Uhlu lwezizathu zokumbozwa kahle kwe-PCB

Uhlu lwezizathu zokuntula PCB enamathela

1. Imbobo yephini

Amaphinikhodi abangelwa i-hydrogen adsorbed ebusweni bezingxenye ezicwecwe, futhi azikhululwa isikhathi eside. Yenza isisombululo se-plating singakwazi ukumanzisa ingaphezulu lezingxenye ezipuletiwe, ukuze ungqimba lwe-plating lungakwazi ukufakwa nge-electrolytically. Njengoba ukujiya kokwembesa endaweni ezungeze indawo ye-hydrogen evolution kukhula, kwakheka imbobo endaweni yokuguquguquka kwe-hydrogen. Ibonakala ngembobo eyindilinga ecwebezelayo futhi kwesinye isikhathi nomsila omncane oya phezulu. Lapho isixazululo sokucwenga sintula i-ejenti yokumanzisa futhi ukuminyana kwamanje kuphezulu, amaphinifa akhiwa kalula.

ipcb

2. I-Pockmark

Umgodi ubangelwa indawo engcolile yendawo ecwebeziwe, ukumenyezelwa kwento eqinile, noma ukumiswa kwento eqinile esixazululweni sokucwenga. Uma ifinyelela ebusweni be-workpiece ngaphansi kwesenzo sensimu kagesi, i-adsorbed kuyo, ethinta i-electrolysis futhi ishumeke lezi zindaba eziqinile Kusendlalelo se-electroplating, ama-bumps amancane (imigodi) akhiwa. Isici siwukuthi i-convex, ayikho into ekhanyayo, futhi asikho isimo esimisiwe. Ngamafuphi, kubangelwa i-workpiece engcolile kanye nesisombululo se-plating esingcolile.

3. Imizila yomoya

I-air flow streaks ibangelwa izithasiselo eziningi kakhulu noma i-high cathode current density noma i-high complexing agent, enciphisa ukusebenza kahle kwamanje kwe-cathode, okuholela ekutheni kube nenani elikhulu le-hydrogen evolution. Uma isixazululo se-plating sigeleza kancane futhi i-cathode ihamba kancane, igesi ye-hydrogen izothinta ukuhlelwa kwamakristalu e-electrolytic ngesikhathi senqubo yokukhuphuka ngokumelene nobuso bomsebenzi wokusebenza, okwenza imigqa yokugeleza kwegesi ephansi kuya phezulu.

4. Ukufihla (okuveziwe)

I-masking ingenxa yokuthi ukukhanya okuthambile kwezikhonkwane ebusweni be-workpiece akususiwe, futhi i-electrolytic deposition coating ayikwazi ukwenziwa lapha. Izinto eziyisisekelo zibonakala ngemuva kwe-electroplating, ngakho-ke kubizwa ngokuthi obala (ngoba i-flash ethambile iyincenye ye-resin translucent noma esobala).

5. I-coating is brittle

Ngemuva kwe-SMD electroplating, ngemva kokusika izimbambo nokubunjwa, kungabonakala ukuthi kunemifantu ekugobeni kwezikhonkwane. Uma kukhona ukuqhekeka phakathi kongqimba lwe-nickel kanye ne-substrate, kubhekwa ukuthi ungqimba lwe-nickel luhlakazekile. Uma kukhona ukuqhekeka phakathi kongqimba lwe-tin kanye nongqimba lwe-nickel, kubhekwa ukuthi ungqimba lukathayela luhlakazekile. Imbangela yokonakala ikakhulukazi izithasiselo, ukukhanya okwedlulele, noma ukungcola okuningi kwe-inorganic noma okuphilayo kusixazululo sokucwenga.