Inzuzo I-HDI PCB

Ake sihlolisise umthelela. Ukwandisa ukuminyana kwephakeji kusivumela ukuthi sinciphise izindlela zikagesi phakathi kwezinto. Nge-HDI, sikhuphule inani lamashaneli wiring ezingqimbeni zangaphakathi ze-PCB, ngaleyo ndlela sinciphisa inani eliphelele lezendlalelo ezidingekayo ekwakhiweni. Ukunciphisa inani lezendlalelo kungabeka ukuxhumana okuningi ebhodini elifanayo futhi kuthuthukise ukubekwa kwengxenye, izintambo nokuxhuma. From there, we can focus on a technique called interconnect per Layer (ELIC), which helps design teams move from thicker boards to thinner flexible ones to maintain strength while allowing the HDI to see functional density.

HDI PCB rely on lasers rather than mechanical drilling. In turn, the HDI PCB design results in a smaller aperture and smaller pad size. Ukunciphisa ukuvula kwavumela ithimba lokuklama ukuthi lenyuse ukwakheka kwendawo yebhodi. Ukunciphisa izindlela zikagesi nokunika amandla izintambo eziqinisa kakhulu kuthuthukisa ubuqotho besiginali bomklamo futhi kusheshise ukucutshungulwa kwesiginali. Sithola inzuzo eyengeziwe ngobuningi ngoba sinciphisa amathuba ezinkinga ze-inductance kanye ne-capacitance.

Imiklamo ye-HDI PCB ayisebenzisi izimbobo, kepha izimbobo eziyimpumputhe nezingcwatshwe. Ukubekwa okungagqamile nokunembayo izimbobo zokungcwaba nezimpumputhe kunciphisa ingcindezi yemishini epuletini futhi kuvimbele noma yiliphi ithuba lokugoqeka. Ngaphezu kwalokho, ungasebenzisa izimbobo ezigqogqiwe ukuthuthukisa amaphuzu wokuxhumana nokuthuthukisa ukuthembeka. Ukusetshenziswa kwakho kuma-pads nakho kunganciphisa ukulahleka kwesiginali ngokunciphisa ukubambezeleka kokuwela nokunciphisa imiphumela ye-parasitic.

Ukukhiqizwa kwe-HDI kudinga ukusebenzisana

Idizayini yokukhiqiza (i-DFM) idinga indlela ecabangayo, eqondile yokwakhiwa kwe-PCB nokuxhumana okungaguquguquki nabakhiqizi nabakhiqizi. Ngenkathi sengeza i-HDI kuphothifoliyo ye-DFM, ukunakwa kwemininingwane emazingeni okuklama, okukhiqiza nawokukhiqiza kwaba okubaluleke kakhulu futhi nezingqinamba zokuhlangana nezokuhlola kwakudingeka zilungiswe. Ngamafuphi, inqubo yokuklama, ukwenza prototyping nokukhiqiza i-HDI PCBS idinga ukusebenzisana ngokubambisana nokunaka imithetho ethile ye-DFM esebenza kuphrojekthi.

Esinye sezici eziyisisekelo zedizayini ye-HDI (kusetshenziswa imishini ye-laser) kungaba ngaphezu kwamandla omkhiqizi, isihlanganisi, noma umenzi, futhi kudinga ukuxhumana okuqondisayo mayelana nokunemba nohlobo lohlelo lokubhola oludingekayo. Ngenxa yezinga lokuvula eliphansi nobukhulu besakhiwo esiphakeme se-HDI PCBS, iqembu lokwakha bekufanele liqinisekise ukuthi abakhiqizi nabakhiqizi bangahlangabezana nezidingo zomhlangano, zokuphinda basebenze nezokushisela zemiklamo ye-HDI. Ngakho-ke, amaqembu okuklama asebenza kumiklamo ye-HDI PCB kumele abe nekhono kumasu ayinkimbinkimbi asetshenziselwa ukukhiqiza amabhodi.

Yazi izinto zakho zebhodi lesifunda nokucaciswa

Ngoba ukukhiqizwa kwe-HDI kusebenzisa izinhlobo ezahlukahlukene zezinqubo zokumba imishini ye-laser, inkhulumomphendvulwano phakathi kwethimba ledizayini, umkhiqizi nomkhiqizi kumele bagxile ohlotsheni lwamabhodi lapho bexoxa ngenqubo yokumba. Uhlelo lokusebenza lomkhiqizo olushukumisela inqubo yokuklama lungaba nosayizi nezidingo zesisindo ezihambisa ingxoxo ohlangothini olulodwa noma kolunye. Izicelo zokuvama kakhulu zingadinga izinto ngaphandle kwe-FR4 ejwayelekile. Ngaphezu kwalokho, izinqumo ngohlobo lwezinto ze-FR4 zithinta izinqumo mayelana nokukhethwa kwezinhlelo zokumba noma ezinye izinsiza zokukhiqiza. Ngenkathi ezinye izinhlelo zibhoboza kalula ithusi, ezinye azingeneki ngokungaguquguquki ezintanjeni zengilazi.

Ngaphezu kokukhetha uhlobo lwezinto ezifanele, iqembu lokuklama kufanele futhi liqinisekise ukuthi umenzi nomkhiqizi bangasebenzisa ubukhulu bokulingana bepuleti namasu wokufaka. Ngokusetshenziswa kwe-laser drilling, isilinganiso sokuvula siyancipha futhi isilinganiso sokujula semigodi esetshenziselwa ukugcwaliswa kwezingcwecwe siyehla. Yize izingcwecwe ezijiyile zivumela ukwambulwa okuncane, izidingo zomshini zephrojekthi zingacacisa amapuleti amancane athambekele ekuhlulekeni ngaphansi kwezimo ezithile zemvelo. Ithimba labaklami kwakudingeka lihlole ukuthi umenzi wayenalo ikhono lokusebenzisa inqubo ye- “interconnect layer” futhi abhoboze izimbobo ekujuleni okulungile, futhi aqinisekise ukuthi isixazululo samakhemikhali esisetshenziselwa i-electroplating sizogcwalisa izimbobo.

Kusetshenziswa ubuchwepheshe be-ELIC

IDESIGN yama-HDI PCBS azungeze ubuchwepheshe be-ELIC inike amandla ithimba lokuklama ukuthi lithuthukise ama-PCBS athuthuke kakhulu, afaka izingqimba eziningi zezitokisi ezigcwele ezigcwele ithusi. Njengomphumela we-ELIC, ukwakheka kwe-PCB kungathatha ithuba lokuxhuma okuxinene, okuyinkimbinkimbi okudingekayo kumasekethe anejubane elikhulu. Ngoba i-ELIC isebenzisa ama-microholes agcwele ithusi ukuhlangana, ingaxhuma phakathi kwanoma yiziphi izingqimba ezimbili ngaphandle kokwenza ibhodi lesifunda libe buthakathaka.

Ukukhethwa kwento kuthinta ukwakheka

Noma iziphi izingxoxo nabakhiqizi nabakhiqizi maqondana nokuklanywa kwe-HDI kufanele futhi zigxile ekuhlelweni okuqondile kwezinto eziphakeme kakhulu. Ukukhethwa kwezinto kuthinta ububanzi bezintambo, isikhundla, isitaki nosayizi wemigodi. Isibonelo, imiklamo ye-HDI PCB ifaka phakathi i-dense ball grid array (BGA) kanye ne-BGA ehlukaniswe kahle edinga ukuphunyuka kwephini. Izici eziphazamisa ukunikezwa kwamandla nobuqotho besiginali kanye nobuqotho bomzimba bebhodi kumele zibonwe lapho kusetshenziswa lezi zinsiza. Lezi zinto zifaka phakathi ukuthola ukuhlukaniswa okufanelekile phakathi kwezendlalelo eziphezulu nezingezansi ukunciphisa i-crosstalk efanayo nokulawula i-EMI phakathi kwezingqimba zesiginali yangaphakathi.Izingxenye ezihlukaniswe ngokulinganisa zizosiza ukuvimbela ukucindezeleka okungalingani ku-PCB.

Naka isignali, amandla nobuqotho bomzimba

Ngaphezu kokuthuthukisa ubuqotho besiginali, ungaphinde uthuthukise ubuqotho bamandla. Ngoba i-HDI PCB ihambisa isendlalelo sokusondeza ngaphezulu, ukuthembeka kwamandla kuyathuthukiswa. Isendlalelo esiphezulu sebhodi sinesendlalelo sokubeka phansi nesendlalelo sokuphakelwa kwamandla kagesi, esingaxhunywa kusendlalelo sokubeka phansi ngokusebenzisa izimbobo eziyimpumputhe noma ama-microholes, futhi sinciphise inani lezimbobo zezindiza.

I-HDI PCB inciphisa inani lezimbobo ngokusebenzisa ungqimba lwangaphakathi lwebhodi. Ngokunjalo, ukunciphisa inani lamapayipi endizeni yamandla kunikeza izinzuzo ezintathu ezinkulu:

Indawo enkulu yethusi iphakela i-AC ne-DC yamanje kuphini yamandla we-chip

Ukumelana no-L kuyehla endleleni yamanje

L Ngenxa yokwehliswa okuphansi, amandla wokushintsha afanele angafunda iphini yamandla.

Elinye iphuzu eliyinhloko lengxoxo ukugcina ububanzi bomugqa omncane, isikhala esiphephile nokufana kwethrekhi. Kumagazini wokugcina, qala ukufeza ukujiya kwethusi okufanayo nokufana kwezintambo ngesikhathi senqubo yokwakhiwa bese uqhubeka nenqubo yokukhiqiza neyokukhiqiza.

Ukuntuleka kwezikhala eziphephile kungaholela ezinsaleleni zefilimu ezeqile ngesikhathi senqubo yangaphakathi yefilimu eyomile, engaholela kumasekhethi amafushane. Ngezansi kobubanzi bolayini obuncane nakho kungadala izinkinga ngesikhathi senqubo yokumboza ngenxa yokumuncwa okubuthakathaka nesekethe evulekile. Amathimba okuklama nabakhiqizi kufanele futhi bacabangele ukugcina ukufana kwethrekhi njengendlela yokulawula impedance yolayini wesiginali.

Sungula futhi usebenzise imithetho ethile yokuklama

Izakhiwo zokuminyana okuphezulu zidinga ubukhulu obuncane bangaphandle, ukuhlangana kahle kwe-wiring kanye nesikhala sezinto eziqinile, ngakho-ke kudinga inqubo ehlukile yokwakhiwa. Inqubo yokukhiqiza ye-HDI PCB ithembela ekubhoneni i-laser, isoftware ye-CAD ne-CAM, izinqubo zokuthwebula izithombe ze-laser ngqo, imishini yokukhiqiza ekhethekile, nobuchwepheshe bo-opharetha. Ukuphumelela kwayo yonke le nqubo kuncike engxenyeni yemithetho yokwakha ekhomba izidingo ze-impedance, ububanzi be-conductor, ubukhulu bembobo, nezinye izinto ezithinta ukwakheka. Developing detailed design rules helps select the right manufacturer or manufacturer for your board and lays the foundation for communication between teams.