Unobangela PCB isekethe yangaphakathi emfutshane

Impembelelo yezinto zokwenza imveliso kwisekethe yangaphakathi emfutshane:

Uzinzo olubonakalayo lwezinto ze-multilayer PCB zezona zinto ziphambili ezichaphazela ukubekwa ngokuchanekileyo kokuma kwangaphakathi. Impembelelo yokwanda kwe-thermal coefficient of substrate kunye ne-foil foil kumaleko wangaphakathi we-multilayer PCB nayo kufuneka ithathelwe ingqalelo. Ukusuka kuhlalutyo lweempawu zomzimba ze-substrate esetyenzisiweyo, ii-laminates ziqukethe iipolymers, ezitshintsha eyona nto iphambili kubushushu obuthile, obaziwa ngokuba liqondo lokutshintsha kweglasi (ixabiso le-TG). Ubushushu beglasi yotshintsho luphawu lwenani elikhulu lepolymer, ecaleni kwendlela yokwandisa i-thermal, lolona phawu lubaluleke kakhulu laminate. Xa kuthelekiswa ezi zinto zimbini ziqhele ukusetyenziswa, ubushushu beglasi yotshintsho lwe-epoxy yeglasi yelinen laminate kunye ne-polyimide yi-Tg120 ℃ kunye ne-230 ℃ ngokwahlukeneyo. Phantsi kwemeko ye-150 ℃, ukwanda kwendalo kwe-epoxy yeglasi yelaminethi emalunga ne-0.01in / ngaphakathi, ngelixa ulwandiso lwendalo lwe-polyimide luyi-0.001in / in kuphela.

Ngokwedatha efanelekileyo yezobuchwephesha, ukwanda komlingani we-thermal we-laminates kwi-X kunye ne-Y yindlela eyi-12-16ppm / ℃ kulonyuso ngalunye lwe-1 ℃, kunye nomlinganiso wokwanda kwe-thermal kwicala le-Z yi-100-200ppm / ℃, eyonyukayo ngokomyalelo wobukhulu kunolo lwalathiso X kunye no-Y. Nangona kunjalo, xa ubushushu budlula i-100 ℃, kufunyaniswa ukuba ukwanda kwe-z-axis phakathi kwe-laminates kunye ne-pores akuhambelani kwaye umahluko uba mkhulu. Ukufakwa kombane kwimingxunya kunenqanaba elisezantsi lokwanda kwendalo kunee-laminates ezijikelezileyo. Kuba ukwandiswa kwe-laminate ye-thermal kuyakhawuleza kunaleyo ye-pore, oku kuthetha ukuba i-pore yoluliwe kwicala lokumka kwe-laminate. Le meko yoxinzelelo ivelisa uxinzelelo lokuqina emzimbeni ongena emngxunyeni. Xa ubushushu bonyuka, uxinzelelo lokuqina luya kuqhubeka ukwanda. Xa uxinzelelo ligqitha kumandla okophuka kwengubo egqobhoziweyo, ukutyabeka kuya kwaphuka. Kwangelo xesha, ukonyuka okuphezulu kwe-thermal kwinqanaba le-laminate kwenza uxinzelelo kuthungelwano lwangaphakathi kunye nephedi inyuke ngokucacileyo, kukhokelela ekuqhekekeni kocingo kunye nephedi, okukhokelela kwisekethe emfutshane yomaleko wangaphakathi wePCB eyahlukeneyo . Ke ngoko, ekwenziweni kwe-BGA kunye nolunye uhlobo olupakishe ubungakanani bePCB yeemfuno zobuchwephesha, kufuneka kwenziwe uhlalutyo olukhethekileyo, ukukhethwa kwe-substrate kunye nefoyile yobhedu yokwanda komlinganiso wobushushu kufuneka kungqinelane.

Okwesibini, impembelelo yendlela yokuchaneka kwenkqubo yokuma kwisekethe yangaphakathi emfutshane

Indawo iyimfuneko ekwakhiweni kwefilimu, kwimizobo yesekethe, kwi-lamination, lamination and drilling, kwaye indlela yendlela yendawo ekufuneka ifundwe kwaye ihlalutywe ngononophelo. Ezi mveliso zigqityiweyo ezifuna ukubekwa ziya kuzisa uthotho lweengxaki zobuchwephesha ngenxa yomahluko ekubekeni ngokuchanekileyo. Ukungakhathali okuncinci kuya kukhokelela kwisenzeko esifutshane kwisangqa sangaphakathi sePCB eyahlukeneyo. Luhlobo luni lwendlela yokubeka ekufuneka ikhethwe ngokuxhomekeke kukuchaneka, ukusebenza kunye nokusebenza kokuma.

Isithathu, ifuthe lomgangatho wangaphakathi wokutsalwa kwisekethe yangaphakathi emfutshane

Inkqubo yokudibanisa ilula kulula ukuvelisa ubhedu obushiyekileyo ukuya esiphelweni senqaku, ubhedu olushiyekileyo ngamanye amaxesha lincinci kakhulu, ukuba alusetyenziswanga ngumvavanyi we-optical lusebenzisa ukukhangela okunomdla, kwaye kunzima ukufumana ngombono wamehlo ohamba ze, iya kuziswa kwinkqubo yokukhutshelwa, intsalela yobhedu yokucinezela ngaphakathi kwe-PCB ye-multilayer, ngenxa yokuxinana kwangaphakathi kuphezulu kakhulu, eyona ndlela ilula yokufumana ubhedu olushiyekileyo lufumene i-PCB ye-multilayer PCB ebangelwe sisiphaluka esifutshane phakathi kwezi zimbini iingcingo.

4. Impembelelo yeenkqubo zokulaminetha kwiparameter yangaphakathi emfutshane

Umaleko wangaphakathi weplate kufuneka ubekwe ngokusebenzisa isikhonkwane sokubekwa xa kulaminishwa. Ukuba uxinzelelo olusetyenzisiweyo xa ufaka ibhodi alufani, umngxunya wokubekwa kwipleyiti yangaphakathi uya kukhubazeka, uxinzelelo lwe-shear kunye noxinzelelo lwentsalela ebangelwe luxinzelelo oluthathwe ngokucinezela nazo zinkulu, kwaye umaleko wokuncipha kunye nezinye izizathu kubangele ukuba umaleko wangaphakathi we-PCB eyahlukeneyo uvelise isekethe emfutshane kunye nezinto ezilahliweyo.

Kwisihlanu, ifuthe lokubhola komgangatho kwisekethe yangaphakathi emfutshane

1. Hole Uhlalutyo lwempazamo yendawo

Ukufumana umgangatho ophezulu kunye nokuthembeka koxhumano lombane, ukudibanisa phakathi kwepedi kunye nocingo emva kokumba kufuneka kugcinwe ubuncinci be-50μm. Ukugcina ububanzi obuncinci obunjalo, indawo emngxunyeni wokugrumba kufuneka ichaneke kakhulu, ivelise impazamo engaphantsi okanye elingana neemfuno zobuchwephesha zokunyamezelana okucetywayo yinkqubo. Kodwa imposiso indawo umngxuma umngxuma kusombiwa ubukhulu becala kumiselwa ngqo kumatshini kusombiwa, ijiyometri of kusombiwa kancinane, iimpawu inshorensi pad kunye parameter zeteknoloji. Uhlalutyo olunamandla oluqokelelwe kwinkqubo yokwenyani yemveliso lubangelwa zizinto ezine: ukuphakama okubangelwe kukungcangcazela komatshini wokugrumba ngokunxulumene nendawo yokwenyani yomngxuma, ukuphambuka kwesitishi, isiliphu esibangelwa kukungena kancinci kwinqanaba le-substrate , kunye deformation ukugoba okubangelwa ukuxhathisa iglasi ifayibha kunye ukusika ukusika emva kancinane ukungena zeendawana. Ezi zinto ziya kubangela ukuphambuka kwendawo yomngxunya ongaphakathi kunye nokubanokwenzeka kwesekethe emfutshane.

2. Ngokokuphambuka kwesithuba somngxunya okwenziwe ngentla apha, ukuze kusonjululwe kwaye kupheliswe ukubakho kwempazamo egqithileyo, kuyacetyiswa ukuba kuthathwe inkqubo yenkqubo yokugrumba, enokunciphisa kakhulu umphumo wokupheliswa kokucolwa kokucheba kunye nokunyuka kwamaqondo obushushu. Ke ngoko, kuyafuneka ukuba utshintshe ijiyometri encinci (indawo enqamlezayo, ubukhulu be-taper, i-chip groove Angle, i-chip groove kunye nobude kumda webhendi, njl njl.) Ukwandisa ukomelela kancinci, kunye nokuchaneka kwendawo ekuyo iphuculwe kakhulu. Kwangelo xesha, kufuneka ukhethe ngokuchanekileyo ipleyiti yokugubungela kunye nenkqubo yokumba iiparameter ukuqinisekisa ukuba ukuchaneka komngxunya wokugrumba ngaphakathi kwenqanaba lenkqubo. Ukongeza kwezi ziqinisekiso zingasentla, izizathu zangaphandle kufuneka nazo ziqwalaselwe. Ukuba ukubekwa kwangaphakathi akuchanekanga, xa kusombiwa ukuphambuka komngxunya, kukhokelela kwisekethe yangaphakathi okanye kwisekethe emfutshane.