinikele kuphando kule ndawo.
Iipropathi ze-LTCC
Ukusebenza kweemveliso ze-LTCC kuxhomekeke ngokupheleleyo ekusebenzeni kwezixhobo ezisetyenzisiweyo. Izinto ze-LTCC ze-ceramic ikakhulu zibandakanya izinto ze-LTCC ze-substrate, izinto zokupakisha kunye nezixhobo ze-microwave. Ukuqhubeka kwe-dielectric yeyona nto ibaluleke kakhulu kwizinto ze-LTCC. Ukuqhubeka kwe-dielectric kuyadingeka ukuba kulungiswe ngokulandelelana ku-2 ukuya ku-20000 ukuze ilungele iindlela ezahlukeneyo zokusebenza. Umzekelo, i-substrate enemvume yokuhambelana no-3.8 ilungele uyilo lweesekethe ezinesantya esiphezulu; I-substrate enemvume yokuhambelana no-6 ukuya ku-80 inokulugqibezela uyilo lweesekethe ezihamba rhoqo; I-substrate enemvume yokuhambelana ukuya kuthi ga kwi-20,000 inokwenza izixhobo ezinobungakanani obuphezulu zidityaniswe kwisakhiwo se-multilayer. Ukuhamba rhoqo ngumkhwa ocacileyo kuphuhliso lweemveliso zedijithali ze-3C. Ukuphuhliswa rhoqo kwe-dielectric rhoqo (ε≤10) izixhobo ze-LTCC ukuhlangabezana neemfuno zokuhamba rhoqo kunye nesantya esiphezulu ngumceli mngeni kwindlela izinto ze-LTCC ezinokuziqhelanisa ngayo nokusetyenziswa rhoqo. Ukuhlala kwe-dielectric yenkqubo ye-901 yeFerroA6 kunye neDuPont ngu-5.2 ukuya ku-5.9, i-4110-70C ye-ESL yi-4.3 ukuya kwi-4.7, i-dielectric rhoqo ye-NEC ye-LTCC substrate imalunga ne-3.9, kwaye i-dielectric engagungqiyo njenge-2.5 iphantsi kophuhliso.

Ubungakanani be-resonator buhambelana ngokuthe ngqo kwingcambu yesikwere se-dielectric rhoqo, ke xa isetyenziswa njenge-dielectric material, i-dielectric rhoqo iyafuneka ukuba ibe nkulu ukunciphisa ubungakanani besixhobo. Okwangoku, umda welahleko ye-ultra-low okanye ye-ultra-high Q, imvume yokuhambelana (> 100) okanye> 150 izixhobo zedizeli ziindawo ekuphandwa kuzo. Kwimijikelezo efuna amandla amakhulu, izixhobo ezinokusetyenziswa rhoqo kwe-dielectric zinokusetyenziswa, okanye umaleko wezinto ezinamandla ombane kunye ne-dielectric engagungqiyo inokubekwa phakathi kwe-LTCC dielectric ceramic substrate umaleko wezinto, kwaye i-dielectric engagungqiyo inokuba phakathi kwe-20 kunye ne-100. Khetha phakathi . Ukulahleka kwe-dielectric kukwindawo ebalulekileyo ekufuneka uyiqwalasele kuyilo lwezixhobo zerediyo. Inxulumene ngokuthe ngqo nelahleko yesixhobo. Kwithiyori, kuyathenjwa ukuba ezincinci ziya kuba ngcono. Okwangoku, izinto ze-LTCC ezisetyenziswa kwizixhobo zokuhamba rhoqo kunomathotholo ikakhulu yiDuPont (951,943), iFerro (A6M, A6S), iHeraeus (CT700, CT800 kunye ne-CT2000) kunye neelebhu ze-Electro-science. Abakwazi ukubonelela kuphela nge-serial LTCC itape yodongwe eluhlaza rhoqo, kodwa ikwabonelela ngezixhobo zokudibanisa.

Omnye umba oshushu kuphando lwezinto ze-LTCC kukuhambelana kwezinto ezidityanisiweyo. Xa ngokudubula ngokudibeneyo ukwahlula kwe-dielectric (i-capacitors, ukumelana, ukungafakwanga, ukuqhuba, njl. Ukuncipha phakathi komaleko wojongano Ireyithi kunye nokwanda kwenqanaba lokufudumeza zihambelana ngokusemandleni ukunciphisa ukubakho kweziphene ezinjengokugoba, ukusonta kunye nokuqhekeka.

Ukuthetha ngokubanzi, ireyithi yokuncipha kwezinto zeceramic zisebenzisa itekhnoloji ye-LTCC imalunga ne-15-20%. Ukuba ukuntywila kwezi zimbini akunakuthelekiswa okanye kuhambelane, umaleko wojongano uza kwahlula emva kokuntywila; ukuba ezi zinto zimbini zisabela kubushushu obuphezulu, isiphumo sokuphendula siya kuthi sichaphazele iimpawu zoqobo zezinto ezifanelekileyo. Ukudibana ngokudibeneyo kwezixhobo ezibini ezinee-dielectric constants ezahlukeneyo kunye nokuqanjwa kunye nendlela yokunciphisa ukwenziwa kwezinto ngokuhlangeneyo kugxilwe kuphando. Xa i-LTCC isetyenziswa kwiinkqubo zokusebenza okuphezulu, isitshixo kulawulo olungqongqo lokuziphatha kwe-shrinkage kukulawula ukuncipha kwesistim yenkqubo ye-LTCC edibeneyo. Ukuncipha kwenkqubo yokudubula ngokudibeneyo ye-LTCC kwicala le-XY ngokubanzi yi-12% ukuya kwi-16%. Ngoncedo lokucoca ngaphandle koxinzelelo okanye itekhnoloji yokuncedisa ngoxinzelelo, izinto ezinokuncipha zero kwicala le-XY zifunyenwe [17,18]. Xa kusenziwa sintering, umphezulu kunye nomgangatho osezantsi we-LTCC obekwe ngokudibeneyo ubekwe phezulu nasezantsi komaleko odibeneyo we-LTCC njengaleyo yolawulo yokuncipha. Ngoncedo lwefuthe elithile lokudibanisa phakathi kolawulo lomaleko kunye ne-multilayer kunye nenqanaba eliqinileyo lokuncitshiswa kocingo lolawulo, indlela yokuziphatha kwe-shrinkage yesakhiwo se-LTCC ecaleni komgaqo we-X kunye no-Y kuthintelwe. Ukuze ubuyekeze ilahleko yokuncipha kwe-substrate kwicala le-XY, i-substrate iya kubuyekezwa ngokuncipha kwicala le-Z. Ngenxa yoko, ubungakanani botshintsho lobume be-LTCC kwicala le-X kunye ne-Y kuphela malunga ne-0.1%, ngaloo ndlela kuqinisekiswa indawo kunye nokuchaneka kweentambo kunye nemingxunya emva kokuntywila, kunye nokuqinisekisa umgangatho wesixhobo.