PCB copying is also known as PCB cloning, PCB copying, PCB cloning, PCB reverse design or PCB reverse development.

Okungukuthi, ngesisekelo sokuba nemikhiqizo ye-elekthronikhi kanye namabhodi wesekethe, ukuhlaziywa okuphindayo kwamabhodi wesifunda kwenziwa ngokusebenzisa ubuchwepheshe bokucwaninga nokuthuthuka, kanye namafayili we-ORIGINAL product PCB, amafayela e-BOM, amafayili wesikimu wokuhlela neminye imibhalo yezobuchwepheshe njengoba kanye namafayela wokukhiqiza we-PCB silkscreen abuyiselwa 1: 1.

Ngemuva kwalokho sebenzisa le mibhalo yezobuchwepheshe nemibhalo yokukhiqiza ekwenzeni ibhodi le-PCB, ukuwelda ingxenye, ukuhlolwa kwenaliti ezindizayo, ukulungisa iphutha lebhodi lesifunda, qedela ikhophi lesampula lesifunda sokuqala.

How to carry out the backsliding of PCB schematic diagram what is the backsliding process?

Ngebhodi lokukopisha le-PCB, abantu abaningi abaqondi, yini ibhodi yokukopisha ye-PCB, abanye abantu bacabanga ukuthi ibhodi yokukopisha ye-PCB yi-copycat.

Ekuqondeni kwawo wonke umuntu, i-shanzhai isho ukulingiswa, kepha ukukopisha kwe-PCB nakanjani akulingisi. Inhloso yokukopisha kwe-PCB ukufunda ubuchwepheshe bamuva bokuklanywa kwesekethe yakwamanye amazwe, bese ubamba izikimu ezinhle kakhulu zedizayini, bese uzisebenzisela ukuthuthukisa nokuklama imikhiqizo engcono.

Ngokuthuthuka okuqhubekayo nokujula komkhakha wokukopisha ibhodi, umqondo wanamuhla wokukopisha ibhodi le-PCB unwetshwe ebangeni elibanzi, awusenamkhawulo wokukopisha nokubhinca okulula kwebhodi yesifunda, kepha futhi kubandakanya nokuthuthuka kwesibili kwemikhiqizo nocwaningo nentuthuko imikhiqizo emisha.

, ngokwesibonelo, ngokuhlaziywa kwemibhalo yezobuchwepheshe yomkhiqizo, ukucabanga kokuklanywa, izici zesakhiwo nobuchwepheshe bokuqonda nokuxoxisana, kunganikeza ukuhlaziywa kokungenzeka kocwaningo nokwakhiwa kwemikhiqizo emisha nemininingwane yokuncintisana, ukusiza amayunithi ocwaningo nokwakhiwa ukulandela ngesikhathi esifanele izindlela zokuthuthuka kwezobuchwepheshe, ukulungiswa okufika ngesikhathi ukwenza ngcono ukuklanywa kwemikhiqizo, ucwaningo nentuthuko kakhulu kunemakethe imikhiqizo emisha yokuncintisana.

Inqubo yokukopisha ibhodi le-PCB ingaqaphela ukuvuselelwa okusheshayo, ukukhuphula izinga nokuthuthuka kwezinhlobo ezahlukahlukene zemikhiqizo ye-elekthronikhi ngokukhipha nokuguqulwa okuyingxenye yamafayela wedatha yobuchwepheshe. Ngokusho komdwebo wedokhumenti nomdwebo ohleliwe okhishwe ekukopisheni kwe-PCB, abaklami abangochwepheshe nabo bangaqhakambisa ukuklama futhi bashintshe i-PCB ngokuya ngezifiso zekhasimende.

Ngalesi sizathu, ingangeza nemisebenzi emisha yomkhiqizo noma ihlele kabusha izici ezisebenzayo, ukuze umkhiqizo onemisebenzi emisha uvele ngejubane elisheshayo futhi nokuma okusha, hhayi nje kuphela ukuthi kunamalungelo ayo empahla yengqondo, kepha futhi kuwina ithuba lokuqala emakethe, liletha izinzuzo eziphindwe kabili kumakhasimende.

Noma ngabe isetshenziselwa ukuhlaziya imigomo yebhodi lesifunda kanye nezimpawu zokusebenza zomkhiqizo ocwaningweni olubuyela emuva, noma isetshenziswe njengesisekelo sokwakhiwa kwe-PCB ekuklanyeni phambili, i-PCB schematic inendima ekhethekile.

Ngakho-ke, ngokwedokhumenti noma into, ungawufeza kanjani umdwebo wesikimu we-PCB emuva, yini inqubo ebuyela emuva? Yimiphi imininingwane okufanele uyinake?

Izinyathelo ezibuyela emuva:

1. Qopha imininingwane ye-PCB

Thola i-PCB, okokuqala ephepheni ukurekhoda zonke izinto zemodeli, imingcele nendawo, ikakhulukazi idayode, ukuqondiswa kwethubhu enezitezi ezintathu, isiqondisi se-IC notch. Kungcono ukuthatha izithombe ezimbili zendawo yezakhi ngekhamera yedijithali. Amabhodi amaningi e-PCB enza okuthuthuke kakhulu ngaphezu kwe-diode triode amanye awanaki ukuvele abone.

2. Izithombe eziskeniwe

Susa zonke izinto bese ususa ithini emigodini ye-PAD. Hlanza i-PCB ngotshwala bese uyifaka kuskena eskena amaphikseli aphakeme kancane ukuthola isithombe esibukhali.

Bese, pholisha izingqimba ezingenhla nezingezansi kancane ngephepha lentambo yamanzi kuze kube yilapho ifilimu yethusi icwebezela. Bafake kuskena, qala i-PHOTOSHOP, bese uxubha izingqimba zombili ngokwehlukana ngombala.

Qaphela ukuthi i-PCB kufanele ibekwe ngokuvundlile nangokuqondile ku-scanner, ngaphandle kwalokho isithombe esiskeniwe ngeke sisetshenziswe.

3. Lungisa futhi ulungise isithombe

Lungisa ukungafani nokukhanya kwetende, ukuze ingxenye enefilimu yethusi nengxenye ngaphandle kokuqhathaniswa kwefilimu yethusi ngokuqinile, bese uphendulela isigatshana kokumnyama nokumhlophe, hlola ukuthi ngabe imigqa icacile, uma kungenjalo, phinda lesi sinyathelo. Uma sicacile, isithombe sizogcinwa njengamafomethi we-BMP amnyama nomhlophe we-TOP BMP ne-BOT BMP, uma isibalo kutholakala ukuthi sinezinkinga singalungiswa futhi silungiswe nge-PHOTOSHOP.

4. Qinisekisa isikhundla se-PAD ne-VIA

Guqula amafayela amabili we-BMP abe amafayela we-PROTEL ngokulandelana, bese udlulisa izingqimba ezimbili ku-PROTEL. Isibonelo, izikhundla ze-PAD ne-VIA ngemuva kwezendlalelo ezimbili ziyahlangana ngokuyisisekelo, okukhombisa ukuthi izinyathelo zangaphambili zenziwe kahle. Uma kukhona ukuphambuka, phinda isinyathelo sesithathu. Ngakho-ke, ukukopishwa kwebhodi le-PCB kungumsebenzi onesineke kakhulu, ngoba inkinga encane izothinta ikhwalithi kanye nezinga elifanayo ngemuva kokukopisha kwebhodi.

5. Dweba ungqimba

Guqula i-TOP layer BMP ibe yi-TOP PCB, qiniseka ukuthi uguqula ungqimba lwe-SILK, ungqimba ophuzi, bese ulandela umugqa kusendlalelo se-TOP, bese ubeka idivayisi ngokusho komdwebo osinyathelo 2. Susa ungqimba lwe-SILK ngemuva kokupenda. Phinda uze udwebe zonke izendlalelo.

6. Ukuhlanganiswa kwe-TOP PCB ne-BOT PCB

Faka i-TOP PCB ne-BOT PCB ku-PROTEL bese uwahlanganisa abe munye.

7. I-Laser phrinta i-TOP LAYER, i-BOTTOM LAYER

Sebenzisa iphrinta ye-laser ukuphrinta i-TOP LAYER ne-BOTTOM LAYER kwifilimu esobala (1: 1 ratio), faka ifilimu kuleyo PCB bese uqhathanisa uma ingalungile, uma ilungile, usuqedile.

Isivivinyo 8.

Hlola ukusebenza kwe-elekthronikhi lebhodi yamakhophi akufani nebhodi lasekuqaleni. Uma kuyefana-ke kusuke sekwenziwe ngempela.

Okwesibili, naka imininingwane

1. Hlukanisa ngokufanele izindawo zokusebenza

Lapho ihlehlisa ukuklama umdwebo ohleliwe we-PCB engaguquki, ukwahlukaniswa okunengqondo kwezindawo ezisebenzayo kungasiza onjiniyela ukunciphisa inkinga ethile engadingekile futhi bathuthukise ukusebenza kahle komdwebo.

Ngokuvamile, izingxenye ezinomsebenzi ofanayo ebhodini le-PCB zizohlelwa maphakathi, ukuze ukwahlukaniswa kokusebenza kwezindawo kunganikeza isisekelo esikahle futhi esinembile sokubuyisa umdwebo wesikimu.

Kodwa-ke, ukuhlukaniswa kwale ndawo esebenzayo akuyona into engqubuzanayo. Kudinga onjiniyela ukuthi babe nokuqonda okuthile kolwazi oluhlobene nesekethe lwe-elekthronikhi.

Okokuqala, thola izingxenye eziyinhloko zophiko olusebenzayo, bese ngokuya ngokuxhumeka kwentambo kungalandelwa ukuthola ezinye izingxenye zophiko olufanayo, ukwakheka kwesahlulelo esisebenzayo.

Ukwakheka kokuhlukaniswa okusebenzayo kuyisisekelo somdwebo wesikimu. Ngaphezu kwalokho, ungakhohlwa ukusebenzisa inombolo yento ebhodini lesifunda ukukusiza ukwahlukanisa imisebenzi ngokushesha.

2. Thola isiqeshana sesisekelo esifanele

Le ngcezu yesethenjwa kungashiwo ukuthi iyidolobha eliyinethiwekhi ye-PCB eyinhloko ekuqaleni komdwebo wesikimu. Ngemuva kokunquma izingcezu zokubhekisela, ukudweba ngokuya ngezikhonkwane zalezi zingcezu zezethenjwa kungaqinisekisa ukunemba komdwebo wesikimu ngezinga elikhulu.

Ibhentshimakhi yonjiniyela, isiqiniseko asizona izinto eziyinkimbinkimbi kakhulu, ngokujwayelekile, zingakhetha ukudlala indima ehamba phambili kuzinto zesekethe njengebhentshimakhi, ngokuvamile zinkulu, zikhomba ngaphezulu, ukudweba okulula, okufana nesekethe ehlanganisiwe, isiguquli, isiguquli, njll. ., zifanele njengebhentshimakhi.

3. Hlukanisa kahle imigqa bese udweba izintambo ezifanele

Ngokuhlukaniswa kocingo lwasemhlabathini, intambo yamandla nolayini wesiginali, onjiniyela futhi kudingeka babe nolwazi olufanele lokuphakelwa kwamandla, ukuxhumeka kwesifunda, i-PCB wiring nokunye. Ukuhlukaniswa kwala masekethe kungahlaziywa kusukela ekuxhumaneni kwezakhi, ububanzi bocingo lwethusi kanye nezimpawu zemikhiqizo kagesi uqobo.

Emdwebeni wezintambo, ukuvikela ukweqa ulayini nokungena ngaphakathi, umhlabathi ungasebenzisa inani elikhulu lezimpawu zokubeka phansi, zonke izinhlobo zemigqa zingasebenzisa imibala ehlukene yemigqa ehlukene ukuqinisekisa ukucace bha, ngoba zonke izinhlobo zezinto zingasebenzisa futhi okhethekile izimpawu, futhi angahlukanisa ngisho nomdwebo wesifunda, bese kuhlanganiswa.

4. Yazi kahle uhlaka oluyisisekelo bese ubheka imidwebo efanayo yesikimu

Kwindlela ethile eyisisekelo yokwakheka kohlaka lwe-elekthronikhi kanye nendlela yokudweba yenqubo, onjiniyela kudingeka bazi kahle, hhayi nje kuphela ukuthi bakwazi ukudweba ukwakheka okulula, okuyisisekelo okuyisisekelo kweseyunithi yeyunithi ngqo, kodwa futhi nokwakha uhlaka oluphelele lwesekethe kagesi.

Ngakolunye uhlangothi, unganaki ukuthi uhlobo olufanayo lwemikhiqizo ye-elekthronikhi inokufana okuthile kumdwebo wesikimu wedolobha lenethiwekhi le-PCB, onjiniyela bangakwazi ngokusho kokuqongelela kwesipiliyoni, badwebe ngokuphelele kumdwebo wesifunda ofanayo ukwenza okuphambene nalokho okusha umdwebo wesikimu womkhiqizo.

5. Hlola nokwandisa

Ngemuva kokuthi umdwebo ohleliwe usuphothuliwe, ukwakheka okuphambene nomdwebo wesikimu we-PCB kungaphethwa kuphela ngemuva kokuhlolwa nokuhlolwa. Amanani wokuqokwa wezinto ezizwela kumapharamitha wokusabalalisa we-PCB adinga ukubhekwa futhi alungiselelwe. Ngokomdwebo wefayela le-PCB, umdwebo wesikimu uyaqhathaniswa, uhlaziywe futhi uhlolwe ukuqinisekisa ukuthi umdwebo wesikimu uhambisana ngokuphelele nomdwebo wefayela.