Njengoba sonke sazi, isinki yokushisa iyindlela yokuthuthukisa umphumela wokushabalalisa ukushisa wezinto ezifakwe ebusweni ngokusebenzisa PCB ibhodi. Ngokuya ngesakhiwo, ukusetha izimbobo ebhodini le-PCB. Uma kuyibhodi le-PCB elinamacala amabili elikabili, lixhuma ubuso bebhodi le-PCB nocwecwe lwethusi ngemuva ukukhulisa indawo nevolumu yokushabalalisa ukushisa, okungukuthi, ukunciphisa ukumelana okushisayo. Uma kuyibhodi le-PCB elinezendlalelo eziningi, lingaxhunywa ebusweni phakathi kwezendlalelo noma ingxenye ekhawulelwe yesendlalelo esixhunyiwe, njll., Ingqikithi iyafana.

Isisekelo sezinto ezingaphezulu kwentaba ukunciphisa ukumelana nokushisa ngokufaka ebhodini le-PCB (substrate). Ukumelana okushisayo kuncike endaweni yocwecwe yethusi nobukhulu be-PCB esebenza njenge-radiator, kanye nobukhulu nezinto ze-PCB. Ngokuyinhloko, umphumela wokushiswa kokushisa uyathuthukiswa ngokwandisa indawo, ukwandisa ubukhulu nokuthuthukisa ukuqhutshwa kokushisa. Kodwa-ke, njengoba ukushuba kocwecwe lwethusi kuvame ukukhawulelwa ngemininingwane ejwayelekile, ubukhulu abunakunyuswa ngokungaboni. Ngaphezu kwalokho, kulezi zinsuku i-miniaturization isibe yimfuneko eyisisekelo, hhayi nje ngoba ufuna indawo ye-PCB, futhi empeleni, ukushuba kocwecwe lwethusi akukukhulu, ngakho-ke uma kudlula indawo ethile, ngeke ikwazi ukuthola umphumela wokushabalalisa ukushisa ohambelana nendawo.

Esinye sezixazululo zalezi zinkinga ukushisa okushisayo. Ukuze usebenzise kahle usinki wokushisa, kubalulekile ukubeka usinki oshisayo eduze kwento yokufudumeza, njengangaphansi kwengxenye. Njengoba kukhonjisiwe kumfanekiso ongezansi, kungabonakala ukuthi kuyindlela enhle yokusebenzisa umphumela wokulinganisa ukushisa ukuxhuma indawo nomehluko omkhulu wokushisa.

Ingxoxo ngokulungiswa kwembobo yokushiswa kokushisa ekwakhiweni kwe-PCB

Ukucushwa kwezimbobo zokuhlanza ukushisa

Okulandelayo kuchaza isibonelo esithile sesakhiwo. Ngezansi kunesibonelo sokuhleleka nobukhulu bomgodi wokushisa we-HTSOP-J8, iphakethe le-heat sink eliveziwe elingemuva.

Ukuze uthuthukise ukuqhutshwa okushisayo komgodi wokushiswa kokushisa, kunconywa ukuthi usebenzise imbobo encane enobubanzi obungaphakathi cishe be-0.3mm obungagcwaliswa nge-electroplating. Kubalulekile ukuthi wazi ukuthi i-solder creep ingenzeka ngesikhathi sokucutshungulwa kabusha uma isikhala sikhulu kakhulu.

Izimbobo zokushabalalisa ukushisa zicishe zehlukane nge-1.2mm, futhi zihlelwe ngqo ngaphansi kosinki bokushisa ngemuva kwephakeji. Uma kuphela usinki wokushisa ongemuva unganele ukushisa, ungamisa futhi izimbobo zokushabalalisa ukushisa ezungeze i-IC. Iphuzu lokumiswa kuleli cala ukulungiselela eduze kwe-IC ngangokunokwenzeka.

Ingxoxo ngokulungiswa kwembobo yokushiswa kokushisa ekwakhiweni kwe-PCB

Ngokuqondene nokumiswa nosayizi womgodi wokupholisa, inkampani ngayinye inolwazi lwayo lobuchwepheshe, kwezinye izimo kungenzeka ukuthi lwenziwe lwaba ngolulodwa, ngakho-ke, sicela ubheke okuqukethwe okungenhla ngesisekelo sengxoxo ethile, ukuze uthole imiphumela engcono .

Amaphuzu ayisihluthulelo:

Ukushisa ukushabalalisa umgodi kuyindlela yokushisa ukushisa ngokusebenzisa isiteshi (ngokusebenzisa imbobo) yebhodi le-PCB.

Umgodi wokupholisa kufanele ulungiselelwe ngqo ngaphansi kwento yokushisa noma usondele entweni yokushisa ngangokunokwenzeka.