Eminyakeni yamuva nje, ukuze kuhlangatshezwane nezidingo zokuncishiswa kwemikhiqizo yabathengi ephezulu esezingeni eliphakeme, ukuhlanganiswa kwe-chip kuya ngokuya kukhula, isikhala se-BGA pin sisondela futhi sisondela (ngaphansi noma esilingana no-0.4pitch), Ukuhlelwa kwe-PCB kuya ngokuya kuhlangana, futhi ukuminyana komzila kuya kukhula futhi kukhule. Ubuchwepheshe be-Anylayer (oda ngokungenasizathu) busetshenziselwa ukuthuthukisa ukwenziwa kokuklama ngaphandle kokuthinta ukusebenza okufana nobuqotho besiginali, Le yi-ALIVH noma yiluphi ungqimba lwe-IVH lwesakhiwo se-multilayer ephrintiwe.
Izici zobuchwepheshe zanoma iyiphi ungqimba ngembobo
Uma kuqhathaniswa nezici zobuchwepheshe be-HDI, inzuzo ye-ALIVH ukuthi inkululeko yokuklama yanda kakhulu futhi izimbobo zingashaywa ngokukhululeka phakathi kwezendlalelo, ezingenakutholwa ubuchwepheshe be-HDI. Ngokuvamile, abakhiqizi basekhaya bafeza isakhiwo esiyinkimbinkimbi, okungukuthi, umkhawulo wokuklama we-HDI ibhodi ye-HDI e-oda lesithathu. Ngoba i-HDI ayisebenzisi ngokuphelele imishini ye-laser, futhi umgodi ongcwatshwe kusendlalelo sangaphakathi usebenzisa izimbobo zemishini, izidingo ze-hole disc zikhulu kakhulu kunezimbobo ze-laser, futhi izimbobo zemishini zihlala esikhaleni esidlulayo. Ngakho-ke, uma kukhulunywa nje, uma kuqhathaniswa nokubhola okungafanele kobuchwepheshe be-ALIVH, ububanzi be-pore bepuleti langaphakathi lomgogodla futhi bungasebenzisa ama-micropores angu-0.2mm, okuseseyigebe elikhulu. Ngakho-ke, isikhala sezintambo zebhodi le-ALIVH cishe siphakeme kakhulu kunaleso se-HDI. Ngasikhathi sinye, ubunzima bezindleko nokucubungula kwe-ALIVH nakho kuphezulu kunalokho kwenqubo ye-HDI. Njengoba kukhonjisiwe kuMdwebo 3, kungumdwebo ohleliwe we-ALIVH.
Izinselelo zokwakha ze-vias kunoma iyiphi ungqimba
Isendlalelo esingenakuphikiswa ngobuchwepheshe sichitha ngokuphelele indabuko ngendlela yokuklama. Uma usadinga ukusetha ama-vias ezinhlakeni ezahlukahlukene, kuzokwandisa ubunzima bokuphathwa. Ithuluzi lokuklama lidinga ukuba nekhono lokubhola okuhlakaniphile, futhi lingahlanganiswa futhi lihlukaniswe ngentando.
I-Cadence ingeza indlela yokufaka izintambo ngokususelwa kusendlalelo sokusebenza kunqubo yendabuko yendabuko ngokususelwa kusendlalelo sokufaka izintambo, njengoba kukhonjisiwe ku-Figure 4: ungabheka ungqimba olungakwazi ukwenza umugqa we-loop kuphaneli yesendlalelo esisebenzayo, bese uqhafaza kabili hole ukukhetha noma iyiphi ungqimba wokufaka ucingo esikhundleni.
Isibonelo sokuklanywa kwe-ALIVH nokwenza amapuleti:
Idizayini eyi-10 enesitezi se-ELIC
Ipulatifomu le-OMAP4
Ukumelana okungcwatshwe, amandla angcwatshwe nezinto ezifakiwe
Ukudidiyelwa okuphezulu nokwenziwa okuncane kwamadivayisi aphathwayo kuyadingeka ekufinyeleleni ngejubane elikhulu kwi-Intanethi nakumanethiwekhi omphakathi. Njengamanje thembela kubuchwepheshe be-4-n-4 HDI. Kodwa-ke, ukuze kuzuzwe ukuphakama kokuxhuma okuphezulu kwesizukulwane esilandelayo sobuchwepheshe obusha, kulo mkhakha, ukushumeka izingxenye ezingenzi lutho noma ezisebenzayo ku-PCB naku-substrate kungahlangabezana nezidingo ezingenhla. Uma uhlela amafoni omakhalekhukhwini, amakhamera edijithali neminye imikhiqizo ye-elektroniki yabathengi, kuyinketho yamanje yokuklama ukubheka ukuthi ungazifaka kanjani izingxenye ezingenzi lutho nezisebenzayo ku-PCB naku-substrate. Le ndlela ingahluka kancane ngoba usebenzisa abahlinzeki abahlukile. Enye inzuzo yezingxenye ezishumekiwe ukuthi ubuchwepheshe buhlinzeka ngokuvikelwa kwempahla yengqondo kulokho okubizwa ngokuthi yi-reverse design. Umhleli we-Allegro PCB angahlinzeka ngezixazululo zezimboni. Isihleli se-Allegro PCB singasebenza futhi kakhulu ngebhodi le-HDI, ibhodi eliguqukayo nezingxenye ezishumekiwe. Ungathola amapharamitha afanele nezingqinamba zokuqedela ukwakhiwa kwezingxenye ezishumekiwe. Idizayini yamadivayisi ashumekiwe ayikwazi ukwenza inqubo ye-SMT ibe lula kuphela, kepha futhi ithuthukisa kakhulu inhlanzeko yemikhiqizo.
Ukumelana nokungcwatshwa nokwakhiwa kwamandla
Ukumelana okungcwatshwe, okwaziwa nangokuthi ukumelana nokungcwatshwa noma ukumelana nefilimu, ukucindezela okokuvikela okukhethekile ku-substrate yokuvikela, bese uthola inani lokudinga elidingekayo ngokunyathelisa, ngokufaka ama-etching nezinye izinqubo, bese ulicindezela kanye nezinye izingqimba ze-PCB ukwakha indiza ukumelana ungqimba. Ubuchwepheshe obujwayelekile bokukhiqiza be-PTFE obufihlwe ukumelana nebhodi ephrintiwe engafinyelela ukumelana okudingekayo.
Amandla we-capacitance angcwatshwe asebenzisa okokusebenza ngamandla amakhulu we-capacitance futhi anciphisa ibanga eliphakathi kwezendlalelo ukwakha i-capacitance enkulu eyanele yamapuleti ukudlala indima yokuqothula nokuhlunga kohlelo lokuphakelwa kwamandla, ukuze kuncishiswe amandla e-discrete adingekayo ebhodini futhi kuzuzwe izici ezingcono zokuhlunga imvamisa ephezulu. Ngoba ukwehliswa kwesidlakudla kwamandla wokungcwaba kuncane kakhulu, iphuzu lawo lemvamisa elizungezayo lizoba ngcono kune-capacitance ejwayelekile noma amandla aphansi we-ESL.
Ngenxa yokuvuthwa kwenqubo nobuchwepheshe kanye nesidingo sokwakhiwa kwejubane elikhulu kohlelo lokuphakelwa kukagesi, ubuchwepheshe bamandla wokungcwaba busetshenziswa kakhulu. Sisebenzisa ubuchwepheshe bokungcwatshwa okungcwatshiwe, kufanele kuqala sibale usayizi weplate plate capacitance Figure 6 flat plate capacitance calculation formula
Okokuthi:
C yi-capacitance yamandla angcwatshwe (ipuleti capacitance)
Indawo yindawo yamapuleti acabalele. Kumiklamo eminingi, kunzima ukukhulisa indawo phakathi kwamapuleti ayizicaba lapho isakhiwo sinqunywa
I-D_ K ingukuguquguquka kwe-dielectric okuphakathi nendawo phakathi kwamapuleti, futhi amandla aphakathi kwamapuleti alingana ngqo ne-dielectric njalo
I-K i-vacuum permittivity, eyaziwa nangokuthi i-vacuum permittivity. Kuyinto engaguquguquki ebonakalayo enenani lika-8.854 187 818 × 10-12 farad / M (F / M);
H ubukhulu phakathi kwezindiza, futhi amandla aphakathi kwamapuleti alingana ngokulingana nokushuba. Ngakho-ke, uma sifuna ukuthola amandla amakhulu, sidinga ukunciphisa ubukhulu be-interlayer. I-3M c-ply egqitshwe amandla we-capacitance ingafinyelela ukushuba kwe-dielectric ye-interlayer ye-0.56mil, futhi ukungaguquguquki kwe-dielectric kwe-16 kukhulisa kakhulu amandla aphakathi kwamapuleti.
Ngemuva kokubala, i-3M c-ply egqitshwe amandla we-capacitance ingafinyelela i-inter plate capacitance engu-6.42nf nge-intshi ngayinye.
Ngasikhathi sinye, kuyadingeka futhi ukusebenzisa ithuluzi lokulingisa le-PI ukulingisa impedance eqondisiwe ye-PDN, ukuze kunqunywe uhlelo lokuklama amandla webhodi elilodwa futhi kugwenywe ukwakhiwa okungafuneki kwamandla we-capacitance wangcwatshwa kanye ne-capacitance ehlukile. Umdwebo 7 ukhombisa imiphumela yokulingisa ye-PI yokwakhiwa komthamo ongcwatshiwe, kubhekwa kuphela umphumela we-inter board capacitance ngaphandle kokungeza umphumela we-discitititance discrete. Kungabonakala ukuthi ngokwandisa umthamo ongcwatshiwe kuphela, ukusebenza kwawo wonke amandla we-impedance curve kuthuthukiswe kakhulu, ikakhulukazi ngaphezulu kwe-500MHz, okuyibhendi yemvamisa lapho izinga lebhodi le-discrete capacitor lokuhluza kunzima ukusebenza kulo. I-capacitor yebhodi inganciphisa ngempumelelo impedance yamandla.