Wonke umuntu uyazi ukuvimbela PCB ukugoba nokujika kwebhodi ekungeneni esithandweni sokugeleza kabusha. Okulandelayo kuyincazelo yawo wonke umuntu:

1. Yehlisa ithonya lokushisa ekucindezelekeni kwebhodi le-PCB

Njengoba “izinga lokushisa” liwumthombo oyinhloko wokucindezeleka kwebhodi, inqobo nje uma izinga lokushisa lehhavini lokugeleza lehliswa noma izinga lokushisa nokupholisa ibhodi kuhhavini lokugeleza liyancipha, ukuvela kokugoba kwepuleti kanye ne-warpage kungaba kakhulu. kuncishisiwe. Kodwa-ke, eminye imiphumela emibi ingase yenzeke, njenge-solder short circuit.

2. Ukusebenzisa ishidi le-Tg eliphezulu

I-Tg izinga lokushisa lokushintsha kwengilazi, okungukuthi, izinga lokushisa lapho izinto zishintsha kusuka kusimo sengilazi kuya esimweni senjoloba. Lapho liphansi inani le-Tg lezinto ezibonakalayo, ibhodi liqala ukuthamba ngokushesha ngemva kokungena kuhhavini lokugeleza kabusha, futhi isikhathi esisithathayo ukuze sibe isimo senjoloba ethambile Lizoba lide, futhi ukuguqulwa kwebhodi kuzoba kubi kakhulu. . Ukusebenzisa ipuleti le-Tg eliphakeme kungakhuphula ikhono layo lokumelana nengcindezi nokuguqulwa, kodwa intengo yezinto ezibonakalayo iphezulu uma kuqhathaniswa.

3. Khulisa ubukhulu bebhodi lesifunda

Ukuze kuzuzwe inhloso yokukhanya nokuzaca kwemikhiqizo eminingi ye-elekthronikhi, ukujiya kwebhodi kushiye u-1.0mm, 0.8mm, ngisho nogqinsi luka-0.6mm. Kunzima ngempela ukujiya okunjalo ukugcina ibhodi lingawohloki ngemva kwesithando somlilo sokugeleza kabusha. Kutuswa ukuthi uma ingekho imfuneko yokukhanya nokuba mncane, ibhodi* lingasebenzisa ukujiya okungu-1.6mm, okunganciphisa kakhulu ingozi yokugoba nokuguqulwa kwebhodi.

4. Yehlisa usayizi webhodi lesekhethi futhi unciphise inani lamaphazili

Njengoba iningi lama-reflow furnaces lisebenzisa amaketanga ukuze liqhubele phambili ibhodi lesifunda, ubukhulu bebhodi lesifunda buyoba likhulu ngenxa yesisindo salo, ukubola kanye nokuguqulwa kwesithando somlilo, ngakho-ke zama ukubeka uhlangothi olude lwebhodi lesifunda. njengomphetho webhodi. Ochungechungeni lwesithando somlilo sokugeleza, ukucindezeleka nokuguqulwa okubangelwa isisindo sebhodi lesifunda kungancishiswa. Ukwehliswa kwenani lamaphaneli nakho kusekelwe kulesi sizathu. I-deformation ephansi.

5. I-tray yesithando somlilo esetshenzisiwe

Uma izindlela ezingenhla kunzima ukuzifeza, *isithwali sokugeleza kabusha/isifanekiso sisetshenziselwa ukwehlisa inani lokuwohloka. Isizathu sokuthi kungani isithwali sokugeleza kabusha/isifanekiso singanciphisa ukugoba kwepuleti kungenxa yokuthi kuthenjwa ukuthi ukunwetshwa okushisayo noma ukufinyela okubandayo. Ithreyi ingakwazi ukubamba ibhodi lesifunda futhi ilinde kuze kube yilapho izinga lokushisa lebhodi lesifunda liphansi kunenani le-Tg bese liqala ukuqina futhi, futhi lingagcina nobukhulu bensimu.

Uma i-pallet ye-single-layer ingakwazi ukunciphisa ukuguqulwa kwebhodi lesifunda, isembozo kufanele sengezwe ukuze ubambe ibhodi lesifunda ngamaphalethi aphezulu naphansi. Lokhu kunganciphisa kakhulu inkinga yokuguqulwa kwebhodi lesifunda ngokusebenzisa isithando somlilo sokugeleza kabusha. Nokho, leli threyi likahhavini libiza kakhulu, futhi kufanele libekwe mathupha futhi ligaywe kabusha.

6. Sebenzisa i-Router esikhundleni se-V-Cut ukuze usebenzise i-sub-board
Njengoba i-V-Cut izobhubhisa amandla esakhiwo sephaneli phakathi kwamabhodi wesifunda, zama ukungasebenzisi i-V-Cut sub-board noma ukunciphisa ukujula kwe-V-Cut.