Intshayelelo:

Ngophuhliso olukhawulezileyo lwe PCB Umzi mveliso, i-PCB ngokuthe chu isiya kwicala lokuchaneka okuphezulu komgca ocolekileyo, ukuvula okuncinci, umlinganiso wembonakalo ephezulu (6: 1-10: 1). Imfuno umngxuma ubhedu 20-25um, kunye nomgca DF umgama board4mil ibhodi. Ngokubanzi, iinkampani zePBB zinengxaki yokuchongwa kwefilimu. Iklip yefilimu iya kubangela isekethe emfutshane ethe ngqo, ichaphazele isivuno seXESHA elinye lebhodi ye-PCB ngokuhlolwa kwe-AOI, iklip yefilimu okanye amanqaku angenakulungiswa ngokuthe ngqo okukhokelela kwi-scrap.

Umzobo womzobo wefilimu yokuqhafaza ingxaki yefilimu:

Indlela yokusombulula ingxaki yebhodi yePCB yesingxobo sefilimu

Uhlalutyo umgaqo ibhodi PCB nokubotshwa film

(1) Ukuba ubukhulu bobhedu bomgca wegraphic electroplating bungaphezulu kobukhulu befilimu eyomileyo, iya kubangela ukubotshwa kwefilimu. (Ubungqingqwa obomileyo befilimu yomzi-mveliso wePCB yi-1.4mil)

(2) Ukuba ubukhulu bobhedu kunye nenkcenkce kumgca wegraphic electroplating budlula ubukhulu befilimu eyomileyo, iklip yefilimu inokubangelwa.

Uhlalutyo lwefilimu lwebhodi ye-PCB

1. Kulula ukucofa imifanekiso yebhodi yefilimu kunye neefoto

Indlela yokusombulula ingxaki ibhodi PCB nesingxobo ikliphu umboniso?

Kwi-FIG. 3 kunye ne-FIG. 4, inokubonwa kwimifanekiso yepleyiti ebonakalayo ukuba isekethe iyaxinana, kwaye kukho umahluko omkhulu phakathi komyinge wobude nobubanzi kuyilo lobunjineli kunye nolwakhiwo, kunye nolwabiwo olubi lwangoku. Isithuba esisezantsi somda we-D / F yi-2.8mil (0.070mm), umngxunya omncinci uyi-0.25mm, ubukhulu beplate yi-2.0mm, umlinganiso we-8: 1, kwaye umngxunya wobhedu uyafuneka ngaphezulu kwe-20Um. Yeyenkqubo yebhodi yobunzima.

2. Uhlalutyo lwezizathu zokubopha ifilimu

Ukuxinana okwangoku kwe-graphic electroplating kukhulu kwaye isaliti sobhedu sikhulu kakhulu. There is no edge strip at both ends of the fly bar, and thick film is plated in the high current area. Impazamo ekhoyo yenkabi inkulu kunaleyo yemveliso. Inqwelomoya ye-C / S kunye ne-S / S zidityaniswe ngokungafaniyo.

Plate umboniso ezinezithuba ezincinane kakhulu 2.5-3.5mil.

Ukuhanjiswa ngoku akufani, isilinda sobhedu ixesha elide ngaphandle kokucoca i-anode. Okwangoku akulunganga (uhlobo olungalunganga okanye indawo yeplate engalunganga) Ixesha langoku lokukhusela ibhodi ye-PCB kwisilinda sobhedu lide kakhulu.

 Uyilo loyilo lweprojekthi alunangqiqo, indawo esebenzayo yokuchonga iiprosesa ayilunganga, njl. PCB board line gap is too small, difficult board line graphics special easy clip film.

Inkqubo ephuculweyo yokuphucula umboniso bhanyabhanya

1. ukunciphisa uxinano lwangoku lwegrafu, ulwandiso olufanelekileyo lwexesha lobhedu.

2. Yandisa ubukhulu besingqengqelo sobhedu kwipleyiti ngokufanelekileyo, nciphisa uxinizelelo lobhedu lwegrafu ngokufanelekileyo, kwaye unciphise ubukhulu besixwexwe sobhedu kwigrafu.

3. Ubungqingqwa bezobhedu bezantsi kweplaten butshintshiwe ukusuka kwi-0.5OZ ukuya kwi-1 / 3oz ezantsi zethusi. Ukutyabeka ubhedu kwipleyiti kwandiswe malunga ne-10Um ukunciphisa uxinzelelo lwangoku lwegrafu kunye nesingxobo sobhedu kwigrafu.

4.Ukuba isithuba sebhodi <4mil yokuthengwa kwempahla 1.8-2.0mil kwimveliso yolingo lwefilimu eyomileyo.

5. Ezinye izikim ezinje ngokulungiswa kwendlela yokumisela, ukuguqulwa kwembuyekezo, ukucoca umgca, iringi yokusika kunye nePAD nako kunokunciphisa imveliso yekliphu.

6.Electroplating imveliso imveliso yolawulo ipleyiti kunye umsantsa omncinci kunye ikliphu lula

1. FA: Okokuqala zama emaphethelweni nokubopha imichilo kuzo zombini iziphelo zebhodi ye-flobar. Emva kobunzima bobhedu, ububanzi bomgca / umgama womgama kunye ne-impedance zikulungele, ukugqiba ukufaka ibhodi ye-flobar kunye nokupasa ukuhlolwa kwe-AOI.

2. Ifilimu ebunayo: kwipleyiti ene-D / F ye-linegap <4mil, isantya sokudubula kwifilimu ebunayo kufuneka silungelelaniswe kancinci.

3. Izakhono zabasebenzi be-FA: nikela ingqalelo kuvavanyo lwangoku lokuxinana xa ubonakalisa isiphumo seplate ngefilimu ecekeceke ngokulula. Ngokubanzi, umsantsa osisiseko womgca weplate ungaphantsi kwe-3.5mil (0.088mm), kwaye uxinano lwangoku lobhedu olusetyenzisiweyo lulawulwa ngaphakathi ≦ 12ASF, ekungekho lula ukuvelisa umboniso bhanyabhanya. Ukongeza kwimizobo yemigca ibhodi enzima ngakumbi njengoko kubonisiwe ngezantsi:

Indlela yokusombulula ingxaki yebhodi yePCB yesingxobo sefilimu

Esona sithuba sincinci se-D / F sale bhodi yemizobo yi-2.5mil (0.063mm). Ngaphantsi kwemeko yokufana okuhle kwegantry electroplating line, kuyacetyiswa ukuba kusetyenziswe i-10ASF yovavanyo lwxinano lwangoku lwe-FA.

Indlela yokusombulula ingxaki ibhodi PCB nesingxobo ikliphu umboniso?

Isithuba esisezantsi somda webhodi yegraphic D / F yi-2.5mil (0.063mm), enemigca ezimeleyo kunye nokusasazwa okungalinganiyo, ayinakukuthintela ukuphela kwesiqwengana sefilimu phantsi kwemeko yokufana okuhle komgca wokufakelwa kombane wabenzi ngokubanzi. Ukuxinana okwangoku kwegraphic electroplating copper yimizuzu eyi-14.5ASF * 65 yokuvelisa iklip yefilimu, kuyacetyiswa ukuba igrafu yombane ngoku ≦ 11ASF kuvavanyo lwe-FA.

Amava akho kunye nesishwankathelo

Ndiye ndenza amava enkqubo ye-PCB iminyaka emininzi, ngokusisiseko yonke ibhodi yokwenza i-PCB enamacala amancinci okanye amancinci aya kuba nengxaki yokubamba ifilimu, umahluko kukuba umzi-mveliso ngamnye unenxalenye eyahlukileyo yengxaki yokubamba ifilimu embi, ezinye iinkampani zimbalwa ingxaki yokubamba ifilimu, ezinye iinkampani zinengxaki yokubamba ifilimu. The following factors are analyzed:

1. inkampani nganye uhlobo ibhodi PCB uhlobo ezahlukeneyo, inkqubo yemveliso ubunzima PCB yahlukile.

2. Inkampani nganye ineendlela ezahlukeneyo zolawulo kunye neendlela.

3. ngokoluvo lofundo lweminyaka yam emininzi yamava aqokelelweyo, kwipleyiti encinci kufuneka iqaphele umsantsa wokuqala womgca unokusebenzisa kuphela uxinano lwangoku oluncinci kwaye kufanelekile ukwandisa ixesha lesingxobo sobhedu, imiyalelo yangoku ngokwe amava oxinano lwangoku kunye nesingxobo sobhedu sisetyenziselwa ukuvavanya ixesha elifanelekileyo, jonga indlela yeplate kunye nendlela yokusebenza, ejolise kumgca omncinci ukusuka kwi-4 mil ipleyiti okanye ngaphantsi, zama ukubhabha ibhodi ye-FA kufuneka ibe novavanyo lwe-AOI ngaphandle Iphilisi, Kwangelo xesha, ikwadlala indima kulawulo lomgangatho kunye nokuthintela, ukuze amathuba okuvelisa iklip yefilimu kwimveliso yobuninzi iya kuba mncinci kakhulu.

Ngokoluvo lwam, umgangatho olungileyo we-PCB awufuni kuphela amava kunye nezakhono, kodwa kunye neendlela ezilungileyo. Kuxhomekeke ekubulaweni kwabantu kwisebe lemveliso.

Imizobo electroplating yahlukile kuyo yonke ipleyiti electroplating, umahluko ophambili ulele kwimizobo yemigca yeendidi ezahlukeneyo zeepleyiti zeelectroplating, ezinye iibhodi zemigca yemigca ngokwazo ayihanjiswanga ngokulinganayo, ukongeza kububanzi bomgca kunye nomgama, kukho okuncinci, a imigca embalwa eyahlukeneyo, imingxunya ezimeleyo zonke iintlobo zemizobo ekhethekileyo yomgca. Ke ngoko, UMBHALI utyekele ngakumbi ekusebenziseni izakhono ze-FA (isalathi sangoku) ukusombulula okanye ukuthintela ingxaki yefilimu eshinyeneyo. Uluhlu lwezenzo zokuphucula lincinci, luyakhawuleza kwaye lusebenzayo, kwaye isiphumo sothintelo siyabonakala.