Ukubaluleka kwe i-PCB eguqukayo eqinileyo cannot be underestimated in PCB manufacturing. Isizathu esinye yindlela yokujonga izinto ezincinci. Ukongeza, ibango le-PCBS engqongqo iyenyuka ngenxa yokuguquguquka nokusebenza kwendibano ye-3D. Nangona kunjalo, ayingabo bonke abavelisi be-PCB abakwaziyo ukuhlangabezana nenkqubo yokuvelisa ye-PCB eguqukayo kunye nengqongqo. Iibhodi zesekethe eziprintiweyo ezisemgangathweni zenziwe yinkqubo ecutha ukutyeba kwebhodi eqinileyo kwi-0.25mm +/- 0.05mm. Oku, kuvumela ukuba ibhodi isetyenziswe kwizicelo ezifuna ukugoba ibhodi kunye nokuyifaka ngaphakathi kwindlu. The plate can be used for one-time bending installation and multi-bending installation.

Nalu ukujonga ngokubanzi ezinye zeempawu ezenza ukuba ikhetheke:

I-FR4 iimpawu zePCB ezinokuguquguquka

L Olona phawu lubaluleke kakhulu olusebenza kakuhle ekusebenziseni kwakho kukuba lubhetyebhetye kwaye lunokuziqhelanisa nendawo ekhoyo.

L Its versatility is increased by the fact that its flexibility does not impede its signal transmission.

L Ayisindi.

Ngokubanzi, ii-PCBS ezinemigangatho-bhetyebhetye ziyaziwa ngexabiso labo kuba iinkqubo zabo zokuvelisa ziyahambelana nezinto ezikhoyo zokuvelisa.

L Zigcina zombini ixesha loyilo kunye nexesha lendibano.

L They are extremely reliable alternatives, not least because they avoid many problems, including tangles and welding.

PCB making procedure

The main manufacturing process of FR4 semi-flexible printed circuit board is as follows:

Inkqubo ngokubanzi igubungela le miba ilandelayo:

L Ukusika izinto

L Ukutyabeka kwefilimu eyomileyo

L Uvavanyo oluzenzekelayo lokujonga

L Browning

L laminated

Uvavanyo lwe-X-ray

L ukubhola

L Ukuchongwa kwamandla

L Igrafu yokuguqula

L ukuhonjiswa

L Ukuprintwa kwesikrini

L Ukubonakalisa kunye nophuhliso

L Surface finish

L Ulawulo lokugaya ubunzulu

L Uvavanyo lombane

L Ulawulo lomgangatho

L packaging

Zithini iingxaki kunye nezisombululo ezinokwenzeka kwimveliso ye-PCB?

Eyona ngxaki iphambili kwimveliso kukuqinisekisa ukuchaneka kunye nobunzulu bolawulo lokugaya ukunyamezelana. Kubalulekile ukuba kuqinisekiswe ukuba akukho zintanda okanye ukuqhekeka kweoyile kunokubangela naziphi na iingxaki ezisemgangathweni. Oku kubandakanya ukukhangela oku kulandelayo ngexesha lokugaya ulawulo olunzulu:

L ubukhulu

L Umxholo wentlaka

L Unyamezelo lokugaya

Uvavanyo lokugaya ubunzulu A

Ukutyeba kobunzima kwenziwa ngendlela yemephu yokuhambelana nobukhulu be-0.25 mm, 0.275 mm kunye ne-0.3 mm. Emva kokuba ibhodi ikhutshiwe, iya kuvavanywa ukubona ukuba ingamelana na nokuguqa kweedigri ezingama-90. Ngokubanzi, ukuba ubukhulu obuseleyo yi-0.283mm, ifayibha yeglasi ithathwa njengemoshakeleyo. Therefore, the thickness of the plate, the thickness of the glass fiber and the dielectric condition must be taken into account when conducting deep milling.

Uvavanyo lokugaya ubunzulu B

Ngokusekwe koku kungasentla, kufuneka kuqinisekiswe ukutyeba kobhedu kwe-0.188mm ukuya kwi-0.213mm phakathi komaleko wokuthintela i-solder kunye ne-L2. Unonophelo olufanelekileyo kufuneka luthathwe nakweyiphi na intshukumo enokuthi yenzeke, echaphazela ukufana ngokubanzi.

Uvavanyo lokugaya ubunzulu C

Ukugaya ulawulo olunzulu kwakubalulekile ukuqinisekisa ukuba imilinganiselo isetelwe ku-6.3 “x10.5” emva kokuba ipaneli yolawulo ikhutshiwe. After this, survey point measurements are taken to ensure that 20 mm vertical and horizontal intervals are maintained.

Special fabrication methods ensure that the depth control thickness tolerance is within ±20μm.