Ngemuva kokuthi i-laminate egqoke ithusi icutshungulwa ukuze ikhiqize PCB ibhodi, ezihlukahlukene ngokusebenzisa izimbobo, kanye nezimbobo zokuhlanganisa, izingxenye ezihlukahlukene zihlanganiswa. Ngemuva kokuhlanganisa, ukuze wenze izingxenye zifinyelele ukuxhumana nesekethe ngayinye ye-PCB, kuyadingeka ukwenza inqubo ye-Xuan welding. I-Brazing ihlukaniswe ngezindlela ezintathu: i-wave soldering, i-reflow soldering kanye ne-solder manual. Izingxenye ezifakwe isokhethi ngokuvamile zixhunywe nge-wave soldering; ukuxhunywa kwe-brazing yezingxenye ezibekwe phezulu ngokuvamile kusebenzisa i-reflow soldering; izingxenye zomuntu ngamunye kanye nezingxenye ziyi-manual (i-chrome kagesi) ngenxa yezidingo zenqubo yokufaka kanye ne-welding yokulungisa umuntu ngamunye. Iron) ukushisela.

1. Ukumelana ne-solder ye-copper clad laminate

I-Copper clad laminate iyi-substrate material ye-PCB. Ngesikhathi sokubhula, ihlangana nokuthintana nezinto ezisezingeni eliphezulu ngokuphazima kweso. Ngakho-ke, inqubo ye-Xuan welding iyindlela ebalulekile “yokushaqeka okushisayo” ku-laminate ye-copper clad kanye nokuhlolwa kokumelana nokushisa kwe-copper clad laminate. I-Copper clad laminates iqinisekisa ikhwalithi yemikhiqizo yabo ngesikhathi sokushaqeka okushisayo, okuyisici esibalulekile sokuhlola ukumelana nokushisa kwama-laminates agqoke ithusi. Ngesikhathi esifanayo, ukwethembeka kwe-copper clad laminate ngesikhathi sokushisela i-Xuan nakho kuhlobene namandla ayo okudonsa, amandla e-peel ngaphansi kwezinga lokushisa eliphezulu, nomswakama nokumelana nokushisa. Ngezidingo zenqubo yokufaka ama-laminates e-copper clad, ngaphezu kwezinto ezivamile zokumelana nokucwiliswa, eminyakeni yamuva, ukuze kuthuthukiswe ukwethembeka kwama-laminates agqoke ithusi ku-Xuan welding, okunye ukukalwa kokusebenza kwesicelo kanye nezinto zokuhlola zengeziwe. Okufana nokumuncwa komswakama kanye nokuhlolwa kokumelana nokushisa (ukwelashwa amahora angu-3, ​​bese kuba ngu-260 ℃ ukuhlolwa kwe-dip soldering), ukuhlolwa kwe-solder yokumunca umswakama (okubekwe ku-30 ​​℃, umswakama ohlobene no-70% isikhathi esithile, ukuhlolwa kwe-reflow soldering) nokunye. . Ngaphambi kokuthi imikhiqizo ye-laminate ye-copper clad ihambe efekthri, umakhi we-copper clad laminate kufanele enze ukuqina okuqinile kokumelana ne-solder (okwaziwa nangokuthi amabhamuza okushisa okushisayo) ngokwezinga. Abakhiqizi bebhodi lesifunda eliphrintiwe kufanele futhi babone le nto ngesikhathi ngemuva kokuthi i-laminate ye-copper clad ingena efektri. Ngesikhathi esifanayo, ngemva kokukhiqizwa kwesampula ye-PCB, ukusebenza kufanele kuhlolwe ngokulingisa izimo ze-wave soldering kumaqoqo amancane. Ngemva kokuqinisekisa ukuthi lolu hlobo lwe-substrate luhlangabezana nezidingo zomsebenzisi mayelana nokumelana nokucwiliswa kwe-solder, i-PCB yalolu hlobo ingakhiqizwa ngobuningi futhi ithunyelwe embonini yomshini ephelele.

Indlela yokulinganisa ukumelana ne-solder ye-copper clad laminates ngokuyisisekelo iyafana neyezizwe ngezizwe (GBIT 4722-92), indinganiso ye-IPC yaseMelika (IPC-410 1), kanye nezinga laseJapane le-JIS (JIS-C-6481-1996) . Izidingo eziyinhloko yilezi:

①Indlela yokunquma ye-arbitration “indlela yokudambisa entantayo” (isampula lintanta endaweni yokunamathisela);

②Usayizi wesampula ngu-25 mm X 25 mm;

③Uma iphoyinti lokulinganisa izinga lokushisa kuyithemometha ye-mercury, kusho ukuthi indawo ehambisanayo yekhanda le-mercury nomsila ku-solder ingu (25 ± 1) mm; izinga le-IPC lingu-25.4 mm;

④Ukushona kwendawo yokugeza ye-solder akukho ngaphansi kuka-40 mm.

Kumele kuqashelwe ukuthi: isikhundla sokulinganisa izinga lokushisa sinethonya elibaluleke kakhulu ekuboniseni okulungile nokuyiqiniso kwezinga lokumelana ne-dip solder yebhodi. Ngokuvamile, umthombo wokushisa we-solder tin ungaphansi kokugeza kwe-tin. Okukhulu (okujulile) ibanga phakathi kwephuzu lokulinganisa izinga lokushisa kanye nobuso be-solder, kukhulu ukuphambuka phakathi kwezinga lokushisa le-solder nezinga lokushisa elilinganisiwe. Ngalesi sikhathi, ukwehla kwezinga lokushisa kwendawo ewuketshezi kunezinga lokushisa elilinganisiwe, isikhathi eside sepuleti elinokumelana ne-dip solder likalwa indlela yesampula yokushisela ukuntanta ukuze ibe ibhamuza.

2. Ukucubungula i-Wave soldering

Enqubweni ye-wave soldering, izinga lokushisa le-solder liyizinga lokushisa le-solder, futhi lokhu kushisa kuhlobene nohlobo lwe-solder. Izinga lokushisa lokushisela kufanele lilawuleke libe ngaphansi kuka-250’c. Izinga lokushisa eliphansi kakhulu le-welding lithinta ikhwalithi yokushisela. Njengoba izinga lokushisa le-solder likhula, isikhathi se-solder se-dip sifinyezwa kakhulu. Uma izinga lokushisa le-solder liphezulu kakhulu, lizokwenza ukuthi isekethe (ithubhu yethusi) noma i-substrate ibe namabhamuza, i-delamination, kanye ne-warpage ebucayi yebhodi. Ngakho-ke, izinga lokushisa lokushisela kufanele lilawulwe ngokuqinile.

Okwesithathu, i-reflow welding processing

Ngokuvamile, izinga lokushisa le-reflow soldering liphansi kancane kunezinga lokushisa le-wave soldering. Ukusethwa kwezinga lokushisa lokuphinda kufakwe i-solder kuhlobene nezici ezilandelayo:

①Uhlobo lwesisetshenziswa sokuphinda kufakwe i-solder;

②Izimo zokubeka isivinini somugqa, njll.;

③Uhlobo nokujiya kwezinto ze-substrate;

④ Usayizi we-PCB, njll.

Izinga lokushisa elimisiwe le-reflow soldering lihlukile kuzinga lokushisa eliphezulu le-PCB. Emazingeni okushisa afanayo esethi ye-reflow soldering, izinga lokushisa elingaphezulu le-PCB nalo lihlukile ngenxa yohlobo nokujiya kwe-substrate material.

Ngesikhathi senqubo ye-reflow soldering, umkhawulo wokumelana nokushisa we-substrate surface lokushisa lapho i-foil yethusi ikhukhumala (amabhamuza) izoshintsha ngokushisa kwangaphambi kokushisa kwe-PCB kanye nokuba khona noma ukungabikho kokumuncwa komswakama. Kungabonakala ku-Figure 3 ukuthi lapho izinga lokushisa langaphambi kokushisa kwe-PCB (izinga lokushisa elingaphezulu le-substrate) liphansi, umkhawulo wokumelana nokushisa wokushisa kwe-substrate lapho inkinga yokuvuvukala ivela khona nayo iphansi. Ngaphansi kwesimo sokuthi izinga lokushisa elibekwe yi-reflow soldering kanye nezinga lokushisa langaphambili le-reflow soldering lihlala njalo, izinga lokushisa elingaphezulu liyehla ngenxa yokumuncwa komswakama we-substrate.

Okwesine, ukushisela ngesandla

Ekulungiseni ukushisela noma ukushisela okuhlukile okwenziwa ngesandla kwezingxenye ezikhethekile, izinga lokushisa elingaphezulu le-ferrochrome kagesi lidingeka libe ngaphansi kuka-260℃ kumalaminates anendwangu yethusi esephepheni, futhi libe ngaphansi kuka-300℃ kumalayini enziwe ngendwangu enziwe ngethusi engilazi. Futhi ngangokunokwenzeka ukunciphisa isikhathi Welding, izidingo jikelele; i-substrate yephepha engu-3s noma ngaphansi, i-glass fibre cloth substrate ingama-5s noma ngaphansi.