- 15
- Nov
Ukuqonda ukuphela kwendawo kusuka kumbala we-PCB
Indlela yokuqonda isiphetho esingaphezulu kusuka PCB umbala?
Kusukela ebusweni be-PCB, kunemibala emithathu eyinhloko: igolide, isiliva kanye nokukhanya okubomvu. I-PCB esagolide iyona ebiza kakhulu, isiliva ibiza kakhulu, futhi okubomvu okukhanyayo ishibhe kakhulu.
Ungazi ukuthi ngabe umenzi usika amakhona embala ongaphezulu.
Ngaphezu kwalokho, isifunda ngaphakathi kwebhodi lesifunda ikakhulukazi ithusi elihlanzekile. I-Copper i-oxidized kalula uma ivuliwe emoyeni, ngakho-ke ungqimba lwangaphandle kufanele lube nesendlalelo sokuzivikela esishiwo ngenhla.
Gold
Abanye abantu bathi igolide yithusi, okuyinto engalungile.
Sicela ubheke isithombe segolide esinamekwe ebhodini lesekethe njengoba kukhonjisiwe ngezansi:
Ibhodi lesifunda legolide elibiza kakhulu igolide langempela. Nakuba incane kakhulu, iphinde ibangele cishe u-10% wezindleko zebhodi.
Kunezinzuzo ezimbili zokusebenzisa igolide, enye ilungele ukushisela, kanti enye i-anti-corrosion.
Njengoba kuboniswe esithombeni esingezansi, lona umunwe wegolide we-memory stick eminyakeni engu-8 edlule. Kusacwebezela okusagolide.
Isendlalelo esifakwe ngegolide sisetshenziswa kakhulu kumaphedi engxenye yebhodi lesifunda, iminwe yegolide, i-shrapnel yesixhumi, njll.
Uma uthola ukuthi amanye amabhodi wesifunda ayisiliva, kufanele asikwe emakhoneni. Sikubiza ngokuthi “ukwehliswa kwentengo”.
Ngokuvamile, ama-motherboards omakhalekhukhwini afakwe ngegolide, kodwa ama-motherboards ekhompuyutha namabhodi amancane edijithali awanamekwe ngegolide.
Sicela ubheke ibhodi le-iPhone X elingezansi, izingxenye eziveziwe zonke zigcwele igolide.
Silver
Igolide liyigolide, isiliva liyisiliva? Akunjalo, ithini.
Ibhodi lesiliva libizwa ngokuthi ibhodi le-HASL. Ukufafaza uthayela ongqimbeni olungaphandle lwethusi nakho kusiza ukusoda, kodwa akuzinzile njengegolide.
Ayinawo umthelela ezingxenyeni ezishiselwe kakade zebhodi le-HASL. Kodwa-ke, uma i-pad ivezwe emoyeni isikhathi eside, njengama-grounding pads namasokhethi, kulula uku-oxidize nokugqwala, okuholela ekuxhumaneni okungalungile.
Yonke imikhiqizo emincane yedijithali ingamabhodi we-HASL. Kunesizathu esisodwa kuphela: ezishibhile.
Okubomvu okukhanyayo
I-OSP (Organic Solderability Preservative), iyimvelo, hhayi insimbi, ngakho ishibhile kunenqubo ye-HASL.
Umsebenzi kuphela wefilimu ephilayo ukuqinisekisa ukuthi i-foil yethusi yangaphakathi ngeke ifakwe i-oxidized ngaphambi kwe-soldering.
Uma ifilimu ihwamuka, izohwamuka futhi ifudumale. Khona-ke ungakwazi ukudambisa ucingo lwethusi kanye nengxenye ndawonye.
Kodwa igqwala kalula. Uma ibhodi le-OSP livezwa emoyeni izinsuku ezingaphezu kweziyi-10, alikwazi ukuthengiswa.
Kunezinqubo eziningi ze-OSP ebhodini lomama lekhompyutha. Ngoba usayizi webhodi lesifunda mkhulu kakhulu.