Ipilẹ Erongba ti PCB ọkọ

Ipilẹ Erongba ti PCB ọkọ

1. Agbekale ti “Layer”
Iru si imọran ti “Layer” ti a ṣe sinu sisọ ọrọ tabi ọpọlọpọ sọfitiwia miiran lati mọ itẹ-ẹiyẹ ati iṣelọpọ ti awọn aworan, ọrọ, awọ, ati bẹbẹ lọ, “Layer” Protel kii ṣe foju, ṣugbọn ohun elo igbimọ ti a tẹjade gangan funrararẹ Ni awọn oriṣiriṣi oriṣiriṣi. Ejò bankanje fẹlẹfẹlẹ. Lasiko yi, nitori awọn ipon fifi sori ẹrọ ti itanna Circuit irinše. Awọn ibeere pataki gẹgẹbi egboogi-kikọlu ati onirin. Awọn igbimọ ti a tẹjade ti a lo ni diẹ ninu awọn ọja itanna tuntun kii ṣe ni awọn ẹgbẹ oke ati isalẹ nikan fun wiwọ, ṣugbọn tun ni awọn foils interlayer Ejò ti o le ṣe ni ilọsiwaju pataki ni aarin awọn igbimọ naa. Fun apẹẹrẹ, awọn modaboudu kọmputa lọwọlọwọ lo. Pupọ julọ awọn ohun elo igbimọ ti a tẹjade jẹ diẹ sii ju awọn fẹlẹfẹlẹ 4. Nitoripe awọn fẹlẹfẹlẹ wọnyi nira pupọ lati ṣe ilana, wọn lo pupọ julọ lati ṣeto awọn fẹlẹfẹlẹ onirin agbara pẹlu wiwu ti o rọrun (gẹgẹbi Ground Dever ati Power Dever ninu sọfitiwia), ati nigbagbogbo lo awọn ọna kikun agbegbe fun wiwọ (bii ExternaI). P1a11e ati Fọwọsi sọfitiwia naa). ). Nibiti awọn ipele oke ati isalẹ ati awọn ipele aarin nilo lati sopọ, eyiti a pe ni “nipasẹ” ti a mẹnuba ninu sọfitiwia naa ni a lo lati baraẹnisọrọ. Pẹlu alaye ti o wa loke, ko ṣoro lati ni oye awọn imọran ti o jọmọ ti “paadi-ọpọlọpọ” ati “eto Layer wiring”. Lati fun apẹẹrẹ ti o rọrun, ọpọlọpọ awọn eniyan ti pari wiwi ati rii pe ọpọlọpọ awọn ebute ti a ti sopọ ko ni awọn paadi nigbati wọn ba tẹ jade. Ni otitọ, eyi jẹ nitori pe wọn kọju si imọran ti “awọn fẹlẹfẹlẹ” nigbati wọn ṣafikun ile-ikawe ẹrọ ati pe wọn ko fa ati ṣajọ ara wọn. Iwa paadi naa ni asọye bi “Multiyer (Mulii-Layer). O yẹ ki o leti pe ni kete ti a ti yan nọmba awọn fẹlẹfẹlẹ ti igbimọ titẹjade ti a lo, rii daju pe o tii awọn ipele ti a ko lo wọnyẹn lati yago fun awọn wahala ati awọn ọna ọna.

ipcb

2. Via (Via)

ni ila ti o so awọn fẹlẹfẹlẹ, ati iho ti o wọpọ ti wa ni ti gbẹ iho ni Wenhui ti awọn okun waya ti o nilo lati wa ni asopọ lori kọọkan Layer, ti o jẹ nipasẹ iho. Ninu ilana naa, ipele ti irin ti wa ni titan lori oju iyipo ti ogiri iho ti nipasẹ nipasẹ ifisilẹ kemikali lati so bankanje idẹ ti o nilo lati sopọ si awọn ipele aarin, ati awọn ẹgbẹ oke ati isalẹ ti nipasẹ ti wa ni ṣe. sinu awọn apẹrẹ paadi lasan, eyiti o le jẹ taara O ti sopọ pẹlu awọn ila ni awọn ẹgbẹ oke ati isalẹ, tabi ko sopọ. Ni gbogbogbo, awọn ipilẹ atẹle wa fun itọju ti vias nigbati o ṣe apẹrẹ Circuit kan:
(1) Minimize the use of vias. Once a via is selected, be sure to handle the gap between it and the surrounding entities, especially the gap between the lines and the vias that are easily overlooked in the middle layers and the vias. If it is Automatic routing can be solved automatically by selecting the “on” item in the “Minimize the number of vias” (Via Minimiz8TIon) submenu.
(2) The larger the current-carrying capacity required, the larger the size of the required vias. For example, the vias used to connect the power layer and ground layer to other layers will be larger.

3. silk screen layer (Overlay)

In order to facilitate the installation and maintenance of the circuit, the required logo patterns and text codes are printed on the upper and lower surfaces of the printed board, such as component label and nominal value, component outline shape and manufacturer logo, production date, etc. When many beginners design the relevant content of the silk screen layer, they only pay attention to the neat and beautiful placement of the text symbols, ignoring the actual PCB effect. On the printed board they designed, the characters were either blocked by the component or invaded the soldering area and wiped off, and some of the components were marked on the adjacent components. Such various designs will bring a lot to assembly and maintenance. inconvenient. The correct principle for the layout of the characters on the silk screen layer is: “no ambiguity, stitches at a glance, beautiful and generous”.

4. Awọn pato ti SMD

There are a large number of SMD packages in the Protel package library, that is, surface soldering devices. The biggest feature of this type of device in addition to its small size is the single-sided distribution of pin holes. Therefore, when choosing this type of device, it is necessary to define the surface of the device to avoid “missing pins (Missing Plns)”. In addition, the relevant text annotations of this type of component can only be placed along the surface where the component is located.

5. Grid-like filling area (External Plane) and filling area (Fill)

Just like the names of the two, the network-shaped filling area is to process a large area of ​​copper foil into a network, and the filling area only keeps the copper foil intact. Beginners often can’t see the difference between the two on the computer in the design process, in fact, as long as you zoom in, you can see it at a glance. It is precisely because it is not easy to see the difference between the two in normal times, so when using it, it is even more careless to distinguish between the two. It should be emphasized that the former has a strong effect of suppressing high-frequency interference in circuit characteristics, and is suitable for needs. Places filled with large areas, especially when certain areas are used as shielded areas, partitioned areas, or high-current power lines are particularly suitable. The latter is mostly used in places where a small area is required such as general line ends or turning areas.

6. paadi

Paadi ni igbagbogbo ti a kan si ati imọran pataki julọ ni apẹrẹ PCB, ṣugbọn awọn olubere ṣọ lati foju yiyan ati iyipada rẹ, ati lo awọn paadi ipin ni apẹrẹ kanna. Yiyan iru paadi ti paati yẹ ki o gbero ni kikun apẹrẹ, iwọn, ipilẹ, gbigbọn ati awọn ipo alapapo, ati itọsọna ipa ti paati naa. Protel n pese lẹsẹsẹ awọn paadi ti awọn titobi oriṣiriṣi ati awọn nitobi ninu ile-ikawe package, bii yika, square, octagonal, yika ati awọn paadi ipo, ṣugbọn nigbakan eyi ko to ati pe o nilo lati ṣatunkọ funrararẹ. Fun apẹẹrẹ, fun awọn paadi ti o ṣe ina ooru, ti wa labẹ wahala ti o tobi ju, ati pe o wa lọwọlọwọ, wọn le ṣe apẹrẹ si “apẹrẹ omije”. Ni awọn faramọ awọ TV PCB ila wu transformer pin pad design, ọpọlọpọ awọn olupese wa ni o kan Ni yi fọọmu. Ni gbogbogbo, ni afikun si eyi ti o wa loke, awọn ipilẹ wọnyi yẹ ki o gbero nigbati o ba n ṣatunkọ paadi funrararẹ:

(1) When the shape is inconsistent in length, consider the difference between the width of the wire and the specific side length of the pad not too large;

(2) Nigbagbogbo o jẹ dandan lati lo awọn paadi asymmetric pẹlu ipari asymmetric nigbati o ba n lọ laarin awọn igun asiwaju paati;

(3) Awọn iwọn ti kọọkan paati paadi iho yẹ ki o wa satunkọ ati pinnu lọtọ gẹgẹ bi awọn sisanra ti awọn pin paati. Ilana naa ni pe iwọn iho jẹ 0.2 si 0.4 mm tobi ju iwọn ila opin pin lọ.

7. Various types of membranes (Mask)

Awọn fiimu wọnyi kii ṣe pataki nikan ni ilana iṣelọpọ PCB, ṣugbọn tun jẹ ipo pataki fun alurinmorin paati. Ni ibamu si ipo ati iṣẹ ti “membrane”, “membrane” le pin si dada paati (tabi dada soldering) boju-boju tita (TOp tabi Isalẹ) ati dada paati (tabi dada soldering) boju solder (TOp tabi BottomPaste BottomPaste) . Gẹgẹbi orukọ naa ṣe tumọ si, fiimu titaja jẹ ipele ti fiimu ti a lo si paadi lati mu ilọsiwaju solderability, iyẹn ni, awọn iyika awọ-ina lori igbimọ alawọ ewe jẹ diẹ sii ju paadi lọ. Awọn ipo ti awọn solder boju jẹ o kan idakeji, fun Lati mu awọn ti pari ọkọ lati igbi soldering ati awọn miiran soldering awọn ọna, o ti wa ni ti beere wipe Ejò bankanje ni ti kii-paadi lori awọn ọkọ ko le wa ni tinned. Nitorina, a gbọdọ lo awọ kan si gbogbo awọn ẹya miiran yatọ si paadi lati ṣe idiwọ tin lati lo si awọn ẹya wọnyi. A le rii pe awọn membran meji wọnyi wa ni ibatan ibaramu. Lati inu ijiroro yii, ko nira lati pinnu akojọ aṣayan
Awọn ohun kan bii “Iboju-boju En1argement solder” ti ṣeto.

8. Ila ti n fo, laini fo ni itumo meji:

(1) Asopọ okun rọba-bi asopọ nẹtiwọki fun akiyesi lakoko wiwakọ laifọwọyi. Lẹhin ikojọpọ awọn paati nipasẹ tabili nẹtiwọọki ati ṣiṣe ipilẹ alakoko, o le lo “Aṣẹ Fihan” lati wo ipo adakoja ti asopọ nẹtiwọọki labẹ ifilelẹ, Nigbagbogbo ṣatunṣe ipo awọn paati lati dinku adakoja yii lati gba adaṣe ti o pọju oṣuwọn afisona. Igbese yii ṣe pataki pupọ. A le sọ pe ki o pọ ọbẹ ki o ma ṣe ge igi naa ni aṣiṣe. O gba akoko diẹ sii ati iye! Ni afikun, lẹhin ti ẹrọ onirin laifọwọyi ti pari, eyiti awọn nẹtiwọọki ko ti gbe lọ, o tun le lo iṣẹ yii lati wa. Lẹhin wiwa nẹtiwọki ti ko ni asopọ, o le san owo pada pẹlu ọwọ. Ti ko ba le sanpada, itumọ keji ti “laini ti n fo” ni a lo, eyiti o jẹ lati so awọn nẹtiwọọki wọnyi pọ pẹlu awọn okun waya lori igbimọ titẹjade ọjọ iwaju. O yẹ ki o jẹwọ pe ti igbimọ Circuit ba jẹ iṣelọpọ laini iṣelọpọ lọpọlọpọ, adari fò yii le jẹ apẹrẹ bi ipin resistance pẹlu iye resistance ohm 0 ati aye paadi aṣọ kan.