Umqondo oyisisekelo we PCB ibhodi

1. Umqondo “wesendlalelo”
Ngokufana nomqondo “wesendlalelo” owethulwe ekucubungulweni kwamagama noma ezinye izinhlelo zokusebenza eziningi ukuze kuqashwe isidleke kanye nokuhlanganiswa kwezithombe, umbhalo, umbala, njll., “ungqimba” lwe-Protel aluyona into ebonakalayo, kodwa impahla yebhodi ephrintiwe ngokwayo Ezinhlobonhlobo ezihlukahlukene. izendlalelo ze-foil zethusi. Namuhla, ngenxa yokufakwa okuminyene kwezingxenye zesekethe ye-elekthronikhi. Izidingo ezikhethekile ezifana nokunqanda ukuphazamiseka kanye nezintambo. Amabhodi aphrintiwe asetshenziswa kweminye imikhiqizo emisha ye-elekthronikhi ayinayo kuphela izinhlangothi ezingenhla nezingezansi zokufaka izintambo, kodwa futhi anezinsimbi zethusi ezihlanganisiwe ezingacutshungulwa ngokukhethekile phakathi kwamabhodi. Isibonelo, kusetshenziswa ama-motherboards ekhompuyutha amanje. Izinto eziningi zebhodi eziphrintiwe zingaphezu kwezingqimba ezi-4. Ngenxa yokuthi lezi zendlalelo kunzima ukuzicubungula, zisetshenziselwa kakhulu ukusetha izendlalelo zezintambo zamandla ngezintambo ezilula (njenge-Ground Dever kanye ne-Power Dever ku-software), futhi ngokuvamile zisebenzisa izindlela zokugcwalisa zendawo enkulu zokufaka izintambo (njenge-ExternaI P1a11e futhi Gcwalisa isofthiwe). ). Lapho izingqimba eziphezulu nezingaphansi kanye nezingqimba eziphakathi zidinga ukuxhunywa, okubizwa ngokuthi “vias” okukhulunywa ngakho ku-software kusetshenziselwa ukuxhumana. Ngencazelo engenhla, akunzima ukuqonda imiqondo ehlobene “yephedi enezingqimba eziningi” kanye “nokusetha isendlalelo sezintambo”. Ukunikeza isibonelo esilula, abantu abaningi sebeqedile ukufaka izintambo futhi bathola ukuthi amatheminali amaningi axhunyiwe awanawo amaphedi lapho ephrintwa. Eqinisweni, lokhu kungenxa yokuthi bawuzibe umqondo “wezendlalelo” lapho bengeza umtapo wezincwadi wedivayisi futhi abazange bazidwebe futhi bazipakishe. Isici sephedi sichazwa ngokuthi “I-Multilayer (Mulii-Layer). Kufanele kukhunjulwe ukuthi uma inani lezendlalelo zebhodi eliphrintiwe elisetshenzisiwe selikhethiwe, qiniseka ukuthi uvala lezo zendlalelo ezingasetshenzisiwe ukuze ugweme izinkinga nokuphambuka.

2. Nge (Via)

umugqa oxhuma izingqimba, futhi imbobo evamile ibhojwa e-Wenhui yezintambo ezidinga ukuxhunywa kungqimba ngalunye, okuyi-via hole. Kule nqubo, ungqimba lwensimbi lugqitshwa endaweni eyicylindrical yodonga lwembobo nge-chemical deposition ukuze kuxhunywe ucwecwe lwethusi oludinga ukuxhunywa kuzendlalelo ezimaphakathi, futhi izinhlangothi ezingenhla nezingezansi ze-via zenziwe. ibe yizimo ze-pad ezijwayelekile, ezingaba ngokuqondile Ixhunywe nemigqa ezinhlangothini ezingenhla nezingezansi, noma zingaxhunywanga. Ngokuvamile, kunezimiso ezilandelayo zokwelashwa kwe-vias lapho uklama isekethe:
(1) Nciphisa ukusetshenziswa kwe-vias. Uma i-via ikhethiwe, qiniseka ukuthi uphatha igebe phakathi kwayo nezinhlangano ezizungezile, ikakhulukazi igebe phakathi kwemigqa kanye ne-vias enganakwa kalula ezingqimbeni eziphakathi nendawo kanye ne-vias. Uma kuwumzila ozenzakalelayo ungaxazululwa ngokuzenzakalelayo ngokukhetha into ethi “ku” kumenyu engaphansi ethi “Nciphisa inani le-vias” (Nge-Minimiz8TIon).
(2) Uma sikhulu umthamo wamanje odingekayo, ubukhulu be-vias edingekayo bukhulu. Isibonelo, i-vias esetshenziselwa ukuxhuma isendlalelo samandla kanye nongqimba lomhlabathi kwezinye izendlalelo izoba nkulu.

3. ungqimba lwesikrini sikasilika (Imbondela)

Ukuze kube lula ukufakwa nokugcinwa kwesekethe, amaphethini elogo adingekayo kanye namakhodi ombhalo aphrintwa endaweni engaphezulu nephansi yebhodi ephrintiwe, njengelebula lengxenye kanye nevelu lokuzisholo, ukwakheka kohlaka lwengxenye kanye nelogo yomkhiqizi, usuku lokukhiqiza, njll. Lapho abasaqalayo abaningi beklama okuqukethwe okufanelekile kwesendlalelo sesikrini sikasilika, banaka kuphela ukubekwa kahle nokuhle kwezimpawu zombhalo, beshaya indiva umphumela wangempela we-PCB. Ebhodini eliphrintiwe abaliklamile, izinhlamvu zazivinjwa ingxenye noma zahlasela indawo yokunamathisela futhi zasulwa, futhi ezinye zezingxenye zazimakwe ezingxenyeni eziseduze. Imiklamo enjalo ehlukahlukene izoletha okuningi ekuhlanganiseni nasekugcinweni. engalungile. Umgomo olungile wokuhlelwa kwezinhlamvu kungqimba lwesikrini sikasilika uthi: “akukho ukungaqondakali, ukuthungwa ngokubuka nje, kuhle futhi kuphane”.

4. Imininingwane ye-SMD

Kunenani elikhulu lamaphakheji e-SMD kumtapo wezincwadi wephakheji we-Protel, okungukuthi, amadivaysi e-surface soldering. Isici esikhulu salolu hlobo lwedivayisi ngaphezu kobukhulu balo obuncane ukusatshalaliswa kohlangothi olulodwa lwezimbobo zamaphini. Ngakho-ke, lapho ukhetha lolu hlobo lwedivayisi, kuyadingeka ukuchaza ubuso bedivayisi ukuze ugweme “izikhonkwane ezingekho (I-Missing Plns)”. Ukwengeza, izichasiselo zombhalo ezifanele zalolu hlobo lwengxenye zingabekwa kuphela endaweni lapho ingxenye itholakala khona.

5. Indawo yokugcwalisa efana negridi (Indiza Yangaphandle) nendawo yokugcwalisa (Gcwalisa)

Njengamagama alaba ababili, indawo yokugcwalisa emise okwenethiwekhi iwukucubungula indawo enkulu ye-copper foil ibe yinethiwekhi, futhi indawo yokugcwalisa igcina kuphela ucwecwe lwethusi luqinile. Abasaqalayo ngokuvamile abawuboni umehluko phakathi kwalokhu okubili kukhompuyutha enqubweni yokuklama, empeleni, inqobo nje uma usondeza, ungakubona ngokubuka nje. Impela kungenxa yokuthi akulula ukubona umehluko phakathi kwalokhu okubili ngezikhathi ezijwayelekile, ngakho-ke uma uyisebenzisa, kuwubudedengu nakakhulu ukuhlukanisa phakathi kokubili. Kufanele kugcizelelwe ukuthi owokuqala unomphumela oqinile wokucindezela ukuphazamiseka kwe-high-frequency ezicini zesifunda, futhi kufanelekile izidingo. Izindawo ezigcwele izindawo ezinkulu, ikakhulukazi lapho izindawo ezithile zisetshenziswa njengezindawo ezivikelekile, izindawo ezihlukanisiwe, noma izintambo zikagesi zamanje eziphakeme. Lesi sakamuva sisetshenziswa kakhulu ezindaweni lapho indawo encane idingeka khona njengeziphetho zomugqa ojwayelekile noma izindawo ezijikayo.

6. Iphedi

Iphedi ingumqondo ovame ukuxhunyanwa nawo futhi obaluleke kakhulu ekwakhiweni kwe-PCB, kodwa abaqalayo bavame ukukushaya indiva ukukhethwa nokuguqulwa kwayo, futhi basebenzise amaphedi ayindilinga kumklamo ofanayo. Ukukhethwa kohlobo lwephedi yengxenye kufanele kucubungule ngokujulile ukuma, usayizi, isakhiwo, izimo zokudlidliza nezishisisa, kanye nokuphoqelela ukuqondiswa kwengxenye. I-Protel ihlinzeka ngochungechunge lwamaphedi anosayizi abahlukene nobumo kumtapo wezincwadi wephakeji, njengamaphedi ayindingilizi, ayisikwele, ama-octagonal, ayindilinga nawokumisa, kodwa ngezinye izikhathi lokhu akwanele futhi kudinga ukuhlelwa uwena. Isibonelo, kumaphedi akhiqiza ukushisa, angaphansi kwengcindezi enkulu, futhi amanje, angaklanywa abe “isimo se-teardrop”. Emklamweni ojwayelekile wephinikhodi ye-TV PCB yomugqa wokukhipha iphinikhodi, abakhiqizi abaningi bakuleli fomu. Ngokuvamile, ngaphezu kwalokhu okungenhla, lezi zimiso ezilandelayo kufanele zicatshangelwe lapho uhlela iphedi uwedwa:

(1) Uma umumo ungaguquki ngobude, cabangela umehluko phakathi kobubanzi bocingo kanye nobude obuthile obuseceleni bephedi hhayi enkulu kakhulu;

(2) Ngokuvamile kudingekile ukusebenzisa amaphedi a-asymmetric anobude obungalingani lapho umzila phakathi kwama-engeli okuhola wengxenye;

(3) Usayizi wengxenye ngayinye yembobo yephedi kufanele uhlelwe futhi unqunywe ngokwehlukana ngokuvumelana nobukhulu bephinikhodi yengxenye. Isimiso siwukuthi ubukhulu bomgodi buyi-0.2 kuya ku-0.4 mm mkhulu kunobubanzi bephini.

7. Izinhlobo ezahlukene zolwelwesi (Imaski)

Lawa mafilimu awabalulekile kuphela kunqubo yokukhiqiza ye-PcB, kodwa futhi ayisimo esidingekayo sokushisela ingxenye. Ngokuya ngokuma nomsebenzi “we-membrane”, “i-membrane” ingahlukaniswa ibe ingxenye yendawo (noma indawo ehlanganisiwe) imaski e-solder (TOP noma Ngezansi) kanye ne-solder surface (noma i-solder surface) imaski ye-solder (TOp noma BottomPaste Mask) . Njengoba igama lisho, ifilimu ye-soldering iyingqimba yefilimu esetshenziselwa i-pad ukuze kuthuthukiswe i-solderability, okungukuthi, imibuthano enemibala ekhanyayo ebhodini eliluhlaza incane kakhulu kune-pad. Isimo se-mask solder sihluke kakhulu, ngoba Ukuze uvumelane nebhodi eliqediwe ukuze lizuzise i-soldering nezinye izindlela zokuhlanganisa, kuyadingeka ukuthi i-foil yethusi ku-non-pad ebhodini ayikwazi ukuthayela. Ngakho-ke, ungqimba lukapende kufanele lufakwe kuzo zonke izingxenye ngaphandle kwephedi ukuvimbela ithini ukuthi ingafakwa kulezi zingxenye. Kuyabonakala ukuthi lezi zingqimba ezimbili zisebudlelwaneni obuhambisanayo. Kusukela kule ngxoxo, akunzima ukunquma imenyu
Izinto ezifana ne-“solder Mask En1argement” zisethiwe.

8. Ulayini ondizayo, umugqa ondizayo unezincazelo ezimbili:

(1) Uxhumano lwenethiwekhi olufana nebhendi yerabha ukuze lubonwe ngesikhathi sezintambo ezizenzakalelayo. Ngemuva kokulayisha izingxenye ngetafula lenethiwekhi nokwenza ukwakheka kokuqala, ungasebenzisa “Show command” ukuze ubone isimo se-crossover soxhumano lwenethiwekhi ngaphansi kwesakhiwo , Hlala ulungisa isikhundla sezingxenye ukuze unciphise le crossover ukuze uthole okuzenzakalelayo okuphezulu. isilinganiso somzila. Lesi sinyathelo sibaluleke kakhulu. Kungathiwa ulola ummese ungagawuli ukhuni ngephutha. Kuthatha isikhathi esiningi kanye nenani! Ngaphezu kwalokho, ngemva kokuba i-wiring ezenzakalelayo isiqediwe, yiziphi amanethiwekhi angakadluliswa, ungasebenzisa lo msebenzi ukuze uthole. Ngemva kokuthola inethiwekhi engaxhunyiwe, inganxeshezelwa mathupha. Uma ingakwazi ukunxeshezelwa, incazelo yesibili yokuthi “umugqa ondizayo” isetshenziswa, okuwukuxhuma la manethiwekhi ngezintambo ebhodini eliphrintiwe lesikhathi esizayo. Kufanele kuvunywe ukuthi uma ibhodi lesifunda likhiqizwa ngobuningi bomugqa othomathikhi owenziwe ngobuningi, lo mthofu endizayo ungaklanywa njengento yokumelana nevelu yokumelana engu-0 ohm kanye nesikhala sephedi esifanayo.