Through the analysis of the parasitic characteristics of vias, we can see that in high-speed PCB design, seemingly simple vias often bring great negative effects to circuit design. In order to reduce the adverse effects caused by the parasitic effects of the vias, the following can be done in the design:

1. Considering the cost and signal quality, choose a reasonable size via size. For example, for the 6-10 layer memory module PCB design, it is better to use 10/20Mil (drilled/pad) vias. For some high-density small-size boards, you can also try to use 8/18Mil. hole. Under current technical conditions, it is difficult to use smaller vias. For power or ground vias, you can consider using a larger size to reduce impedance.

2. The two formulas discussed above can be concluded that using a thinner PCB is beneficial to reduce the two parasitic parameters of the via.

3. Zama ukungashintshi izendlalelo zezimpawu zezimpawu ebhodini le-PCB, okusho ukuthi, zama ukungasebenzisi ama-vias angadingekile.

4. Amandla nezikhonkwane zomhlabathi kufanele zibhojwe eduze, futhi ukuhola phakathi kwe-via nephini kufanele kube kufushane ngangokunokwenzeka, ngoba kuzokwandisa i-inductance. Ngesikhathi esifanayo, amandla kanye nemikhondo yomhlabathi kufanele ibe mkhulu ngangokunokwenzeka ukuze kuncishiswe i-impedance.

5. Beka i-vias ethile eduze kwe-vias yongqimba lwesignali ukuze unikeze iluphu eseduze yesiginali. Kungenzeka ngisho nokubeka inombolo enkulu yezindawo ezingasasebenzi ebhodini le-PCB. Yiqiniso, umklamo udinga ukuguquguquka. Imodeli okuxoxwe ngayo ngaphambili yisimo lapho kukhona amaphedi kusendlalelo ngasinye. Ngezinye izikhathi, singanciphisa noma sisuse ngisho namaphedi kwezinye izendlalelo. Ikakhulukazi lapho ukuminyana kwe-vias kuphezulu kakhulu, kungase kuholele ekwakhekeni kwe-break groove ehlukanisa iluphu kungqimba lwethusi. Ukuxazulula le nkinga, ngaphezu kokuhambisa isikhundla se-via, singacabanga nokubeka i-via kungqimba lwethusi. Usayizi wephedi uncishisiwe.