Imbangela ye- PCB isifunda esifushane sangaphakathi

Umphumela wezinto zokusetshenziswa kuma-short-circuit wangaphakathi:

Ukuzinza kobukhulu bezinto ze-multilayer PCB kuyisici esiyinhloko esithinta ukunemba kokubeka ungqimba lwangaphakathi. Ithonya le-coefficient yokunwetshwa okushisayo kwe-substrate ne-foil foil kungqimba lwangaphakathi lwe-PCB ye-multilayer nayo kufanele icatshangelwe. Kusukela ekuhlaziyweni kwezakhiwo zomzimba we-substrate esetshenzisiwe, ama-laminate aqukethe ama-polymers, aguqula isakhiwo esiyinhloko ekushiseni okuthile, okwaziwa ngokuthi ukushisa kwengilazi yokuguquguquka (inani le-TG). Izinga lokushisa lengilazi liyisici senani elikhulu le-polymer, eduze kwe-coefficient yokwanda okushisayo, isici esibaluleke kakhulu se-laminate. Ekuqhathaniseni izinto ezimbili ezisetshenziswa kakhulu, izinga lokushisa kwengilazi le-epoxy glass laminate ne-polyimide yi-Tg120 ℃ no-230 ℃ ngokulandelana. Ngaphansi kwesimo se-150 ℃, ukunwetshwa kwemvelo okushisayo kwe-epoxy glass indwangu laminate icishe ibe yi-0.01in / in, kanti ukunwetshwa kwemvelo okushisayo kwe-polyimide kungu-0.001in / ku kuphela.

Ngokuya ngemininingwane efanele yezobuchwepheshe, i-coefficient yokunwetshwa okushisayo kwama-laminates ku-X naku-Y izinkomba yi-12-16ppm / ℃ ngokwanda ngakunye kwe-1 ℃, kanye ne-coefficient yokwanda okushisayo ku-Z isiqondisi yi-100-200ppm / ℃, ekhuphuka nge-oda lobukhulu kunalokho kuzikhombisi ze-X ne-Y. Kodwa-ke, lapho izinga lokushisa lidlula u-100 ℃, kutholakala ukuthi ukunwetshwa kwe-z-axis phakathi kwama-laminates nama-pores akuhambelani futhi umehluko uba mkhulu. I-Electroplated ngokusebenzisa izimbobo inezinga eliphansi lokukhula kwemvelo kunama-laminates azungezile. Njengoba ukunwetshwa okushisayo kwe-laminate kushesha ukwedlula kwe-pore, lokhu kusho ukuthi i-pore yelulelwe lapho kuqondiswa khona ukusonteka kwe-laminate. Lesi simo sokucindezeleka sikhiqiza ukucindezeleka okuqinile emzimbeni wembobo. Lapho izinga lokushisa landa, ukucindezela okuqinile kuzoqhubeka nokwanda. Lapho ingcindezi idlula amandla okwephuka kwengubo embobo, ukumbozwa kuzophuka. Ngasikhathi sinye, izinga eliphezulu lokushisa elishisayo le-laminate lenza ukucindezelwa ocingweni lwangaphakathi nephedi kukhuphuke ngokusobala, okuholele ekuqhekekeni kocingo nephedi, okuholele ekutheni isekethe elifushane lesendlalelo sangaphakathi se-PCB enezingqimba eziningi . Ngakho-ke, ekwakhiweni kwe-BGA nolunye uhlobo lokuphakwa kokuxinana okukhulu kwezidingo zobuchwepheshe be-PCB, kufanele kwenziwe ukuhlaziywa okuningiliziwe, ukukhethwa kwe-coefficient yokwanda kwe-substrate nethusi kufanele kufane ngokuyisisekelo.

Okwesibili, umthelela wendlela ngokunemba kohlelo lokubeka indawo kusifunda esifushane sangaphakathi

Indawo iyadingeka ekwakhiweni kwefilimu, ihluzo zesekethe, i-lamination, i-lamination kanye ne-drilling, futhi indlela yendlela yendawo kufanele ifundwe futhi ihlaziywe ngokucophelela. Le mikhiqizo eqediwe edinga ukubekwa izoletha uchungechunge lwezinkinga zobuchwepheshe ngenxa yomehluko ekubekeni ngokunemba. Ukunganaki okuncane kuzoholela esimweni sesifunda esifushane kungqimba lwangaphakathi lwe-PCB enezingqimba eziningi. Hlobo luni lwendlela yokubeka okufanele lukhethwe kuncike ekunembeni, ekusebenzeni nasekusebenzeni kahle kokuma.

Okwesithathu, umphumela wekhwalithi yangaphakathi yokudonswa kwesifunda esifushane sangaphakathi

Inqubo yokufaka ulwelwesi kulula ukukhiqiza ukusika kwethusi okusalayo kuye ngasekupheleni kwephuzu, ithusi eliyinsalela kwesinye isikhathi lincane kakhulu, uma kungenjalo kusetshenziswa umhloli we-optical ukuthola okunembile, futhi kunzima ukukuthola ngamehlo enqunu, izolethwa enqubeni yokuvikela ngocwazi, ukucindezelwa okwethule okwenziwe ngethusi kungaphakathi kwe-PCB ye-multilayer, ngenxa yobuningi bengqimba yangaphakathi iphezulu kakhulu, indlela elula yokuthola ithusi eliyinsalela lithole ulwelwesi lwe-multilayer PCB olubangelwa yisifunda esifushane phakathi kwalaba ababili izintambo.

4. Ithonya laminating inqubo nemingcele on kwangaphakathi short circuit

Ipuleti lesendlalelo sangaphakathi kufanele libekwe kahle ngokusebenzisa iphini lokuma lapho ulamula. Uma ingcindezi esetshenziswa lapho ufaka ibhodi ingafani, imbobo yokubeka ipuleti langaphakathi lendle izokhubazeka, ukucindezela kwe-shear nokucindezela okusalile okubangelwa yingcindezi ethathwe ngokucindezela nakho kukhulu, futhi ukusikeka kwesendlalelo kanye nezinye izizathu kubangele ungqimba lwangaphakathi lwe-PCB enezingqimba eziningi ukukhiqiza isifunda esifushane kanye nodoti.

Okwesihlanu, umthelela wekhwalithi yokumba kusifunda esifushane sangaphakathi

1. Ukuhlaziywa kwephutha lendawo yeHole

Ukuthola ukuxhumana okuphezulu nokuthembeka okuphezulu kogesi, ukuhlangana phakathi kwephedi nocingo ngemuva kokumba kufanele kugcinwe okungenani ama-50μm. Ukugcina ububanzi obuncane kangaka, indawo yomgodi wokumba kufanele inembe kakhulu, ikhiqize iphutha elingaphansi noma elilingana nezidingo zobuchwepheshe bokubekezelelana okuyisilinganiso okuphakanyiswe inqubo. Kodwa iphutha imbobo isikhundla imbobo imishini ikakhulukazi kunqunywa ngokunemba umshini imishini, i-geometry sokuprakthiza bit, izici ikhava kanye pad kanye nemingcele zobuchwepheshe. Ukuhlaziywa okunamandla okuqoqiwe kusuka enqubeni yokukhiqiza yangempela kudalwa yizici ezine: ubukhulu obudalwa ukudlidliza komshini wokuprakthiza maqondana nendawo yangempela yomgodi, ukuphambuka kophiko lokuphotha, isiliphu esibangelwe ukungena kancane kwephuzu le-substrate , kanye ne-deformation eguqa ebangelwa ukumelana nengilazi yefibre kanye nokusika ukusika ngemuva kokungena kancane ku-substrate. Lezi zinto zizobangela ukuphambuka kwendawo yangaphakathi yomgodi kanye nethuba lesifunda esifushane.

2. Ngokuya kokuphambuka kwesimo somgodi okukhiqizwe ngenhla, ukuze uxazulule futhi uqede amathuba wephutha eleqile, kuphakanyiswa ukwamukela inqubo yenqubo yesinyathelo, enganciphisa kakhulu umphumela wokuqedwa kokuqedwa kwezinsimbi kanye nokukhuphuka kwezinga lokushisa. Ngakho-ke, kuyadingeka ukuthi ushintshe i-geometry encane (indawo enqamulelayo, ubukhulu bomgogodla, i-taper, i-chip groove Angle, i-chip groove nobude kuye kunqenqema lwebhendi, njll.) Ukukhulisa ukuqina okuncane, nokunemba kwendawo okuzoba kuyo kuthuthukiswe kakhulu. Ngasikhathi sinye, kuyadingeka ukuthi ukhethe kahle ipuleti lekhava nenqubo yokumba imingcele ukuqinisekisa ukuthi ukunemba komgodi wokumba ngaphakathi kobubanzi benqubo. Ngaphezu kwalezi ziqinisekiso ezingenhla, izimbangela zangaphandle kufanele futhi kube ukugxila kuzona. Uma ukuma kwangaphakathi kunganembile, lapho kubhola ukuphambuka komgodi, nakho kuholele kusifunda esingaphakathi noma isifunda esifushane.