Imveliso ye-HDI PCB: izixhobo ze-PCB kunye neenkcukacha

Ngaphandle kwale mihla PCB design, high density interconnect (HDI) technology, and of course high-speed components, none of these would be usable. Itekhnoloji ye-HDI ivumela abayili ukuba babeke izinto ezincinci kufutshane. Ukuxinana kwephakheji ephezulu, ubungakanani bebhodi encinci kunye namanqanaba ambalwa azisa umphumo wokuyila kuyilo lwePCB.

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Uncedo lwe-HDI

Let’s take a closer look at the impact. Ukonyusa iphakheji yokuxinana kusivumela ukuba sinciphise iindlela zombane phakathi kwezinto. With HDI, we increased the number of wiring channels on the inner layers of the PCB, thus reducing the total number of layers required for the design. Ukunciphisa inani leelayi kunokubeka unxibelelwano ngakumbi kwibhodi enye kunye nokuphucula ukubekwa kwecandelo, iingcingo kunye nokunxibelelana. Ukusuka apho, singagxila kubuchwephesha obubizwa ngokuba kukudibana kwindawo nganye (ELIC), enceda amaqela oyilo ukusuka kwiibhodi ezishinyeneyo ukuya kwezicekeceke ukuze zigcine amandla ngelixa ivumela i-HDI ukuba ibone uxinano olusebenzayo.

HDI PCBS rely on lasers rather than mechanical drilling. Kwelinye icala, uyilo lwe-HDI PCB lubangela ukuvula okuncinci kunye nesayizi encinci yepad. Ukunciphisa ukuvula kwavumela iqela loyilo ukuba lenyuse ubeko lwendawo yebhodi. Ukunciphisa iindlela zombane kunye nokwenza ukuba i-wiring enzulu ngakumbi iphucule ukuthembeka komqondiso kuyilo kunye nokukhawulezisa ukulungiswa kwemiqondiso. We get an added benefit in density because we reduce the chance of inductance and capacitance problems.

Uyilo lwe-HDI lwe-PCB alusebenzisi ngemingxunya, kodwa yimingxunya engaboniyo nengcwatyelweyo. Ukubekwa ngokungxolayo nangokuchanekileyo kwemingxunya yokungcwaba kunye nemingxunya engaboniyo kunciphisa uxinzelelo loomatshini kwipleyiti kwaye kuthintela naliphi na ithuba lokulwa. Ukongeza, ungasebenzisa ukutyibilika ngemingxunya ukuphucula amanqaku okudibanisa kunye nokuphucula ukuthembeka. Ukusetyenziswa kwakho kwiipads kunokunciphisa ukulahleka komqondiso ngokunciphisa ukulibaziseka komnqamlezo kunye nokunciphisa iimpembelelo ze-parasitic.

Ukuveliswa kweHDI kufuna ukusebenzisana

Uyilo lweMveliso (DFM) lufuna indlela ecingisisiweyo, echanekileyo yoyilo lwePCB kunye nonxibelelwano oluhambelana nabavelisi kunye nabavelisi. As we added HDI to the DFM portfolio, attention to detail at the design, manufacturing, and manufacturing levels became even more important and assembly and testing issues had to be addressed. Ngamafutshane, uyilo, prototyping kunye nenkqubo yokuvelisa ye-HDI PCBS ifuna ukusebenzisana ngokusondeleyo kunye nokuqwalaselwa kwemigaqo ethile ye-DFM esebenzayo kule projekthi.

One of the fundamental aspects of HDI design (using laser drilling) may be beyond the capability of the manufacturer, assembler, or manufacturer, and requires directional communication regarding the accuracy and type of drilling system required. Because of the lower opening rate and higher layout density of HDI PCBS, the design team had to ensure that manufacturers and manufacturers could meet the assembly, rework and welding requirements of HDI designs. Therefore, design teams working on HDI PCB designs must be proficient in the complex techniques used to produce boards.

Yazi izinto zebhodi yesekethe kunye neenkcukacha

Kuba imveliso ye-HDI isebenzisa iintlobo ezahlukeneyo zenkqubo yokomba i-laser, ingxoxo phakathi kweqela loyilo, umenzi kunye nomenzi kufuneka ajolise kuhlobo lweebhodi xa kuxoxwa ngenkqubo yokomba. Isicelo semveliso esinyanzela inkqubo yoyilo sinokuba nobukhulu kunye neemfuno zobunzima ezihambisa incoko kwelinye icala. High frequency applications may require materials other than standard FR4. Ukongeza, izigqibo malunga nohlobo lwezixhobo ze-FR4 zichaphazela izigqibo malunga nokukhethwa kweenkqubo zokomba okanye ezinye izixhobo zokuvelisa. Ngelixa ezinye iinkqubo zibhola ngobhedu ngokulula, ezinye azingeni ngokungena kwimicu yeglasi.

Ukongeza ekukhetheni uhlobo lwezinto ezifanelekileyo, iqela loyilo kufuneka liqinisekise ukuba umenzi kunye nomenzi banokusebenzisa ubukhulu beepleyiti ezichanekileyo kunye neendlela zobugcisa. With the use of laser drilling, the aperture ratio decreases and the depth ratio of the holes used for plating fillings decreases. Nangona iipleyiti ezijiyileyo zivumela indawo encinci, iimfuno zeprojekhthi zingachaza iipleyiti ezicekeceke ezinokuthi zisilele phantsi kweemeko ezithile zokusingqongileyo. Iqela loyilo kuye kwafuneka liqwalasele ukuba ngaba umenzi unakho na ukusebenzisa ubuchule “be-interconnect layer” kunye nokumba imingxunya kubunzulu obuchanekileyo, kwaye aqinisekise ukuba isisombululo semichiza esisetyenziselwa ukwenza i-electroplating siyayigcwalisa imingxunya.

Using ELIC technology

The DESIGN of HDI PCBS around ELIC technology enabled the design team to develop more advanced PCBS, which include multiple layers of stacked copper filled microholes in the pad. Njengomphumo we-ELIC, uyilo lwe-PCB lunokuthatha ithuba lokudibanisa, unxibelelwano oluntsonkothileyo olufunekayo kwiisekethe ezinesantya esiphezulu. Ngenxa yokuba i-ELIC isebenzisa i-microholes egcwele ubhedu edityanisiweyo, inokudityaniswa phakathi kwayo nayiphi na imiqolo emibini ngaphandle kokwenza buthathaka ibhodi yesekethe.

Ukukhethwa kwecandelo kuchaphazela uyilo

Naziphi na iingxoxo kunye nabavelisi kunye nabavelisi ngokubhekisele kuyilo lwe-HDI kufuneka zigxile kulwakhiwo oluchanekileyo lwezinto ezixineneyo. The selection of components affects wiring width, position, stack and hole size. Umzekelo, uyilo lwe-HDI PCB lubandakanya uluhlu lwegridi yebhola eshinyeneyo (BGA) kunye ne-BGA evulekileyo efuna ukuphuncuka kwepini. Izinto ezonakalisa ukubonelelwa ngombane kunye nokuthembeka komqondiso kunye nokuthembeka kwibhodi kufuneka kuqatshelwe xa kusetyenziswa ezi zixhobo. Ezi zinto zibandakanya ukufezekiswa kokuzahlula phakathi kwezingqimba eziphezulu nezisezantsi ukunciphisa i-crosstalk efanayo kunye nokulawula i-EMI phakathi komaleko wangaphakathi.Symmetrically spaced components will help prevent uneven stress on the PCB.

Nika ingqalelo umqondiso, amandla kunye nokunyaniseka komzimba

Ukongeza ekuphuculeni ukuthembeka komqondiso, unokuphinda unyuse ukuthembeka kwamandla. Ngenxa yokuba i-HDI PCB ishukumisela umaleko osondeleyo kufutshane nomphezulu, amandla ethembekileyo aphuculwe. Uluhlu oluphezulu lwebhodi lunomaleko womhlaba kunye nombane wokuhambisa umbane, onokuthi uqhagamshelwe kumaleko wokumisa ngokusebenzisa imingxunya engaboniyo okanye ii-microholes, kwaye unciphise inani lemingxunya yenqwelomoya.

I-HDI PCB inciphisa inani leemingxunya ngokusebenzisa umaleko wangaphakathi webhodi. In turn, reducing the number of perforations in the power plane provides three major advantages:

Indawo enkulu yobhedu ityisa i-AC kunye ne-DC yangoku kwipini yamandla e-chip

L resistance decreases in the current path

L Ngenxa yokunyanzeliswa okuphantsi, ukutshintsha ngoku ngokuchanekileyo kunokufunda ipini yamandla.

Elinye inqaku eliphambili lengxoxo kukugcina ubuncinci bomda wobubanzi, isithuba esikhuselekileyo kunye nokufana komkhondo. Kwiphepha lokugqibela, qala ukufezekisa ukulingana kobhedu kunye nokufana kwe-wiring ngexesha lenkqubo yoyilo kwaye uqhubeke ngenkqubo yokuvelisa kunye neyokwenza.

Ukunqongophala kwezithuba ezikhuselekileyo kungakhokelela kwintsalela yefilimu egqithisileyo ngexesha lenkqubo yefilimu eyomileyo yangaphakathi, enokuthi ikhokelele kwiisekethe ezimfutshane. Below the minimum line width can also cause problems during the coating process because of weak absorption and open circuit. Amaqela oyilo kunye nabavelisi kufuneka bakuthathele ingqalelo ukugcina ukufana komkhondo njengendlela yokulawula ukungqinelana komgca womqondiso.

Ukuseka nokusebenzisa imigaqo ethile yoyilo

Ubeko loxinano oluphezulu lufuna imilinganiselo emincinci yangaphandle, intambo ecikizekileyo kunye nokushiya isithuba secandelo, kwaye ke ngoko kufuna inkqubo yoyilo eyahlukileyo. Inkqubo yokuvelisa ye-HDI ye-PCB ixhomekeke ekusombeni kwe-laser, isoftware ye-CAD kunye ne-CAM, iinkqubo zokucinga ze-laser ngqo, izixhobo zemveliso ezizodwa, kunye nobungcali bokuqhuba. Impumelelo yayo yonke le nkqubo ixhomekeke kwinxalenye yemithetho yoyilo echonga iimfuno ze-impedance, ububanzi beekhondaktha, ubungakanani bomngxunya, kunye nezinye izinto ezichaphazela ubeko. Ukuphuhlisa imigaqo yoyilo eneenkcukacha kunceda ukhethe umenzi olungileyo okanye umenzi webhodi yakho kwaye ubeke isiseko sonxibelelwano phakathi kwamaqela.