I-Copper sulfate electroplating ithatha isikhundla esibaluleke kakhulu PCB i-electroplating. Izinga le-asidi yethusi yokugcoba i-electroplating lithinta ngokuqondile ikhwalithi kanye nezakhiwo ezihambisanayo zemishini yongqimba lwethusi olufakwe i-electroplated lwebhodi le-PCB, futhi linomthelela othile ekucutshungulweni okulandelayo. Ngakho-ke, indlela yokulawula i-acid yethusi electroplating Ikhwalithi ye-PCB iyingxenye ebalulekile ye-PCB electroplating, futhi ingenye yezinqubo ezinzima zamafektri amaningi amakhulu ukulawula inqubo. Ngokusekelwe eminyakeni yokuhlangenwe nakho kwe-electroplating kanye nezinsizakalo zobuchwepheshe, umbhali ekuqaleni ufingqa lokhu okulandelayo, enethemba lokukhuthaza imboni ye-electroplating embonini ye-PCB.Izinkinga ezivamile ku-acid yethusi electroplating ikakhulukazi zihlanganisa okulandelayo:

1. Ukucwenga okuqinile; 2. Plating (ibhodi surface) izinhlayiya zethusi; 3. Umgodi we-Electroplating; 4. Ingaphezulu lebhodi limhlophe noma alilingani ngombala.

Ekuphenduleni izinkinga ezingenhla, ezinye iziphetho zenziwe, futhi ezinye izixazululo zokuhlaziya kafushane kanye nezinyathelo zokuvimbela zenziwa.

I-electroplating engamanzi: Ngokuvamile i-engeli yebhodi ilukhuni, iningi lazo elibangelwa i-electroplating current inkulu kakhulu. Unganciphisa okwamanje futhi uhlole isibonisi samanje ngemitha yekhadi ukuze uthole okungavamile; ibhodi lonke lilukhuni, ngokuvamile akunjalo, kodwa umbhali uhlangabezane nalo kanye endaweni yekhasimende. Kamuva kwatholakala ukuthi izinga lokushisa ebusika laliphansi futhi okuqukethwe kokukhanya kwakunganele; futhi ngezinye izikhathi amanye amabhodi asebenziwe kabusha ayengaphathwa kahle, futhi kwenzeka izimo ezifanayo.

Ukufaka izinhlayiya zethusi endaweni yebhodi: Kunezici eziningi ezibangela ukukhiqizwa kwezinhlayiya zethusi endaweni yebhodi. Kusukela ekucwileni kwethusi kuye kuyo yonke inqubo yokudlulisa iphethini, kungenzeka ukufaka ithusi nge-electroplating ebhodini le-PCB uqobo.

Izinhlayiya zethusi endaweni yebhodi ebangelwa inqubo yokucwiliswa kwethusi ingase ibangelwe yinoma yisiphi isinyathelo sokwelashwa sokucwiliswa kwethusi. Ukususwa kwe-alkaline ngeke kubangele kuphela ukuhwalala endaweni engaphezulu kwebhodi kodwa kuzophinde kubangele ukuqina emigodini lapho ubulukhuni bamanzi buphakeme futhi uthuli lokumba luningi kakhulu (ikakhulukazi ibhodi elizinhlangothi ezimbili aligcotshwa). Ubulukhuni bangaphakathi kanye nokungcola okuncane okufana nendawo endaweni yebhodi nakho kungasuswa; ikakhulukazi kunezimo ezimbalwa zokucwiliswa okuncane: ikhwalithi ye-micro-etching agent i-hydrogen peroxide noma i-sulfuric acid impofu kakhulu, noma i-ammonium persulfate (i-sodium) iqukethe ukungcola okuningi, ngokuvamile Kunconywa ukuthi okungenani ibe yi-CP ibanga. Ngaphezu kwebanga lezimboni, okunye ukwehluleka kwekhwalithi kungase kubangelwe; okuqukethwe kwethusi okuphezulu ngokweqile kubhavu e-micro-etching noma izinga lokushisa eliphansi kungase kubangele ukuna kancane kwamakristalu e-copper sulfate; futhi uketshezi lokugeza lungcolile futhi lungcolile.

Iningi lesixazululo sokwenza kusebenze libangelwa ukungcola noma ukulungiswa ngendlela engafanele. Isibonelo, ukuvuza kwephampu yesihlungi, uketshezi lokugeza lunomfutho othize ophansi, futhi okuqukethwe kwethusi kuphezulu kakhulu (ithangi lokuqalisa lisetshenziswe isikhathi eside kakhulu, ngaphezu kweminyaka emi-3), okuzokhiqiza izinhlayiyana ezimisiwe kubhavu. . Noma i-colloid yokungcola, ekhangisiwe endaweni yepuleti noma odongeni lwembobo, kulokhu kuzohambisana nokumahhadla kwembobo. Ukuqedwa noma ukusheshisa: isixazululo sokugeza side kakhulu ukuthi sibonakale siyi-turbid, ngoba iningi lesisombululo sokuqedwa lilungiswa nge-fluoroboric acid, ukuze lihlasele i-fiber yeglasi ku-FR-4, okubangela ukuthi i-silicate ne-calcium usawoti okugeza kukhuphuke. . Ngaphezu kwalokho, ukwanda kokuqukethwe kwethusi kanye nenani le-tin encibilikile ekugezeni kuzobangela ukukhiqizwa kwezinhlayiya zethusi endaweni yebhodi. Ithangi lokucwila ithusi ngokwalo libangelwa ikakhulukazi umsebenzi oweqile woketshezi lwethangi, uthuli olunyakazayo emoyeni, kanye nenani elikhulu lezinhlayiya eziqinile ezimisiwe oketshezini lwethangi. Ungakwazi ukulungisa amapharamitha wenqubo, ukhuphule noma ufake esikhundleni isici sokuhlunga umoya, ukuhlunga ithangi lonke, njll. Isixazululo esisebenzayo. Ithangi le-asidi ehlanjululweyo yokugcina okwesikhashana ipuleti lethusi ngemva kokufakwa kwethusi, uketshezi lwethangi kufanele lugcinwe luhlanzekile, futhi uketshezi lwethangi kufanele kushintshwe ngesikhathi lapho ludubukile.

Isikhathi sokugcina sebhodi lokucwiliswa kwethusi akufanele sibe side kakhulu, ngaphandle kwalokho ibhodi lebhodi lizokwenziwa kalula i-oxidized, ngisho nesisombululo se-asidi, futhi ifilimu ye-oxide izoba nzima kakhulu ukulahla ngemva kwe-oxidation, ukuze kukhiqizwe izinhlayiya zethusi. indawo yebhodi. Izinhlayiya zethusi ezingaphezulu kwebhodi ezibangelwa inqubo yokucwilisa ithusi okukhulunywe ngenhla, ngaphandle kwe-oxidation engaphezulu, ngokuvamile zisatshalaliswa endaweni yebhodi ngokufana nangokujwayelekile okuqinile, futhi ukungcola okukhiqizwa lapha kuzodala kungakhathaliseki ukuthi conductive noma cha. Lapho kubhekwana nokukhiqizwa kwezinhlayiya zethusi ebusweni bepuleti yethusi ele-electroplated lohlelo lwe-PCB, amanye amabhodi amancane okuhlola angasetshenziswa ukucubungula ngokwehlukana ukuze kuqhathaniswe nokwahlulela. Ebhodini elinephutha elisendaweni, ibhulashi elithambile lingasetshenziswa ukuxazulula inkinga; inqubo yokudlulisa ihluzo: kukhona i-glue eyeqile ekuthuthukisweni (incane kakhulu Ifilimu esele ingabuye ihlanganiswe futhi ihlanganiswe ngesikhathi se-electroplating), noma ayihlanzwa ngemva kokuthuthukiswa, noma ipuleti libekwe isikhathi eside kakhulu ngemva kokudluliselwa kwephethini, okuholela emazingeni ahlukene e-oxidation endaweni yepuleti, ikakhulukazi ukuhlanzwa okungekuhle kwendawo yepuleti Lapho ukungcoliswa komoya endaweni yokusebenzela yokugcina noma yokugcina izinto kusinda. Isixazululo ukuqinisa ukugeza kwamanzi, ukuqinisa uhlelo futhi uhlele isimiso, futhi uqinise ukuqina kwe-acid degreasing.

Ithangi le-asidi le-electroplating yethusi ngokwalo, ngalesi sikhathi, ukwelashwa kwalo kwangaphambili ngokuvamile akubangeli izinhlayiya zethusi endaweni yebhodi, ngoba izinhlayiya ezingaqhubeki zingabangela kakhulu ukuvuza noma imigodi endaweni yebhodi. Izizathu zezinhlayiya zethusi endaweni yepuleti ebangelwa i-cylinder yethusi zingafingqwa ngezici eziningana: ukugcinwa kwemingcele yokugeza, ukukhiqizwa nokusebenza, impahla kanye nokugcinwa kwenqubo. Ukugcinwa kwamapharamitha okugeza okugeza kuhlanganisa i-sulfuric acid ephezulu kakhulu, ithusi eliphansi kakhulu, izinga lokushisa lokugeza eliphansi noma eliphakeme kakhulu, ikakhulukazi ezimbonini ezingenazo izinhlelo zokupholisa ezilawulwa izinga lokushisa, lokhu kuzobangela ukuthi uhla lwamanje lokuminyana kwebhavu lwehle, ngokusho kwe inqubo evamile yokukhiqiza Ukusebenza, i-powder yethusi ingase ikhiqizwe ekugezeni futhi ixutshwe ekugezeni;

Mayelana nokusebenza kokukhiqiza, amandla amanje ngokweqile, ukuqhekeka okungekuhle, amaphuzu okuncinza angenalutho, kanye nepuleti eliwiswe ethangini ngokumelene ne-anode ukuthi lincibilike, njll. nakho kuzodala amandla amaningi ngokweqile kwamanye amapuleti, okuholela ekubeni impushana yethusi, iwele oketshezini lwethangi. , futhi kancane kancane kubangele ukwehluleka kwezinhlayiya zethusi; Isici sezinto ezibonakalayo siwukuqukethwe kwe-phosphorus ye-engeli yethusi ye-phosphor kanye nokufana kokusatshalaliswa kwe-phosphorus; isici sokukhiqiza nokugcinwa ngokuyinhloko siwukucubungula okukhulu, futhi i-engeli yethusi iwela ethangini lapho i-engeli yethusi yengezwa, ikakhulukazi ngesikhathi sokucubungula okukhulu, ukuhlanzwa kwe-anode nokuhlanza isikhwama se-anode, amafektri amaningi awaphathwa kahle. , futhi kunezingozi ezicashile. Ukuze uthole ukwelashwa kwebhola le-copper, indawo engaphezulu kufanele ihlanzwe, futhi indawo yethusi entsha kufanele ifakwe kancane nge-hydrogen peroxide. Isikhwama se-anode kufanele sicwiliswe nge-sulfuric acid hydrogen peroxide kanye ne-lye ngokulandelana ukuze sihlanzeke, ikakhulukazi isikhwama se-anode kufanele sisebenzise isikhwama sokuhlunga se-5-10 micron gap PP. .

Imigodi ye-Electroplating: Lesi sici siphinde sibangele izinqubo eziningi, kusukela ekushoneni kwethusi, ukudluliswa kwephethini, ukuya ekwelapheni kwangaphambili kwe-electroplating, i-copper plating kanye ne-tin plating. Isizathu esiyinhloko sokucwila kwethusi ukuhlanzwa okungalungile kwebhasikidi lokulenga ithusi elicwilayo isikhathi eside. Ngesikhathi se-microetching, uketshezi olungcolile oluqukethe i-palladium yethusi luzoconsa lusuka kubhasikidi olengayo phezu kwebhodi, lubangele ukungcola. Imigodi. Inqubo yokudlulisa ihluzo ibangelwa ikakhulukazi ukunganakwa kahle kwemishini nokuthuthukisa ukuhlanzwa. Kunezizathu eziningi: i-brush roller suction stick yomshini wokuxubha ingcolisa amabala eglue, izitho zangaphakathi zomshini wommese womoya engxenyeni yokomisa zomile, kukhona uthuli olunamafutha, njll., ingaphezulu lebhodi liyaqoshwa noma uthuli. iyasuswa ngaphambi kokuphrinta. Okungalungile, umshini okhulayo awuhlanzekile, ukugeza emva kokuthuthukiswa akukuhle, i-defoamer equkethe i-silicon ingcolisa indawo yebhodi, njll. Ukwelashwa kwangaphambili kwe-electroplating, ngoba ingxenye eyinhloko yokugeza uketshezi i-sulfuric acid, kungakhathaliseki ukuthi i-acidic. i-agent yokuhlanza, i-micro-etching, i-prepreg, nesisombululo sokugeza. Ngakho-ke, lapho ubulukhuni bamanzi buphezulu, buzovela buxubene futhi bungcolise indawo yebhodi; ngaphezu kwalokho, ezinye izinkampani zine-encapsulation engalungile yama-hangers. Isikhathi eside, kuzotholakala ukuthi i-encapsulation izohlakazeka futhi isakaze ethangini ebusuku, ingcolise uketshezi lwethangi; lezi zinhlayiya ezingezona u-conductive zikhangiswa ebusweni bebhodi, okungase kubangele imigodi ye-electroplating yamazinga ahlukene we-electroplating elandelayo.

I-asidi yethusi ye-electroplating tank ngokwayo ingaba nezici ezilandelayo: i-air blast tube iphuma endaweni yokuqala, futhi umoya uphazamiseka ngokungalingani; iphampu yokuhlunga iyavuza noma i-inlet yoketshezi iseduze neshubhu lokuqhuma komoya ukuze ihogele umoya, ikhiqize amabhamuza omoya amahle, akhangiswa endaweni yebhodi noma onqenqemeni lomugqa. Ikakhulukazi eceleni komugqa ovundlile kanye nekhoneni lomugqa; elinye iphuzu lingase libe ukusetshenziswa kwezinsimbi zekotini eziphansi, futhi ukwelashwa akuphelele. I-ejenti ye-anti-static yokwelapha esetshenziswa enqubweni yokukhiqiza umongo kakotini ingcolisa uketshezi lokugeza futhi ibangele ukuvuza kwe-plating. Lesi simo singengezwa. Vuthela, hlanza igwebu le-liquid surface ngesikhathi. Ngemuva kokuthi umgogodla kakotini ucwiliswe nge-asidi ne-alkali, umbala webhodi lebhodi umhlophe noma awulingani: ikakhulukazi ngenxa ye-ejenti yokupholisha noma izinkinga zokulungisa, futhi ngezinye izikhathi kungase kube izinkinga zokuhlanza ngemva kokunciphisa i-asidi. Inkinga ye-micro-etching.

Ukungahleleki kahle kwe-ejenti ekhanyayo kusilinda sethusi, ukungcoliswa okukhulu kwezinto eziphilayo, kanye nezinga lokushisa lokugeza elidlulele kungase kubangelwe. Ukukhishwa kwe-asidi ngokuvamile akunazo izinkinga zokuhlanza, kodwa uma amanzi ene-asidi encane ye-pH kanye nezinto eziphilayo, ikakhulukazi ukugeza amanzi okugaywa kabusha, kungase kubangele ukuhlanzeka okungekuhle kanye nokuhushulwa okuncane; i-micro-etching ikakhulukazi ibheka okuqukethwe kwe-ejenti e-micro-etching eyeqile Okuphansi, okuqukethwe kwethusi okuphezulu kusixazululo se-micro-etching, izinga lokushisa eliphansi lokugeza, njll., kuzophinde kubangele ukungalingani kwe-micro-etching endaweni yebhodi; ngaphezu kwalokho, ikhwalithi yamanzi okuhlanza ayilungile, isikhathi sokugeza sithe ukude kancane noma isisombululo se-asidi sangaphambi kwe-soak singcolile, futhi indawo yebhodi ingase ingcoliswe ngemva kokwelashwa. Kuzoba khona i-oxidation encane. Ngesikhathi se-electroplating ekugezeni kwethusi, ngenxa yokuthi i-acidic oxidation futhi ipuleti ikhokhiswa ekugezeni, i-oxide kunzima ukuyisusa, futhi izophinde ibangele umbala ongalingani wendawo yepuleti; ngaphezu kwalokho, indawo yepuleti ixhumene nesikhwama se-anode, futhi ukuqhutshwa kwe-anode akulingani. , I-anode passivation nezinye izimo nazo zingabangela ukukhubazeka okunjalo.