Njengoko sonke sisazi, isinki yokufudumeza yindlela yokuphucula ukusasaza ubushushu bezinto ezonyuswe umphezulu ngokusebenzisa Ibhodi PCB. Ngokomgaqo wesakhiwo, kukucwangcisa imingxunya kwibhodi ye-PCB. Ukuba yibhodi enye enamacala amabini ye-PCB, kukudibanisa umphezulu webhodi ye-PCB kunye nefoyile yobhedu ngasemva ukwandisa indawo kunye nevolumu yokuchitha ubushushu, oko kukuthi, ukunciphisa ukuxhathisa kobushushu. Ukuba yibhodi yePCB eyahlukeneyo, inokudityaniswa nomphezulu phakathi kwamanqanaba okanye icandelo eliqingqiweyo lomaleko oxhunyiwe, njl., Umxholo uyafana.

Isiseko sezinto eziphakamileyo zomhlaba kukunciphisa ukuxhathisa kwe-thermal ngokukhwela kwibhodi ye-PCB (substrate). Ukuxhathisa kobushushu kuxhomekeke kummandla wefoyile yobhedu kunye nobukhulu bePCB esebenza njengeradiator, kunye nobukhulu kunye nezinto zePCB. Ngokusisiseko, ukusasaza kobushushu kuphuculwe ngokwandisa indawo, ukwandisa ubukhulu kunye nokuphucula ukuqhuba kobushushu. Nangona kunjalo, njengoko ubukhulu befoyile yobhedu busikelwe umda ngokuthe ngqo kumgangatho, ubukhulu abunakunyuswa ngokungaboni. Ukongeza, kule mihla i-miniaturization iye yaba yimfuno esisiseko, hayi kuba ufuna indawo ye-PCB, kwaye enyanisweni, ubukhulu befoyile yobhedu abukhuni, ke xa idlula indawo ethile, ayizukufumana isiphumo sokusasaza ubushushu esihambelana nendawo.

Esinye sezisombululo kwezi ngxaki kukuntywila kobushushu. Ukuze usebenzise isinki yobushushu ngokufanelekileyo, kubalulekile ukubeka isinki yobushushu kufutshane nezinto ezifudumezayo, ezinje ngokuthe ngqo phantsi kwecandelo. Njengoko kubonisiwe kumzobo ongezantsi, kunokubonwa ukuba yindlela elungileyo yokusebenzisa isiphumo sokulinganisa ubushushu ukudibanisa indawo kunye neqondo lobushushu elikhulu.

Ingxoxo malunga noqwalaselo lomngxunya wokutshatyalaliswa kobushushu kuyilo lwePCB

Ukuqwalaselwa kwemingxunya yokuhambisa ubushushu

Oku kulandelayo kuchaza umzekelo wobeko oluthile. Apha ngezantsi ngumzekelo wobeko kunye nobungakanani bomngxunya wobushushu besinki yeHTSOP-J8, iphakheji yokutsala ubushushu yangasemva.

Ukuze kuphuculwe ukuqhutywa kobushushu bomngxunya wokutshatyalaliswa kobushushu, kuyacetyiswa ukuba kusetyenziswe umngxunya omncinci onobubanzi obungaphakathi malunga ne-0.3mm enokugcwaliswa ngokufakelwa kombane. Kubalulekile ukuba uqaphele ukuba i-solder creep ingenzeka ngexesha lokucocwa kwakhona kokuvula ukuba indawo enkulu kakhulu.

Imingxunya yokusasaza ubushushu imalunga nama-1.2mm ngokwahlukana, kwaye icwangciswe ngokuthe ngqo phantsi kwesinki yobushushu ngasemva kwephakheji. Ukuba kuphela isinki yokufudumeza ngasemva ayonelanga ukufudumeza, unokucwangcisa imingxunya yokuhambisa ubushushu ejikeleze i-IC. Inqaku loqwalaselo kule meko kukumisela ngokusondeleyo kwi-IC kangangoko kunokwenzeka.

Ingxoxo malunga noqwalaselo lomngxunya wokutshatyalaliswa kobushushu kuyilo lwePCB

Ngokumalunga nobumbeko kunye nobungakanani bomngxunya wokupholisa, inkampani nganye inolwazi lwayo lobuchwephesha, kwezinye iimeko inokuthi ibekwe emgangathweni, ke ngoko, nceda ujonge umxholo ongentla ngokwengxoxo ethile, ukuze ufumane iziphumo ezingcono. .

Amanqaku aphambili:

Umngxunya wokutshabalalisa ubushushu yindlela yokufudumeza ubushushu ngejelo (ngembobo) yebhodi yePCB.

Umngxunya wokupholisa kufuneka uqwalaselwe ngokuthe ngqo ngaphantsi kwento yokufudumeza okanye kufutshane nendawo yokufudumeza ngokusemandleni.