Ukusebenza Nokulingiswa Kwefilimu ye-OSP Kunqubo Engaholeleki Ye PCB Kopisha Ibhodi

I-OSP (i-Organic Solderable Protective Film) ibhekwa njengenqubo yokwelashwa engcono kakhulu ngenxa yokudayiswa kwayo okuhle kakhulu, inqubo elula kanye nezindleko eziphansi.

Kuleli phepha, i-thermal desorption-gas chromatography-mass spectrometry (TD-GC-MS), ukuhlaziywa kwe-thermogravimetric (TGA) kanye ne-photoelectron spectroscopy (XPS) isetshenziselwa ukuhlaziya izici zokumelana nokushisa kwesizukulwane esisha samafilimu e-OSP amelana nokushisa okuphezulu. I-Chromatography yegesi ihlola izingxenye ezincane zamangqamuzana efilimu ye-OSP emelana nezinga lokushisa eliphezulu (HTOSP) ethinta ukuthengiswa. Ngesikhathi esifanayo, kubonisa ukuthi i-alkylbenzimidazole-HT efilimu ye-OSP ephikisana nokushisa okuphezulu inokuguquguquka okuncane kakhulu. Idatha ye-TGA ibonisa ukuthi ifilimu ye-HTOSP inezinga lokushisa eliphezulu lokuwohloka kunefilimu ye-OSP evamile yemboni. Idatha ye-XPS ikhombisa ukuthi ngemuva kokugeleza kabusha okungaholeli okungu-5 kwe-OSP yezinga lokushisa eliphezulu, okuqukethwe komoyampilo kukhuphuke ngo-1%. Lokhu kuthuthukiswa okungenhla kuhlobene ngokuqondile nezidingo zokuthengiselana okungenayo i-lead-free solderability.

Ifilimu ye-OSP isetshenziswe kumabhodi wesekethe iminyaka eminingi. Ifilimu ye-polymer ye-organometallic eyakhiwe ukusabela kwenhlanganisela ye-azole enezici zensimbi eziguqukayo, njengethusi ne-zinc. Ucwaningo oluningi [1,2,3] luye lwembula indlela yokuvimbela ukugqwala kwama-azole compounds ezindaweni zensimbi. I-GPBrown [3] ihlanganise ngempumelelo i-benzimidazole, ithusi (II), i-zinc (II) nezinye izakhi zensimbi eziguqukayo zama-polymers e-organometallic, futhi yachaza ukumelana nezinga lokushisa eliphezulu okuhle kakhulu kwe-poly(benzimidazole-zinc) ngesici se-TGA. Idatha ye-TGA ye-GPBrown ikhombisa ukuthi izinga lokushisa lokuwohloka kwe-poly(benzimidazole-zinc) liphakeme lifinyelela ku-400°C emoyeni kanye no-500°C emkhathini we-nitrogen, kanti izinga lokushisa le-poly(benzimidazole-copper) lingama-250°C kuphela. . Ifilimu entsha esanda kwakhiwa ye-HTOSP isuselwe kumakhemikhali e-poly(benzimidazole-zinc), ekwazi ukumelana nokushisa okungcono kakhulu.

Ifilimu ye-OSP ikakhulukazi yakhiwe ama-polymers e-organometallic nama-molecule amancane e-organic afakwe phakathi nenqubo yokubeka, njengama-fatty acids nama-azole compounds. Ama-polymers e-Organometallic ahlinzeka ngokumelana nokugqwala okudingekayo, ukunamathela kwendawo yethusi, nobulukhuni bobuso be-OSP. Izinga lokushisa lokuwohloka kwe-polymer ye-organometallic kufanele libe phezulu kunephuzu lokuncibilika le-solder engenamthofu ukuze imelane nenqubo yokungaholeli. Uma kungenjalo, ifilimu ye-OSP izokwehlisa isithunzi ngemva kokucubungula inqubo engenamthofu. Izinga lokushisa lokuwohloka kwefilimu ye-OSP lincike kakhulu ekumelaneni nokushisa kwe-polymer ye-organometallic. Esinye isici esibalulekile esithinta ukumelana ne-oxidation yethusi ukuguquguquka kwezinhlanganisela ze-azole, njenge-benzimidazole ne-phenylimidazole. Ama-molecule amancane efilimu ye-OSP azohwamuka ngesikhathi senqubo yokugeleza kabusha okungaholeli, okuzothinta ukumelana ne-oxidation yethusi. I-gas chromatography-mass spectrometry (GC-MS), ukuhlaziywa kwe-thermogravimetric (TGA) kanye ne-photoelectron spectroscopy (XPS) kungasetshenziswa ukuchaza ngokwesayensi ukumelana nokushisa kwe-OSP.

1. Ukuhlaziywa kwe-gas chromatography-mass spectrometry

Amapuleti ethusi ahloliwe ayegcotshwe: a) ifilimu entsha ye-HTOSP; b) ifilimu ye-OSP ejwayelekile yemboni; kanye c) nenye ifilimu ye-OSP yezimboni. Khwebula cishe u-0.74-0.79 mg wefilimu ye-OSP epuleti lethusi. Lawa mapuleti e-copper amboziwe kanye namasampuli aklwetshiwe awakenzi noma yikuphi ukwelashwa kokugeleza kabusha. Lokhu kuhlolwa kusebenzisa ithuluzi le-H/P6890GC/MS, futhi kusebenzisa isirinji ngaphandle kwesipetu. Amasirinji angenasisirinji angakwazi ukukhipha ngokuqondile amasampula aqinile egumbini lesampula. Isipetu esingenayo isipetu singadlulisela isampula eshubhuni lengilazi elincane liye endaweni yokungena ye-chromatograph yegesi. Igesi yenkampani yenethiwekhi ingaletha ngokuqhubekayo izinhlanganisela zezinto eziphilayo ezishintshashintshayo kukholamu ye-chromatograph yegesi ukuze iqoqwe futhi ihlukaniswe. Beka isampula eduze kwaphezulu kwekholomu ukuze ukuchithwa kwe-thermal kuphindwe ngempumelelo. Ngemva kokukhishwa kwamasampula anele, i-gas chromatography yaqala ukusebenza. Kulesi sivivinyo, kusetshenziswe ikholomu ye-gas chromatography ye-RestekRT-1 (0.25mmid×30m, ukujiya kwefilimu okungu-1.0μm). Uhlelo lokwenyuka kwezinga lokushisa lwekholomu ye-gas chromatography: Ngemva kokushisa ku-35°C imizuzu engu-2, izinga lokushisa liqala ukuphakama libe ngu-325°C, futhi izinga lokushisa lingu-15°C/min. Izimo ze-thermal desorption yilezi: ngemva kokushisa ku-250 ° C imizuzu engu-2. Isilinganiso sesisindo/seshaji sezinhlanganisela ezihlukanisiwe zemvelo eziguquguqukayo sitholwa nge-mass spectrometry ebangeni lama-10-700daltons. Isikhathi sokugcina sawo wonke ama-molecule amancane ezinto eziphilayo nawo siyarekhodwa.

2. Ukuhlaziywa kwe-Thermogravimetric (TGA)

Ngokufanayo, ifilimu entsha ye-HTOSP, ifilimu ye-OSP ejwayelekile yezimboni, nenye ifilimu ye-OSP yezimboni kufakwe kumasampula. Cishe u-17.0 mg wefilimu ye-OSP yakhunyulwa epuleti lethusi njengesampula yokuhlola okubalulekile. Ngaphambi kokuhlolwa kwe-TGA, akukho sampuli noma ifilimu engabhekana nanoma yikuphi ukwelashwa okugelezayo okungenayo umthofu. Sebenzisa i-TA Instruments’ 2950TA ukwenza ukuhlolwa kwe-TGA ngaphansi kokuvikelwa kwe-nitrogen. Izinga lokushisa elisebenzayo ligcinwe ekamelweni lokushisa imizuzu engu-15, bese lenyuka libe ngu-700 ° C ngesilinganiso se-10 ° C / min.

3. I-Photoelectron spectroscopy (XPS)

I-Photoelectron Spectroscopy (XPS), eyaziwa nangokuthi i-Chemical Analysis Electron Spectroscopy (ESCA), iyindlela yokuhlaziya ubuso bamakhemikhali. I-XPS ingakala ukwakheka kwamakhemikhali okungu-10nm kwendawo yokumboza. Gcoba ifilimu ye-HTOSP nefilimu ye-OSP evamile embonini epuleti le-copper, bese udlula kuma-reflows angaholeli angu-5. I-XPS yasetshenziswa ukuhlaziya ifilimu ye-HTOSP ngaphambi nangemuva kokwelashwa kokugeleza kabusha. Ifilimu ye-OSP ejwayelekile embonini ngemuva kokugeleza kabusha okungaholeli oku-5 okungaholeli futhi yahlaziywa yi-XPS. Insimbi esetshenzisiwe kwakuyi-VGESCALABMarkII.

4. Ngokusebenzisa imbobo solderability test

Ukusebenzisa amabhodi okuhlola ukuthengiselana (ama-STV) ekuhloleni ukuqina kwe-hole. Kukhona isamba esingu-10 sebhodi lokuhlola elikwazi ukuthengiselana le-STV lamalungu afanayo (uhlu ngalunye lunama-STV angu-4) ambozwe ngogqinsi lwefilimu olucishe lube ngu-0.35μm, lapho ama-STV afanayo angu-5 ambozwe ngefilimu ye-HTOSP, kanti amanye ama-STV angu-5 ahlanganiswe ngezinga lemboni. Ifilimu ye-OSP. Bese, ama-STV amboziwe athola uchungechunge lwezindlela zokwelapha zokugeleza kabusha ezisezingeni eliphezulu, ezingenamthofu kuhhavini ye-solder paste reflow. Isimo ngasinye sokuhlola sihlanganisa 0, 1, 3, 5 noma 7 ukugeleza kabusha okulandelanayo. Kunama-STV angu-4 ohlobo ngalunye lwefilimu esimweni ngasinye sokuhlola ukugeleza kabusha. Ngemuva kwenqubo yokugeleza kabusha, wonke ama-STV acutshungulwa izinga lokushisa eliphezulu kanye ne-solder-free wave soldering. Ukudayiswa kwemigodi kunganqunywa ngokuhlola i-STV ngayinye nokubala inani lezimbobo ezigcwaliswe kahle. Umbandela wokwamukela ngokusebenzisa izimbobo ukuthi i-solder egcwele kufanele igcwaliswe phezulu kwembobo embozwe ngembobo noma umkhawulo ongaphezulu wembobo.