Izinga lokushisa kanye nendlela isipiliyoni BGA Welding

Okokuqala, uma iglue isetshenziswa emagumbini amane e-chip naseduze kwe-chip, qala ngokulungisa izinga lokushisa lesibhamu somoya oshisayo libe ngama-degree angu-330 kanye namandla omoya abe okungenani. Bamba isibhamu ngesandla sakho sobunxele kanye nama-tweezers esandleni sakho sokudla. Ngenkathi ushaya, ungacosha iglue ngama-tweezers. Kokubili iglue elimhlophe neglue elibomvu lingasuswa ngesikhathi esifushane. Naka isikhathi osenza ngaso kanye nesikhathi osivuthela ngaso
Ngeke kube yinde kakhulu. Izinga lokushisa lokuluma liphezulu. Ungakwenza ngezikhathi ezithile. Kwenze isikhashana, ume isikhashana. Ngaphezu kwalokho, lapho ukhetha ngama-tweezers, kufanele futhi uqaphele. I-glue ayithambile futhi awukwazi ukukhetha ngamandla. Kufanele futhi uqaphele ukuthi unganwayi ibhodi lesifunda. Uma kungenzeka, ungase futhi usebenzise ingcina ukuthambisa ingcina, kodwa ngicabanga ukuthi usasebenzisa hot-air gun BGA welding woza maduze.

Ake sikhulume ngezinyathelo zonke zokwenza ibhentshi lokulungisa i-BGA. Ngingaphumelela ngokuyisisekelo ekwenzeni ibhentshi lokulungisa le-BGA ngale ndlela, futhi ukwehla kwephuzu akuvamile ukwenzeka. Ake sithathe kabusha ikhadi lezithombe njengesibonelo.
Ake sikhulume ngezinyathelo zami ku-BGA:
1. Okokuqala, engeza inani elifanele lekhwalithi ephezulu ye-BGA Solder Namathisela ekhadini lemifanekiso, setha izinga lokushisa lesibhamu somoya oshisayo libe ngamadigri angu-200, unciphise amandla omoya, ushaye ngokumelene ne-solder unama, bese uphephetha kancane unamathisele we-solder. i-chip yekhadi lezithombe. Ngemuva kokuthi i-solder inamathisela i-chip yekhadi lezithombe ivuthelwe ngaphansi kwe-chip, lungisa amandla omoya wesibhamu somoya oshisayo phezulu bese ubhekana ne-chip futhi.
Inhloso yalokhu ukwenza i-solder inamathisele ijule ku-chip.

Izinga lokushisa kanye nendlela isipiliyoni BGA Welding
2. Ngemuva kokuthi izinyathelo ezingenhla seziqediwe, linda ukuthi i-chip iphole ngokuphelele (kubaluleke kakhulu), bese usula unamathisele we-solder oweqile futhi uzungeze i-chip yekhadi lezithombe ngekotini yotshwala. Qiniseka ukuthi uyayisula.
3. Bese, iphepha leplatinamu linamathiselwe eduze kwe-chip. Ukuze kuqinisekiswe ukuthi izinga lokushisa eliphakeme ngesikhathi sokushisela ngeke lilimaze i-capacitor, ishubhu lensimu kanye ne-triode ezungeze ikhadi lehluzo, kanye ne-crystal oscillator, ikakhulukazi inkumbulo yevidiyo ezungeze ikhadi lehluzo, iphepha le-platinum le-tin kufanele linamathiselwe ezingqimbeni ezingu-15 ngesikhathi. I-Beiqiao. Iphepha lami le-platinum likathayela lincane, futhi angazi ukuthi muhle kangakanani umphumela wokufakwa kwe-thermal uma izingqimba eziyi-15 zephepha le-platinum linamathiselwe,
Kodwa kufanele kusebenze. Okungenani ngaso sonke isikhathi lapho wenza i-BGA, kwakungekho nkinga ngememori yevidiyo eduze kwekhadi lehluzo kanye neNorth Bridge, futhi ayizange ihlanganiswe futhi iqhume.

Izinga lokushisa kanye nendlela isipiliyoni BGA Welding
Uma inkundla yokulungisa i-BGA yekhadi lehluzo ingakakhanyiswa ngemva kokuba isiqediwe, ngingaqiniseka ukuthi ayiqediwe. Ngeke ngingabaze ukuthi inkumbulo yevidiyo elandelayo noma i-North Bridge ilimele yini. Ngemuva kwe-chip yekhadi lezithombe, iphepha le-platinum le-tin kufanele futhi linamathiselwe. Ngivame ukunamathela esitezi sesihlanu. Futhi indawo inkulu kancane. Lokhu ukuvimbela lapho wenza BGA ukulungisa ebhentshini
, izinto ezincane ezingemuva kwe-chip ziyawa lapho kushisa. Ukunamathisela izendlalelo eziningi kungcono kunokunamathela isendlalelo esisodwa. Uma unamathela ungqimba olulodwa, izinga lokushisa eliphezulu lizoncibilika ngokuphelele iglue ephepheni lethini bese linamathela ebhodini, elibi kakhulu. Uma unamathisela izendlalelo eziningi, lesi simo ngeke sivele.