Inzuzo I-HDI yePCI

Masiqwalasele ngokuthe gca ifuthe. Ukonyusa iphakheji yokuxinana kusivumela ukuba sinciphise iindlela zombane phakathi kwezinto. Nge-HDI, sonyuse inani lamajelo eentambo kumaleko angaphakathi e-PCB, yiyo loo nto sinciphisa inani lilonke lamanqanaba afunekayo kuyilo. Ukunciphisa inani leelayi kunokubeka unxibelelwano ngakumbi kwibhodi enye kunye nokuphucula ukubekwa kwecandelo, iingcingo kunye nokunxibelelana. From there, we can focus on a technique called interconnect per Layer (ELIC), which helps design teams move from thicker boards to thinner flexible ones to maintain strength while allowing the HDI to see functional density.

HDI PCB rely on lasers rather than mechanical drilling. In turn, the HDI PCB design results in a smaller aperture and smaller pad size. Ukunciphisa ukuvula kwavumela iqela loyilo ukuba lenyuse ubeko lwendawo yebhodi. Ukunciphisa iindlela zombane kunye nokwenza ukuba i-wiring enzulu ngakumbi iphucule ukuthembeka komqondiso kuyilo kunye nokukhawulezisa ukulungiswa kwemiqondiso. Sifumana isibonelelo esongeziweyo koxinano kuba sinciphisa ithuba lokunyanzelwa kunye neengxaki zomthamo.

Uyilo lwe-HDI lwe-PCB alusebenzisi ngemingxunya, kodwa yimingxunya engaboniyo nengcwatyelweyo. Ukubekwa ngokungxolayo nangokuchanekileyo kwemingxunya yokungcwaba kunye nemingxunya engaboniyo kunciphisa uxinzelelo loomatshini kwipleyiti kwaye kuthintela naliphi na ithuba lokulwa. Ukongeza, ungasebenzisa ukutyibilika ngemingxunya ukuphucula amanqaku okudibanisa kunye nokuphucula ukuthembeka. Ukusetyenziswa kwakho kwiipads kunokunciphisa ukulahleka komqondiso ngokunciphisa ukulibaziseka komnqamlezo kunye nokunciphisa iimpembelelo ze-parasitic.

Ukuveliswa kweHDI kufuna ukusebenzisana

Uyilo lweMveliso (DFM) lufuna indlela ecingisisiweyo, echanekileyo yoyilo lwePCB kunye nonxibelelwano oluhambelana nabavelisi kunye nabavelisi. Njengokuba besongeza i-HDI kwipotfoliyo ye-DFM, ingqalelo kwiinkcukacha kuyilo, kwimveliso nakwinqanaba lokuvelisa kuye kwabaluleka nangakumbi kwaye imicimbi yokuhlangana kunye nokuvavanywa kwafuneka ukuba isonjululwe. Ngamafutshane, uyilo, prototyping kunye nenkqubo yokuvelisa ye-HDI PCBS ifuna ukusebenzisana ngokusondeleyo kunye nokuqwalaselwa kwemigaqo ethile ye-DFM esebenzayo kule projekthi.

Enye yemiba esisiseko yoyilo lwe-HDI (kusetyenziswa ukubhola kwelaser) kunokuba ngaphaya komvelisi, isihlanganisi, okanye umenzi, kwaye ifuna unxibelelwano kwicala lesikhokelo malunga nokuchaneka kunye nohlobo lwenkqubo yokomba efunekayo. Ngenxa yenqanaba lokuvula elisezantsi kunye nokuxinana kobeko oluphezulu lwe-HDI PCBS, iqela loyilo kuye kwafuneka liqinisekise ukuba abavelisi kunye nabavelisi banokuhlangabezana nomhlangano, ukuphinda basebenze kunye neemfuno zokuwelda yoyilo lwe-HDI. Ke ngoko, amaqela oyilo asebenza kuyilo lwe-HDI ye-PCB kufuneka abe nobuchule kubuchwephesha obusetyenziselwa ukuvelisa iibhodi.

Yazi izinto zebhodi yesekethe kunye neenkcukacha

Kuba imveliso ye-HDI isebenzisa iintlobo ezahlukeneyo zenkqubo yokomba i-laser, ingxoxo phakathi kweqela loyilo, umenzi kunye nomenzi kufuneka ajolise kuhlobo lweebhodi xa kuxoxwa ngenkqubo yokomba. Isicelo semveliso esinyanzela inkqubo yoyilo sinokuba nobukhulu kunye neemfuno zobunzima ezihambisa incoko kwelinye icala. Izicelo zokuhamba rhoqo zinokufuna izinto ngaphandle kweFR4 esemgangathweni. Ukongeza, izigqibo malunga nohlobo lwezixhobo ze-FR4 zichaphazela izigqibo malunga nokukhethwa kweenkqubo zokomba okanye ezinye izixhobo zokuvelisa. Ngelixa ezinye iinkqubo zibhola ngobhedu ngokulula, ezinye azingeni ngokungena kwimicu yeglasi.

Ukongeza ekukhetheni uhlobo lwezinto ezifanelekileyo, iqela loyilo kufuneka liqinisekise ukuba umenzi kunye nomenzi banokusebenzisa ubukhulu beepleyiti ezichanekileyo kunye neendlela zobugcisa. Ngokusetyenziswa kokomba kwe-laser, umyinge wokuvula uyehla kunye nobunzulu bemingxunya esetyenziselwa ukuzaliswa kwesingxobo kuncipha. Nangona iipleyiti ezijiyileyo zivumela indawo encinci, iimfuno zeprojekhthi zingachaza iipleyiti ezicekeceke ezinokuthi zisilele phantsi kweemeko ezithile zokusingqongileyo. Iqela loyilo kuye kwafuneka liqwalasele ukuba ngaba umenzi unakho na ukusebenzisa ubuchule “be-interconnect layer” kunye nokumba imingxunya kubunzulu obuchanekileyo, kwaye aqinisekise ukuba isisombululo semichiza esisetyenziselwa ukwenza i-electroplating siyayigcwalisa imingxunya.

Sebenzisa itekhnoloji ye-ELIC

Uyilo lwee-PCI ze-HDI ezijikeleze itekhnoloji ye-ELIC lenze ukuba iqela loyilo liphuhlise i-PCBS eqhubele phambili, ebandakanya uluhlu oluninzi lweetreyini ezigcweleyo zobhedu. Njengomphumo we-ELIC, uyilo lwe-PCB lunokuthatha ithuba lokudibanisa, unxibelelwano oluntsonkothileyo olufunekayo kwiisekethe ezinesantya esiphezulu. Ngenxa yokuba i-ELIC isebenzisa i-microholes egcwele ubhedu edityanisiweyo, inokudityaniswa phakathi kwayo nayiphi na imiqolo emibini ngaphandle kokwenza buthathaka ibhodi yesekethe.

Ukukhethwa kwecandelo kuchaphazela uyilo

Naziphi na iingxoxo kunye nabavelisi kunye nabavelisi ngokubhekisele kuyilo lwe-HDI kufuneka zigxile kulwakhiwo oluchanekileyo lwezinto ezixineneyo. Ukukhethwa kwezinto kuchaphazela ububanzi beentambo, isikhundla, isitaki kunye nobungakanani bomngxunya. Umzekelo, uyilo lwe-HDI PCB lubandakanya uluhlu lwegridi yebhola eshinyeneyo (BGA) kunye ne-BGA evulekileyo efuna ukuphuncuka kwepini. Izinto ezonakalisa ukubonelelwa ngombane kunye nokuthembeka komqondiso kunye nokuthembeka kwibhodi kufuneka kuqatshelwe xa kusetyenziswa ezi zixhobo. Ezi zinto zibandakanya ukufezekiswa kokuzahlula phakathi kwezingqimba eziphezulu nezisezantsi ukunciphisa i-crosstalk efanayo kunye nokulawula i-EMI phakathi komaleko wangaphakathi.Amacandelo ahlukaniswe ngokulinganayo aya kunceda ukuthintela uxinzelelo olungalinganiyo kwi-PCB.

Nika ingqalelo umqondiso, amandla kunye nokunyaniseka komzimba

Ukongeza ekuphuculeni ukuthembeka komqondiso, unokuphinda unyuse ukuthembeka kwamandla. Ngenxa yokuba i-HDI PCB ishukumisela umaleko osondeleyo kufutshane nomphezulu, amandla ethembekileyo aphuculwe. Uluhlu oluphezulu lwebhodi lunomaleko womhlaba kunye nombane wokuhambisa umbane, onokuthi uqhagamshelwe kumaleko wokumisa ngokusebenzisa imingxunya engaboniyo okanye ii-microholes, kwaye unciphise inani lemingxunya yenqwelomoya.

I-HDI PCB inciphisa inani leemingxunya ngokusebenzisa umaleko wangaphakathi webhodi. Kwelinye icala, ukunciphisa inani lezinto ezenziwayo kwindiza yamandla kubonelela ngezinto ezintathu ezilungileyo:

Indawo enkulu yobhedu ityisa i-AC kunye ne-DC yangoku kwipini yamandla e-chip

L ukumelana kuyancipha kwindlela yangoku

L Ngenxa yokunyanzeliswa okuphantsi, ukutshintsha ngoku ngokuchanekileyo kunokufunda ipini yamandla.

Elinye inqaku eliphambili lengxoxo kukugcina ubuncinci bomda wobubanzi, isithuba esikhuselekileyo kunye nokufana komkhondo. Kwiphepha lokugqibela, qala ukufezekisa ukulingana kobhedu kunye nokufana kwe-wiring ngexesha lenkqubo yoyilo kwaye uqhubeke ngenkqubo yokuvelisa kunye neyokwenza.

Ukunqongophala kwezithuba ezikhuselekileyo kungakhokelela kwintsalela yefilimu egqithisileyo ngexesha lenkqubo yefilimu eyomileyo yangaphakathi, enokuthi ikhokelele kwiisekethe ezimfutshane. Ngaphantsi kobubanzi bomgca obuncinci kunokubangela iingxaki ngexesha lenkqubo yokutyabeka ngenxa yokufunxa okubuthathaka kunye nesekethe evulekileyo. Amaqela oyilo kunye nabavelisi kufuneka bakuthathele ingqalelo ukugcina ukufana komkhondo njengendlela yokulawula ukungqinelana komgca womqondiso.

Ukuseka nokusebenzisa imigaqo ethile yoyilo

Ubeko loxinano oluphezulu lufuna imilinganiselo emincinci yangaphandle, intambo ecikizekileyo kunye nokushiya isithuba secandelo, kwaye ke ngoko kufuna inkqubo yoyilo eyahlukileyo. Inkqubo yokuvelisa ye-HDI ye-PCB ixhomekeke ekusombeni kwe-laser, isoftware ye-CAD kunye ne-CAM, iinkqubo zokucinga ze-laser ngqo, izixhobo zemveliso ezizodwa, kunye nobungcali bokuqhuba. Impumelelo yayo yonke le nkqubo ixhomekeke kwinxalenye yemithetho yoyilo echonga iimfuno ze-impedance, ububanzi beekhondaktha, ubungakanani bomngxunya, kunye nezinye izinto ezichaphazela ubeko. Developing detailed design rules helps select the right manufacturer or manufacturer for your board and lays the foundation for communication between teams.