1. Inhlaka ye-BT
Igama eligcwele le-resin ye-BT yi- “bismaleimide triazine resin”, eyakhiwa yi-Mitsubishi Gas Company yaseJapan. Yize isikhathi se-patent se-resin ye-BT sesiphelile, iMitsubishi Gas Company isesikhundleni esiphambili emhlabeni ku-R & D nasekusebenziseni i-resin ye-BT. I-resin ye-BT inezinzuzo eziningi ezifana ne-Tg ephezulu, ukumelana nokushisa okuphezulu, ukumelana nomswakama, i-dielectric engapheli (DK) ne-low loss factor (DF). Kodwa-ke, ngenxa yesendlalelo sentambo yengilazi, kunzima kune-FC substrate eyenziwe nge-ABF, i-wiring enenkinga nobunzima obukhulu ekubhoneni i-laser, ayikwazi ukuhlangabezana nezidingo zemigqa emihle, kepha ingaqinisa ubukhulu futhi ivimbele ukwanda okushisayo nokuncipha okubandayo ekuthinteni isivuno somugqa, ngakho-ke, izinto ze-BT zisetshenziselwa kakhulu ama-chip network kanye nama-logic chips ahlelwe ngezidingo zokuthembeka okuphezulu. Njengamanje, ama-substrates e-BT asetshenziswa kakhulu kuma-chip mobile MEMS chips, chips chips, memory chips kanye neminye imikhiqizo. Ngokuthuthuka okusheshayo kwama-chip e-LED, ukusetshenziswa kwe-BT substrates kumaphakethe we-chip ye-LED nakho kuthuthuka ngokushesha.

2,ABF
Izinto ze-ABF yinto eholwa futhi yathuthukiswa yi-Intel, esetshenziselwa ukukhiqizwa kwamabhodi wezinga eliphezulu athwala njenge-flip chip. Uma kuqhathaniswa ne-BT substrate, impahla ye-ABF ingasetshenziswa njenge-IC enesifunda esincane futhi ifanele inombolo ephezulu yephini nokudluliswa okuphezulu. Isetshenziselwa kakhulu ama-chip aphezulu aphezulu njenge-CPU, i-GPU ne-chip set. I-ABF isetshenziswa njengesendlalelo sokwengeza. I-ABF ingaxhunyaniswa ngqo kwi-substrate yethusi yethusi njengesifunda ngaphandle kwenqubo yokucindezela ezishisayo. Esikhathini esedlule, i-abffc ibinenkinga yokushuba. Kodwa-ke, ngenxa yobuchwepheshe obukhulayo be-substrate yethusi, i-abffc ingaxazulula inkinga yokushuba inqobo nje uma yamukela ipuleti elincanyana. Ezinsukwini zokuqala, ama-CPU amaningi wamabhodi we-ABF ayesetshenziswa kumakhompyutha nakududuzo lomdlalo. Ngokukhuphuka kwama-smart phone nokushintsha kobuchwepheshe bokupakisha, imboni ye-ABF yake yawela ngaphansi. Kodwa-ke, eminyakeni yamuva nje, ngokuthuthuka kwejubane lenethiwekhi nokuqhamuka kwezobuchwepheshe, izicelo ezintsha zekhompyutha esebenza kahle kakhulu sezivele, futhi isidingo se-ABF siphinde sakhuliswa futhi. Ngokombono womkhuba wemboni, i-ABF substrate ingahambisana nesivinini se-semiconductor esezingeni eliphakeme, ukuhlangabezana nezidingo zomugqa omncane, ububanzi bobubanzi bomugqa / ibanga lomugqa, kanye nokukhula kwemakethe okungalindeleka ngokuzayo.
Amandla wokukhiqiza alinganiselwe, abaholi bemboni baqala ukukhulisa umkhiqizo. NgoMeyi 2019, uXinxing umemezele ukuthi kulindeleke ukuthi kutshalwe ama-yuan angama-20 billion kusuka ku-2019 kuya ku-2022 ukukhulisa isitshalo se-IC sokufaka izinto eziphezulu kakhulu futhi athuthukise ngamandla ama-substrates we-ABF. Ngokuya ngezinye izitshalo zaseTaiwan, i-jingshuo kulindeleke ukuthi idlulise amapuleti ekilasi elithwala abakhiqizi be-ABF, kanti iNandian nayo iyaqhubeka nokukhulisa umthamo wokukhiqiza. Imikhiqizo yanamuhla ye-elekthronikhi icishe ibe yi-SOC (system on chip), futhi cishe yonke imisebenzi nokusebenza kuchazwa ngemininingwane ye-IC. Ngakho-ke, ubuchwepheshe nezinto zokwenziwa kwamaphethelo we-back-end design carriers zizodlala indima ebaluleke kakhulu ukuqinisekisa ukuthi ekugcineni bangaxhasa ukusebenza kwejubane kwama-chip chips. Njengamanje, i-ABF (i-Ajinomoto build up film) iyisendlalelo esithandwa kakhulu esengeza okokusebenza okuphezulu kwe-IC emakethe, futhi abahlinzeki abakhulu bezinto ze-ABF ngabakhiqizi baseJapan, abanjengo-Ajinomoto neSekisui chemical.
Ubuchwepheshe Jinghua kuyinto nomkhiqizi wokuqala eChina ukuba ngokuzimela ukuthuthukisa ABF izinto. Njengamanje, imikhiqizo iqinisekiswe ngabakhiqizi abaningi ekhaya naphesheya futhi ithunyelwe ngamanani amancane.

3,I-MIS
Ubuchwepheshe bokupakisha be-MIS substrate ubuchwepheshe obusha, obukhula ngokushesha emikhakheni yezimakethe ye-analog, i-IC yamandla, imali yedijithali njalonjalo. Ngokuhlukile kwe-substrate yendabuko, i-MIS ifaka isendlalelo esisodwa noma eziningi zesakhiwo esifakwe ngaphakathi. Isendlalelo ngasinye sixhunywe nge-electroplating copper ukuhlinzeka ngogesi kuhlelo lokupakisha. I-MIS ingashintsha amanye amaphakeji wendabuko afana nephakeji le-QFN noma iphakethe le-leadframe, ngoba i-MIS inekhono lentambo elincanyana, ukusebenza kangcono kukagesi nokushisa, nesimo esincanyana.