Prosperous cities are inseparable from the decoration of LED lights. I believe we have all seen LED. Its figure has appeared in every place of our lives and illuminates our lives.

As the carrier of heat and air convection, the thermal conductivity of Power LED packaged PCB ibamba iqhaza elibalulekile ekushisweni kokushisa kwe-LED. I-DPC PCB ye-ceramic enokusebenza kwayo okuhle nentengo eyehlisiwe kancane kancane, ezintweni eziningi zokupakisha ze-elekthronikhi zibonisa ukuncintisana okuqinile, amandla okuthuthuka okupakisha we-LED wesikhathi esizayo. Ngokuthuthuka kwesayensi nobuchwepheshe kanye nokuvela kobuchwepheshe obusha bokulungiselela, ukwenziwa okuphezulu kokushisa okushisayo kwezinto zobumba njengempahla entsha ye-elektroniki ye-PCB inethemba lesicelo elibanzi kakhulu.

Ubuchwepheshe bokupakisha be-LED buthuthukiswa kakhulu futhi buvela ngesisekelo sobuchwepheshe bokupakisha bezinto ezihlukile, kepha bunokucaciswa okukhulu. Ngokuvamile, ingqikithi yedivayisi ehlukile ivaliwe emzimbeni wephakeji. Umsebenzi oyinhloko wephakheji ukuvikela ukuxhumana okuyisisekelo nokuphelele kagesi. Futhi ukufakwa kwe-LED ukuqedela amasiginali kagesi okukhiphayo, ukuvikela umsebenzi ojwayelekile womgogodla wokukhiphayo, okukhiphayo: ukusebenza okukhanyayo okubonakalayo, imingcele kagesi, kanye nemingcele ebonakalayo yomklamo nezidingo zobuchwepheshe, akunakuba nje ukupakisha okwehlukile kwe-LED.

Ngokuthuthuka okuqhubekayo kwamandla wokufaka we-chip ye-LED, inani elikhulu lokushisa okwenziwe ukusabalalisa kwamandla okuphezulu kubeka phambili izidingo eziphakeme zezinto zokupakisha ze-LED. Esiteshini sokushabalalisa ukushisa kwe-LED, i-PCB ehlanganisiwe iyisixhumanisi esiyisihluthulelo esixhuma isiteshi sokushabalalisa ukushisa kwangaphakathi nangaphandle, inemisebenzi yesiteshi sokushabalalisa ukushisa, ukuxhumeka kwesifunda kanye nokuxhaswa ngokomzimba kwe-chip. Ngemikhiqizo ye-LED enamandla amakhulu, ukupakisha i-PCBS kudinga ukwahlukanisa okuphezulu kagesi, ukuqhuba okuphezulu kokushisa kanye ne-coefficient yokwanda okushisayo ehambelana ne-chip.

Isixazululo esivele sikhona ukufaka i-chip ngqo kwi-radiator yethusi, kepha i-radiator yethusi uqobo iyisiteshi esisebenza. Ngokuya ngemithombo elula, ukwahlukaniswa kwe-thermoelectric akutholakali. Ekugcineni, umthombo wokukhanya uhlanganiswe ebhodini le-PCB, futhi kusadingeka ungqimba oluvikela imizimba ukuthola ukuhlukaniswa kwe-thermoelectric. Kuleli qophelo, yize ukushisa kungagxili ku-chip, kugxilwe eduze kongqimba lokuvikela ngaphansi komthombo wokukhanya. Njengoba amandla enyuka, kuphakama izinkinga zokushisa. I-DPC substrate ye-ceramic ingaxazulula le nkinga. Ingalungisa i-chip ngqo ku-ceramic futhi yakhe umgodi wokuhlangana oqondile ku-ceramic ukwakha isiteshi esizimele sangaphakathi sokuqhuba. Izimbumbulu ngokwazo zingama-insulators, aqeda ukushisa. Lokhu ukwahlukaniswa kwe-thermoelectric ezingeni lomthombo wokukhanya.

Eminyakeni yamuva nje, i-SMD LED isekela imvamisa isebenzisa izinto zepulasitiki zobunjiniyela obushintshe kakhulu, isebenzisa i-PPA (polyphthalamide) resin njengezinto ezingavuthiwe, futhi ifaka okugcwalisiwe okuguquliwe ukuthuthukisa ezinye izakhiwo zomzimba nezamakhemikhali zempahla eluhlaza ye-PPA. Ngakho-ke, izinto ze-PPA zikulungele kakhulu ukubunjwa komjovo nokusetshenziswa kwamabakaki we-SMD LED. I-PPA plastic conductivity ezishisayo iphansi kakhulu, ukushabalalisa kwayo ukushisa ikakhulukazi ngohlaka lokuhola lwensimbi, amandla wokushiswa kokushisa anqunyelwe, afaneleka kuphela ukupakisha kwe-LED enamandla amancane.

Ukuze uxazulule inkinga yokwehlukaniswa kwe-thermoelectric ezingeni lomthombo wokukhanya, ama-substrates e-ceramic kufanele abe nalezi zici ezilandelayo: okokuqala, kufanele kube nokuqhuba okuphezulu kokushisa, ama-oda amaningana wobukhulu obuphakeme kune-resin; Okwesibili, kufanele ibe namandla aphezulu okuhlukanisa; Okwesithathu, isifunda sinokulungiswa okuphezulu futhi singaxhunywa noma siphendulwe sibheke nge-chip ngaphandle kwezinkinga. Owesine ukuphakama kobuso obuphezulu, ngeke kube khona igebe lapho kushiselwa. Okwesihlanu, izinto zobumba nezinsimbi kufanele zibe nokubambelela okuphezulu; Okwesithupha ukuxhumeka okuqonde mpo ngembobo, okwenza ukuthi i-SMD encapsulation iqondise isekethe ukusuka emuva kuye ngaphambili. Okuwukuphela kwesisekelo esihlangabezana nalezi zimo yi-DPC substrate ye-ceramic.

I-substrate ye-Ceramic ene-conductivity ephezulu yokushisa ingathuthukisa ngokuphumelelayo ukusebenza kahle kokushiswa kokushisa, ingumkhiqizo ofanele kakhulu ukuthuthukiswa kwamandla amakhulu, usayizi omncane we-LED. I-Ceramic PCB inezinto zokushisa ezishisayo ezintsha kanye nesakhiwo esisha sangaphakathi, esenzela ukukhubazeka kwe-aluminium PCB futhi ithuthukise umphumela wokupholisa jikelele we-PCB. Phakathi kwezinto zokwakha zobumba ezisetshenziselwa ukupholisa ama-PCBS, iBeO ine-conductivity ephezulu yokushisa, kepha i-coefficient yayo yomugqa wokukhulisa ihluke kakhulu kunaleyo ye-silicon, futhi ubuthi bayo ngesikhathi sokukhiqiza bunqanda ukusetshenziswa kwayo. I-BN inokusebenza okuhle jikelele, kepha isetshenziswa njenge-PCB. Okokusebenza akunazinzuzo ezivelele futhi kuyabiza. Njengamanje iyafundwa futhi inyuswe; I-silicon carbide inamandla amakhulu futhi i-conductivity ephezulu yokushisa, kepha ukumelana kwayo nokuqina kokuvikela kuphansi, futhi inhlanganisela ngemuva kokufakwa metallization ayizinzile, okuzoholela kuzinguquko ekushiseni kwe-thermal kanye ne-dielectric njalo ayifanele ukusetshenziswa njengokuvikela impahla ye-PCB.

I believe that in the future, when science and technology are more developed, LED will bring greater convenience to our life in more kinds of ways, which requires our researchers to study harder, so as to contribute their own strength to the development of science and technology.