What is the difference between LED packaged PCB and DPC ceramic PCB?

Prosperous cities are inseparable from the decoration of LED lights. I believe we have all seen LED. Its figure has appeared in every place of our lives and illuminates our lives.

As the carrier of heat and air convection, the thermal conductivity of Power LED packaged PCB idlala indima ebonakalayo kwisibetho sobushushu kwi-LED. I-DPC PCB yodongwe kunye nokusebenza kwayo okugqwesileyo kunye namaxabiso ancitshisiweyo ngokuthe ngcembe, kwizinto ezininzi zokupakisha ze-elektroniki zibonisa ukhuphiswano olomeleleyo, lixesha elizayo lokukhulisa ukupakisha kwe-LED. Ngokuphuhliswa kwesayensi kunye netekhnoloji kunye nokuvela kwetekhnoloji entsha yokulungiselela, ukuhambisa okuphezulu kwe-thermal izinto ze-ceramic njengezinto ezintsha zokupakisha ze-PCB zombane zinethemba lesicelo elibanzi kakhulu.

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Itekhnoloji yokupakisha ye-LED ikakhulu iphuhlisiwe kwaye yavela ngokusekwe kwitekhnoloji yokupakisha yezixhobo, kodwa ineenkcukacha ezithile. Ngokubanzi, isiseko sedivayisi edibeneyo sitywinwe emzimbeni wephakheji. Owona msebenzi uphambili kukukhusela isiseko kunye nokudibana kombane ngokupheleleyo. Kwaye ukupakishwa kwe-LED kukugqibezela ukukhutshwa kwemiqondiso yombane, ukukhusela umsebenzi oqhelekileyo wombindi wombhobho, ukuphuma: ukukhanya kokukhanya, zombini iiparameter zombane, kunye neeparitha ezibonakalayo zedizayini kunye neemfuno zobuchwephesha, akunakuba nje kukupakisha kwezixhobo ze-LED.

Ngophuculo oluqhubekayo lwamandla efakelo ye-chip ye-LED, isixa esikhulu sobushushu esiveliswa kukusasazeka kwamandla okuphezulu kubeka phambili iimfuno eziphezulu zezinto zokupakisha ze-LED. Kwisiteshi sokusasaza ubushushu se-LED, ipakethe ye-PCB sisixhobo esiphambili sokudibanisa isiteshi sokuhambisa ubushushu sangaphakathi nangaphandle, sinemisebenzi yokuhambisa ubushushu, uqhagamshelo lwesekethe kunye nenkxaso yomzimba. Iimveliso ze-LED ezinamandla amakhulu, ukupakishwa kwePCBS kufuna ukufakwa kombane okuphezulu, ukuqhuba okuphezulu kobushushu kunye nokwandiswa kokulingana kokufudumeza okuhambelana ne-chip.

Isisombululo esele sikhona kukuncamathisela i-chip ngokuthe ngqo kwiradiyetha yobhedu, kodwa irediyetha yobhedu yona iyisiteshi esiqhubayo. Ngokubhekisele kwimithombo yokukhanya, ukwahlulwa kwe-thermoelectric akuphumelelanga. Ekugqibeleni, umthombo wokukhanya upakishwe kwibhodi ye-PCB, kwaye umaleko wokugquma usafuneka ukufezekisa ukwahlukana kwethermelectric. Okwangoku, nangona ubushushu bungagxili kwi-chip, bujolise kufutshane nobushushu obungaphantsi komthombo wokukhanya. Njengoko amandla esanda, kuvela iingxaki zobushushu. I-DPC substrate yodongwe ingasombulula le ngxaki. Ingayilungisa i-chip ngqo kwi-ceramic kwaye yenze umngxunya wokudibanisa ngokuthe nkqo kwi-ceramic ukwenza ijelo elizimeleyo langaphakathi lokuqhuba. Iiceramics ngokwazo zizinto zokufudumeza, ezichitha ubushushu. Oku kwahlulahlula amandla ombane kwinqanaba lomthombo wokukhanya.

Kwiminyaka yakutshanje, ii-SMD ze-LED zixhasa zihlala zisebenzisa ubushushu obuphezulu bezinto zobunjineli, zisebenzisa i-PPA (polyphthalamide) resin njengezinto ezingavuthiyo, kunye nokongeza iifilitha eziguqulweyo ukomeleza iipropathi zomzimba kunye neekhemikhali zePPA. Ke ngoko, izinto ze-PPA zikulungele ngakumbi ukubumba ngenaliti kunye nokusetyenziswa kwezibiyeli ze-SMD ze-LED. I-PPA yeplastiki yokuqhuba kwe-thermal isezantsi kakhulu, ukusasazeka kobushushu kwayo ikakhulu ngesakhelo sesinyithi esikhokelayo, amandla okusasaza ubushushu anqabile, afanelekile kuphela kupakisho lwamandla aphantsi e-LED.

 

Ukuze usombulule ingxaki yokwahlulahlula amandla ombane kwinqanaba lomthombo wokukhanya, ii-substrates ze-ceramic kufuneka zibe nezi mpawu zilandelayo: okokuqala, kufuneka ibe ne-thermal conductivity ephezulu, ii-odolo ezininzi zobukhulu obuphezulu kune-resin; Okwesibini, kufuneka ibe namandla okusonga aphezulu; Okwesithathu, isiphaluka sinesisombululo esiphezulu kwaye sinokudityaniswa okanye sitsibishwe ngokuthe nkqo nge-chip ngaphandle kwengxaki. Okwesine kukuphakama komphezulu ophezulu, ngekhe kubekho sithuba xa udibanisa. Okwesihlanu, iiseramikhi kunye nezinyithi kufuneka zibambelele kakhulu; Owesithandathu kukunxibelelana nkqo ngapha nangapha kwemingxunya, ke oko kwenza ukuba ukubethelelwa kwe-SMD kukhokele isekethe ukusuka ngasemva ukuya ngaphambili. Ekuphela komhlathana ohlangabezana nale miqathango yi-DPC yodongwe olungaphantsi.

I-ceramic substrate ene-conductivity ephezulu ye-thermal inokuphucula ukusebenza kakuhle kobushushu, yeyona mveliso ifanelekileyo ekuphuhlisweni kwamandla amakhulu, ubungakanani be-LED encinci. I-Ceramic PCB inezinto ezintsha zokuhambisa ubushushu kunye nesakhiwo esitsha sangaphakathi, esenza iziphene ze-aluminium PCB kunye nokuphucula ukusebenza ngokubanzi kwe-PCB. Phakathi kwezinto ze-ceramic ezisetyenziselwa ukupholisa i-PCBS, i-BeO ine-conductivity ephezulu yokushisa, kodwa i-coefficient yayo yokwandiswa komgca ihluke kakhulu kwi-silicon, kunye nobutyhefu bayo ngexesha lokuvelisa umda isicelo sayo. I-BN isebenza kakuhle ngokubanzi, kodwa isetyenziswa njenge-PCB. Imathiriyeli ayinazibonelelo zibalaseleyo kwaye iyabiza. Kungoku nje kuyafundwa kwaye kuphakanyiswe; I-silicon carbide inamandla aphezulu kunye ne-conductivity ephezulu ye-thermal, kodwa ukuxhathisa kwayo kunye nokuchasana kwe-insulation kuphantsi, kwaye indibaniselwano emva kokunyibilikiswa kwesinyithi ayizinzanga, eya kuthi ikhokelele kutshintsho lwendlela yokuqhuba kwe-thermal kunye ne-dielectric rhoqo ayikufanelanga ukusetyenziswa njenge-insulating impahla yePCB.

I believe that in the future, when science and technology are more developed, LED will bring greater convenience to our life in more kinds of ways, which requires our researchers to study harder, so as to contribute their own strength to the development of science and technology.