Ngokuthuthuka okuqhubekayo kwesayensi ye-elekthronikhi nobuchwepheshe, PCB ubuchwepheshe buye baba nezinguquko ezinkulu, futhi inqubo yokukhiqiza nayo idinga ukuthuthukiswa. Ngesikhathi esifanayo, izidingo zenqubo yamabhodi wesifunda we-PCB embonini ngayinye ziye zaba ngcono kancane kancane. Isibonelo, kumabhodi wesifunda omakhalekhukhwini namakhompiyutha, igolide nethusi lisetshenziswa, okwenza kube lula ukuhlukanisa izinzuzo nezinkinga zamabhodi wesifunda.

Thatha wonke umuntu ukuthi aqonde ubuchwepheshe obungaphezulu bebhodi le-PCB, futhi uqhathanise izinzuzo nezibi kanye nezimo ezisebenzayo zezinqubo ezahlukene zokwelashwa kwendawo yebhodi le-PCB.

Ngokuhlanzekile ngaphandle, ungqimba lwangaphandle lwebhodi lesifunda lunemibala emithathu: igolide, isiliva, nokubomvu okukhanyayo. Ihlukaniswa ngentengo: igolide libiza kakhulu, isiliva lingelesibili, futhi okubomvu okukhanya kubiza kakhulu. Eqinisweni, kulula ukwahlulela kusukela kumbala ukuthi abakhiqizi be-hardware banqamula amakhona. Kodwa-ke, i-wiring ngaphakathi kwebhodi lesifunda ikakhulukazi ithusi elihlanzekile, okungukuthi, ibhodi lethusi elingenalutho.

1. Bare ipuleti lethusi

Ubuhle nobubi busobala:

Izinzuzo: izindleko eziphansi, indawo ebushelelezi, i-weldability enhle (ngokungabikho kwe-oxidation).

Ububi: Kulula ukuthintwa i-asidi nomswakama futhi ayikwazi ukugcinwa isikhathi eside. Kufanele isetshenziswe kungakapheli amahora ama-2 ngemuva kokuqaqa, ngoba ithusi likhishwa kalula nge-oxidized lapho livezwa emoyeni; ngeke isetshenziselwe amabhodi anezinhlangothi ezimbili ngoba uhlangothi lwesibili ngemva kokudayiswa kokugeleza kabusha kokuqala Seluvele lwenziwe i-oxidized. Uma kukhona iphuzu lokuhlola, i-solder paste kufanele iphrintiwe ukuvimbela i-oxidation, ngaphandle kwalokho ngeke ixhumane kahle ne-probe.

I-copper ehlanzekile i-oxidized kalula uma ivuliwe emoyeni, futhi ungqimba lwangaphandle kufanele lube nesendlalelo sokuzivikela esishiwo ngenhla. Futhi abanye abantu bacabanga ukuthi umbala ophuzi osagolide uyithusi, okuyinto engalungile ngoba ungqimba lwethusi oluyisivikelo. Ngakho-ke, kuyadingeka ukunamathisela indawo enkulu yegolide ebhodini lesifunda, okuyinqubo yokucwiliswa kwegolide engikufundise yona ngaphambili.

Okwesibili, ipuleti legolide

Igolide igolide langempela. Ngisho noma ungqimba oluncane kakhulu lufakwe, luvele lubala cishe u-10% wezindleko zebhodi lesifunda. E-Shenzhen, kunabathengisi abaningi abasebenza ngokukhethekile ekuthengeni amabhodi esekethe kadoti. Bangakwazi ukugeza igolide ngezindlela ezithile, okuyimali engenayo enhle.

Sebenzisa igolide njengongqimba lokucwenga, enye iwukuba lula ukushisela, kanti enye iwukuvikela ukugqwala. Ngisho nomunwe wegolide we-memory stick osekuyiminyaka eminingana usetshenziswa namanje usalokoza njengakuqala. Uma kwasetshenziswa ithusi, i-aluminium, nensimbi kwasekuqaleni, manje sekugqwalile kwaba yinqwaba yezinsalela.

Isendlalelo esinamekwe ngegolide sisetshenziswa kakhulu kumaphedi engxenye, iminwe yegolide, kanye nezinhlamvu zokuxhuma zebhodi lesifunda. Uma uthola ukuthi ibhodi lesifunda empeleni liyisiliva, lihamba ngaphandle kokusho. Uma ushayela inombolo yocingo yamalungelo omthengi ngokuqondile, umenzi kufanele anqamule, ahluleke ukusebenzisa izinto ngendlela efanele, futhi asebenzise ezinye izinsimbi ukuze akhohlise amakhasimende. Amabhodi omama amabhodi esekethe omakhalekhukhwini asetshenziswa kakhulu amabhodi agqitshwe ngegolide, amabhodi egolide acwilisiwe, amabhodi omama wekhompyutha, amabhodi esekethe alalelwayo namancane edijithali ngokuvamile awawona amabhodi agqitshwe ngegolide.

Izinzuzo kanye nokubi kobuchwepheshe begolide bokucwiliswa empeleni akunzima ukukudweba:

Izinzuzo: Akulula ukwenza i-oxidize, ingagcinwa isikhathi eside, futhi indawo engaphezulu iphansi, ifanele ukushisela izikhonkwane ezincane ze-gap kanye nezingxenye ezinamajoyini amancane e-solder. Inketho yokuqala yamabhodi e-PCB anezinkinobho (njengamabhodi omakhalekhukhwini). I-reflow soldering ingaphinda izikhathi eziningi ngaphandle kokunciphisa ukuthengiselana kwayo. Ingasetshenziswa njenge-substrate ye-COB (ChipOnBoard) yokubopha ngocingo.

Ukungalungi: izindleko eziphezulu, amandla ampofu we-welding, ngoba inqubo ye-electroless nickel plating isetshenziswa, kulula ukuba nenkinga yediski emnyama. Isendlalelo se-nickel sizokhipha i-oxidize ngokuhamba kwesikhathi, futhi ukwethembeka kwesikhathi eside kuyinkinga.

Manje siyazi ukuthi igolide liyigolide nesiliva isiliva? Akunjalo, ithini.

Okwesithathu, ibhodi lesifunda lesifuthizi

Ibhodi lesiliva libizwa ngokuthi ibhodi le-spray tin. Ukufafaza ungqimba lukathayela ongqimbeni olungaphandle lwesekethe yethusi nakho kungasiza ekuhlanganiseni. Kodwa ayikwazi ukunikeza ukuthembeka kokuxhumana kwesikhathi eside njengegolide. Ayinawo umthelela ezingxenyeni ezidayisiwe, kodwa ukwethembeka akwanele kumaphedi atholakale emoyeni isikhathi eside, njengamapulangwe aphansi kanye namasokhethi ephini. Ukusetshenziswa isikhathi eside kuthambekele ekubeni ne-oxidation kanye nokugqwala, okuholela ekuxhumaneni okubi. Ngokuyisisekelo isetshenziswa njengebhodi lesifunda lemikhiqizo emincane yedijithali, ngaphandle kokukhetha, ibhodi le-spray tin, isizathu siwukuthi ishibhile.

Izinzuzo zayo kanye nokubi kufinyezwa kanje:

Izinzuzo: intengo ephansi nokusebenza okuhle kwe-welding.

Ukungalungi: Akufanele izikhonkwane zokushisela ezinezikhala ezinhle nezingxenye ezincane kakhulu, ngenxa yokuthi i-flatness ye-spray tin plate impofu. Ubuhlalu be-solder bujwayele ukukhiqizwa ngesikhathi sokucutshungulwa kwe-PCB, futhi kulula ukubangela ukuthi amasekhethi amafushane abe nezingxenye ezinhle zephimbo. Uma isetshenziswa enqubweni ye-SMT enezinhlangothi ezimbili, ngenxa yokuthi uhlangothi lwesibili lwenziwe nge-solder yezinga lokushisa eliphezulu lokugeleza kabusha, kulula kakhulu ukufafaza uthayela futhi uncibilike kabusha, okuholela ebuhlalu bethayela noma amaconsi afanayo athintwa amandla adonsela phansi abe yindilinga eyindilinga. amachashazi, okuzokwenza ukuthi ubuso bube bumbi nakakhulu. Ukucaba kuthinta izinkinga zokushisela.

Ngaphambi kokukhuluma ngebhodi lesifunda elibomvu elishibhile, okungukuthi, isibani se-thermoelectric sokuhlukanisa i-copper substrate yesibani somvukuzi.

Okwesine, ibhodi lezandla le-OSP

Ifilimu ye-solder ye-organic. Ngenxa yokuthi i-organic, hhayi insimbi, ishibhile kunokufutha ngamathini.

Izinzuzo: Inazo zonke izinzuzo zokushisela ipuleti le-copper elingenalutho, futhi ibhodi eliphelelwe yisikhathi lingaphathwa futhi phezulu.

Ukungalungi: kuthinteka kalula yi-asidi nomswakama. Uma isetshenziswa ekufakweni kwe-reflow soldering yesibili, idinga ukuqedwa phakathi nesikhathi esithile, futhi ngokuvamile umphumela we-reflow soldering yesibili uzoba mubi kakhulu. Uma isikhathi sokugcina sidlula izinyanga ezintathu, kufanele sivuswe kabusha. Kufanele isetshenziswe kungakapheli amahora angama-24 ngemuva kokuvula iphakheji. I-OSP iwungqimba oluvikelayo, ngakho iphoyinti lokuhlola kufanele liphrintwe ngokunamathisela kwe-solder ukuze kukhishwe isendlalelo sokuqala se-OSP ngaphambi kokuthi sithinte iphinikhodi ukuze kuhlolwe ugesi.

Okuwukuphela komsebenzi wale filimu ephilayo ukuqinisekisa ukuthi ucwecwe lwethusi lwangaphakathi ngeke lufakwe i-oxidized ngaphambi kokushisela. Lolu ngqimba lwefilimu luyashintshashintsha ngokushesha lapho lushiswa ngesikhathi sokushisela. I-solder ingashisela ucingo lwethusi kanye nezingxenye ndawonye.

Kodwa ayimelani nokugqwala. Uma ibhodi lesifunda le-OSP livezwa emoyeni izinsuku eziyishumi, izingxenye azikwazi ukushiselwa.

Amabhodi omama amaningi ekhompyutha asebenzisa ubuchwepheshe be-OSP. Ngenxa yokuthi indawo yebhodi lesekethe inkulu kakhulu, ayikwazi ukusetshenziselwa ukufakwa kwegolide.