Ngokukhula kwe-5g, i-AI nezimakethe zekhompyutha esebenza kahle kakhulu, isidingo sabathwali be-IC, ikakhulukazi abathwali be-ABF, siqhume. Kodwa-ke, ngenxa yomthamo olinganiselwe wabaphakeli abafanelekile, ukunikezwa kwabaphethe i-ABF kuyashoda kanti intengo iyaqhubeka nokukhuphuka. Imboni ilindele ukuthi inkinga yokuphakelwa okuqinile kwamapuleti e-ABF ingaqhubeka kuze kube ngu-2023. Kulesi simo, izitshalo ezine ezinkulu zokulayisha amapuleti eTaiwan, iXinxing, iNandian, i-jingshuo neZhending, zethule izinhlelo zokunwetshwa kwamapuleti e-ABF kulo nyaka, nge izindleko eziphelele zezimali ezingaphezu kwe-NT $ 65 billion ezitshalweni zezwe nezaseTaiwan. Ngaphezu kwalokho, i-ibiden ne-shinko yaseJapan, izimoto zakwa-Samsung kanye ne-Dade electronics yaseNingizimu Korea zibuye zandisa utshalomali lwabo kuma-ABF carriers plate.

Isidingo nentengo yebhodi yenethiwekhi ye-ABF inyuka kakhulu, kanti ukushoda kungaqhubeka kuze kube ngu-2023
I-IC substrate ithuthukiswa ngesisekelo sebhodi le-HDI (ibhodi yesifunda yokuxhuma kakhulu), enezici zobuningi obukhulu, ukucacisa okuphezulu, i-miniaturization kanye nokuzaca. Njengoba izinto eziphakathi ezixhuma i-chip nebhodi lesifunda kunqubo yokupakisha ye-chip, umsebenzi oyinhloko webhodi lesithwali le-ABF ukwenza ukuxhumana okuphezulu nokuxhumana okusheshayo nge-chip, bese kuxhunyaniswa nebhodi elikhulu le-PCB ngemigqa eminingi ebhodini lesithwali le-IC, elidlala indima yokuxhuma, ukuvikela ubuqotho besekethe, ukunciphisa ukuvuza, ukulungisa indawo okukuyo Kulungele ukushabalalisa ukushisa okungcono kwe-chip ukuvikela i-chip, futhi kushumeke okungenzi lutho futhi okusebenzayo amadivayisi ukufeza imisebenzi ethile yohlelo.

Njengamanje, emkhakheni wokufaka okuphezulu, i-IC carrier isibe yingxenye ebaluleke kakhulu yokupakisha kwe-chip. Imininingwane ikhombisa ukuthi njengamanje, inani lesithwali se-IC ezindlekweni eziphelele zokupakisha selifinyelele cishe ku-40%.
Phakathi kwezithwali ze-IC, kukhona ikakhulukazi abathwali be-ABF (Ajinomoto build up film) kanye nabathwali be-BT ngokuya ngezindlela ezahlukahlukene zobuchwepheshe ezifana nohlelo lwe-CLL resin.
Phakathi kwazo, ibhodi yenethiwekhi ye-ABF isetshenziselwa ikakhulukazi ama-chip computing chips afana ne-CPU, GPU, FPGA ne-ASIC. Ngemuva kokuthi lawa machisi akhiqiziwe, imvamisa adinga ukuhlanganiswa ebhodini lesithwali le-ABF ngaphambi kokuthi ahlangane ebhodini elikhulu le-PCB. Lapho isithwali se-ABF sesiphelile, abakhiqizi abakhulu kubandakanya i-Intel ne-AMD abakwazi ukubalekela isiphetho sokuthi i-chip ayikwazi ukuthunyelwa. Ukubaluleka kwesithwali se-ABF kungabonakala.

Kusukela engxenyeni yesibili yanyakenye, ngenxa yokukhula kwe-5g, i-cloud AI computing, amaseva nezinye izimakethe, isidingo samashipsi we-computing ephezulu (HPC) sikhule kakhulu. Kuhambisana nokukhula kwesidingo semakethe yehhovisi lasekhaya / ezokuzijabulisa, izimoto nezinye izimakethe, isidingo sama-CPU, ama-GPU nama-AI chips ohlangothini lwesiginali sikhuphuke kakhulu, okubuye kwenyusa isidingo samabhodi wezinkampani ze-ABF.